US-12625333-B1 - Pluggable transceiver modules including heat sinks biased against thermal energy generating components

Abstract

A pluggable transceiver module is disclosed and includes first and second ends, lower and upper housings, and a thermal energy generating component. The first end plugs into a network device. The second end is opposite the first end and is located external to the network device when the first end is plugged into the network device. The lower housing enhouses a printed circuit board. The upper housing includes a heat sink and floats above the lower housing such that the upper housing is not fastened to and/or resting on the lower housing. At least side portions of the upper housing do not contact sides of the lower housing. The upper housing is held in place relative to the lower housing. A thermal energy generating component is mounted on the printed circuit board and supports the first heat sink, which dissipates thermal energy received from the thermal energy generating component.

Inventors

• Chris Togami
• Kee-Sin Tan
• Steve ABOAGYE
• BRIAN DEAN TAYLOR

Assignees

• MARVELL ASIA PTE LTD

Dates

Publication Date

20260512

Application Date

20230811

Claims (20)

1. 1 . A pluggable transceiver module comprising: a first end configured to plug into a network device; a second end opposite the first end and configured to be located external to the network device when the first end is plugged into the network device; a lower housing enhousing a printed circuit board; an upper housing comprising a first heat sink and configured to float above the lower housing such that the upper housing is at least one of i) not fastened to the lower housing, and ii) not resting on the lower housing, wherein at least side portions of the upper housing do not contact sides of the lower housing, and wherein the upper housing is held in place relative to the lower housing; and a thermal energy generating component mounted on the printed circuit board and configured to support the first heat sink, which dissipates thermal energy received from the thermal energy generating component.
2. 2 . The pluggable transceiver module of claim 1 , further comprising a second heat sink forward of the first heat sink, wherein the upper housing is held in place relative to the lower housing using attachment points at ends of the upper housing, the attachment points referring to i) a portion of the second heat sink overhanging flanges of the lower housing, and ii) hooked portions of the upper housing engaging hooked portions of the lower housing.
3. 3 . The pluggable transceiver module of claim 1 , wherein the upper housing is configured to float above the lower housing such that gaps exist between the side portions of the upper housing and sides of the lower housing.
4. 4 . The pluggable transceiver module of claim 1 , further comprising a holding clip configured to at least partially hold the upper housing in place relative to the lower housing.
5. 5 . The pluggable transceiver module of claim 4 , wherein the holding clip is configured to at least partially hold the lower housing in place relative to the upper housing.
6. 6 . The pluggable transceiver module of claim 4 , wherein: the first heat sink comprises a recessed area; and the holding clip is disposed in the recessed area.
7. 7 . The pluggable transceiver module of claim 4 , wherein: at least one gap exists between the first heat sink and the holding clip; and the holding clip is configured, due to the gap, to flex around the first heat sink and hook onto the lower housing and bias the first heat sink against the thermal energy generating component.
8. 8 . The pluggable transceiver module of claim 4 , wherein the holding clip comprises one or more hooks that are configured to mate with corresponding receptacles formed in the lower housing to fix the upper housing in place relative to the lower housing.
9. 9 . The pluggable transceiver module of claim 1 , wherein: the first heat sink comprising a thermally conductive boss and a plurality of heat radiating elements; the thermally conductive boss is configured to contact the thermal energy generating component; and the plurality of heat radiating elements are configured to extend away from the thermally conductive boss and dissipate thermal heat from the first heat sink.
10. 10 . The pluggable transceiver module of claim 9 , wherein the thermally conductive boss extends downward from the plurality of heat radiating elements and abuts the thermal energy generating component.
11. 11 . The pluggable transceiver module of claim 9 , wherein a thermal interface material is disposed at least partially between the thermally conductive boss and the thermal energy generating component and exhibits less thermal resistance as compared to an air gap between the thermally conductive boss and the thermal energy generating component.
12. 12 . The pluggable transceiver module of claim 1 , wherein: the side portions of the upper housing are configured as a pair of flanges; and the pair of flanges extend downwardly from a body of the upper housing toward sides of the lower housing to at least one of i) hold the upper housing in a lateral orientation relative to the lower housing, and ii) limit or prevent movement of the upper housing laterally relative to the lower housing.
13. 13 . The pluggable transceiver module of claim 12 , wherein the pair of flanges and a thermally conductive boss of the first heat sink at least partially define a pair of channels.
14. 14 . A communication system comprising: the pluggable transceiver module of claim 1 ; and the network device comprising a motherboard, the motherboard comprising an integrated circuit for processing and transferring data to and from the pluggable transceiver module; and wherein the pluggable transceiver module of claim 1 is plugged into the motherboard.
15. 15 . A pluggable transceiver module comprising: a first end configured to plug into a network device; a second end opposite the first end and configured to be located external to the network device when the first end is plugged into the network device; a lower housing component enhousing a printed circuit board; a thermal energy generating component disposed on the printed circuit board; a wedge-shaped shim configured to be in thermal contact with the thermal energy generating component and configured to transfer thermal energy away from the thermal energy generating component; and an upper housing configured to thermally contact the wedge-shaped shim and the lower housing component, the upper housing comprising a heat sink, the heat sink disposed on the wedge-shaped shim configured to dissipate thermal energy received from the wedge-shaped shim.
16. 16 . The pluggable transceiver module of claim 15 , wherein the thermal energy generating component is a digital signal processor.
17. 17 . The pluggable transceiver module of claim 15 , wherein: the wedge-shaped shim comprises a first surface, a second surface and side surfaces extending between the first surface and the second surface; the first surface extends parallel to and thermally contacts a surface of the upper housing; and the second surface extends parallel to and contacts the thermal energy generating component.
18. 18 . The pluggable transceiver module of claim 15 , further comprising at least one biasing element, wherein the at least one biasing element is configured to bias the wedge-shaped shim toward a surface of the upper housing and provide thermal contact with the thermal energy generating component and the heat sink.
19. 19 . The pluggable transceiver module of claim 18 , wherein the at least one biasing element comprises a screw disposed between a side of the upper housing and the wedge-shaped shim.
20. 20 . The pluggable transceiver module of claim 18 , wherein the at least one biasing element comprises a spring disposed between a side of the upper housing and the wedge-shaped shim.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of U.S. Provisional Application No. 63/397,228, filed on Aug. 11, 2022 and U.S. Provisional Application No. 63/397,262, filed on Aug. 11, 2022. The entire disclosures of the applications referenced above are incorporated herein by reference. FIELD The present disclosure relates to pluggable transceiver modules, and more specifically to dissipation of thermal energy from pluggable transceiver modules. BACKGROUND The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent the work is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure. A small form-factor pluggable (SFP) transceiver module is a compact transceiver used in data communication and telecommunication networks for transferring data at high speeds (e.g., 10 gigabits per second (Gb/s) to 1.6 terabits per second (Tb/s)). The SFP transceiver modules can receive and transmit data over copper lines or fiber optical cables to and from network devices, such as switches and/or other network equipment having SFP ports. As an example, a switch can have multiple SFP ports configured to receive respective SFP transceiver modules. Pluggable SFP modules generate a significant amount of heat which needs to be dissipated to support fault-free operation. SUMMARY A pluggable transceiver module is disclosed and includes a first end, a second end, a lower housing, an upper housing, and a thermal energy generating component. The first end is configured to plug into a network device. The second end is opposite the first end and is configured to be located external to the network device when the first end is plugged into the network device. The lower housing enhouses a printed circuit board. The upper housing includes a first heat sink and configured to float above the lower housing such that the upper housing is not at least one of fastened to and resting on the lower housing. At least side portions of the upper housing do not contact sides of the lower housing. The upper housing is held in place relative to the lower housing. A thermal energy generating component is mounted on the printed circuit board and is configured to support the first heat sink, which dissipates thermal energy received from the thermal energy generating component. In other features, the pluggable transceiver module further includes a second heat sink forward of the first heat sink. The upper housing is held in place relative to the lower housing using attachment points at ends of the upper housing. The attachment points refer to i) a portion of the second heat sink overhanging flanges of the lower housing, and ii) hooked portions of the upper housing engaging hooked portions of the lower housing. In other features, the upper housing is configured to float above the lower housing such that gaps exist between the side portions of the upper housing and sides of the lower housing. In other features, the pluggable transceiver module further includes a holding clip configured to at least partially hold the upper housing in place relative to the lower housing. In other features, the holding clip is configured to at least partially hold the lower housing in place relative to the upper housing. In other features, the first heat sink includes a recessed area. The holding clip is disposed in the recessed area. In other features, at least one gap exists between the first heat sink and the holding clip. The holding clip is configured, due to the gap, to flex around the first heat sink and hook onto the lower housing and bias the first heat sink against the thermal energy generating component. In other features, the holding clip includes one or more hooks that are configured to mate with corresponding receptacles formed in the lower housing to fix the floating upper housing in place relative to the lower housing. In other features, the first heat sink includes a thermally conductive boss and heat radiating elements. The thermally conductive boss is configured to contact the thermal energy generating component. The heat radiating elements are configured to extend away from the thermally conductive boss and dissipate thermal heat from the first heat sink. In other features, the thermally conductive boss extends downward from the heat radiating elements and abuts the thermal energy generating component. In other features, a thermal interface material is disposed at least partially between the thermally conductive boss and the thermal energy generating component and exhibits less thermal resistance as compared to an air gap between the thermally conductive boss and the thermal energy generating component. In other features, the side portions of the upper h