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US-12625334-B2 - 400G silicon photonic integrated optical module with embedded thermoelectric cooler (TEC) substrate

US12625334B2US 12625334 B2US12625334 B2US 12625334B2US-12625334-B2

Abstract

A 400G silicon photonic integrated optical module with an embedded thermoelectric cooler (TEC) substrate includes: a housing, a printed circuit board (PCB) substrate, and a silicon photonic integrated circuit board, where an accommodating cavity is formed in the housing; the PCB substrate is provided in the accommodating cavity; a TEC substrate is embedded into the PCB substrate; the silicon photonic integrated circuit board is provided on the TEC substrate; the silicon photonic integrated circuit board is provided with an extended segment; the extended segment extends to one side and to the PCB substrate; a fiber array, an electronic integrated circuit board, a light emission assembly, and a light-receiving detector are arranged on the silicon photonic integrated circuit board; the light emission assembly is mounted on the silicon photonic integrated circuit board; and the light emission assembly and the light-receiving detector are provided above the TEC substrate.

Inventors

  • Jie Huang

Assignees

  • Shunyun Technology (Zhongshan) Limited

Dates

Publication Date
20260512
Application Date
20240209
Priority Date
20230221

Claims (8)

  1. 1 . A 400G silicon photonic integrated optical module with an embedded thermoelectric cooler (TEC) substrate, comprising: a housing, wherein an accommodating cavity is formed in the housing; a printed circuit board (PCB) substrate, wherein the PCB substrate is provided in the accommodating cavity, and a TEC substrate is embedded into the PCB substrate; and a silicon photonic integrated circuit board, wherein the silicon photonic integrated circuit board is provided on the TEC substrate, the silicon photonic integrated circuit board is provided with an extended segment, and the extended segment extends along a side of the PCB substrate in a length direction of the PCB substrate to the PCB substrate, wherein a fiber array, an electronic integrated circuit board, a light emission assembly, and a light-receiving detector are arranged on the silicon photonic integrated circuit board; the light emission assembly is mounted on the silicon photonic integrated circuit board in an upside-down manner; and the light emission assembly and the light-receiving detector are provided above the TEC substrate.
  2. 2 . The 400G silicon photonic integrated optical module with an embedded TEC substrate according to claim 1 , wherein the silicon photonic integrated circuit board is mounted on the PCB substrate and the TEC substrate through a flip chip.
  3. 3 . The 400G silicon photonic integrated optical module with an embedded TEC substrate according to claim 1 , wherein the electronic integrated circuit board is mounted on the extended segment of the silicon photonic integrated circuit board through a flip chip.
  4. 4 . The 400G silicon photonic integrated optical module with an embedded TEC substrate according to claim 1 , wherein a groove is formed in the PCB substrate; the TEC substrate is embedded into the groove; and an upper surface of the TEC substrate is flush with an upper surface of the PCB substrate.
  5. 5 . The 400G silicon photonic integrated optical module with an embedded TEC substrate according to claim 1 , wherein the light emission assembly comprises a laser and triangular prisms; two sides of the laser each are provided with one of the triangular prisms; the laser is mounted on the silicon photonic integrated circuit board in an upside-down manner; and mirror surfaces of two of the triangular prisms are symmetric with respect to the laser.
  6. 6 . The 400G silicon photonic integrated optical module with an embedded TEC substrate according to claim 5 , wherein there are two light emission assemblies; the two light emission assemblies are spaced; and the two light emission assemblies are provided at a same side of the electronic integrated circuit board.
  7. 7 . The 400G silicon photonic integrated optical module with an embedded TEC substrate according to claim 5 , wherein a monitor photo detector (MPD) is further integrated onto the silicon photonic integrated circuit board; and the MPD is connected to the light emission assembly.
  8. 8 . The 400G silicon photonic integrated optical module with an embedded TEC substrate according to claim 1 , wherein one end of the PCB substrate is provided with a multi-fiber push on (MPO) optical connector; the MPO optical connector is connected to the fiber array through a fiber; and the other end of the PCB substrate is provided with a gold finger electrical connector.

Description

CROSS REFERENCE TO RELATED APPLICATIONS The present application claims the benefit of Chinese Patent Application No. 2023101495890 filed on Feb. 21, 2023, the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD The present disclosure relates to the technical field of fiber communications, and in particular to a 400G silicon photonic integrated optical module with an embedded thermoelectric cooler (TEC) substrate. BACKGROUND With rapid development of optical communication industry and constant upgrade of communication technologies, an optical module as a central component in optical communication is developed toward a high rate and a high density to meet development demands in the communication. An optical chip serves as a core component of the optical module. To ensure continuous and stable operation of the optical module, the optical chip is required to work within a certain temperature range. Therefore, heat dissipation of the optical chip is crucial. The Chinese Utility Patent with Publication No. CN 211236354 U provides a 400G optical module. The optical module includes a main heat dissipation shell, an auxiliary heat dissipation shell, and a printed circuit board (PCB). A control chip is provided on the PCB. The PCB is connected to a laser. A front side of the laser is sequentially provided with an optical assembly and a fiber array. The fiber array is connected to a fiber. The optical module further includes a TEC. The laser and a lower end of the fiber array are attached to the TEC. The TEC is provided in a metal heat sink. The metal heat sink includes an extension portion extending to a rear side of the fiber array. A fiber groove is formed in the extension portion corresponding to each fiber. A lower end of the metal heat sink, the fiber groove, and an upper end of the fiber groove each are provided with a heat conductive pad. The head conductive pad is attached to the main heat dissipation shell and the auxiliary heat dissipation shell. Heat from the laser and the fiber array is dissipated through the TEC and the metal heat sink to meet a heat dissipation requirement. However, the laser is connected to the PCB through a bonding alloy wire, and is then attached to the TEC. This causes a complex manufacturing process. SUMMARY An objective of the present disclosure is to provide a 400G silicon photonic integrated optical module with an embedded TEC substrate, to solve a problem of a complex manufacturing process due to a fact that the laser is connected to the PCB through a bonding alloy wire, and is then attached to the TEC in prior art. To Achieve the Above Objective, the Present Disclosure Employs the Following Technical Solutions A 400G silicon photonic integrated optical module with an embedded TEC substrate provided by the present disclosure includes: a housing, where an accommodating cavity is formed in the housing;a PCB substrate, where the PCB substrate is provided in the accommodating cavity, and a TEC substrate is embedded into the PCB substrate; anda silicon photonic integrated circuit board, where the silicon photonic integrated circuit board is provided on the TEC substrate, the silicon photonic integrated circuit board is provided with an extended segment, and the extended segment extends along a side of the PCB substrate in a length direction of the PCB substrate to the PCB substrate,where a fiber array, an electronic integrated circuit board, a light emission assembly, and a light-receiving detector are arranged on the silicon photonic integrated circuit board; the light emission assembly is mounted on the silicon photonic integrated circuit board in an upside-down manner; and the light emission assembly and the light-receiving detector are provided above the TEC substrate. Preferably, the silicon photonic integrated circuit board is mounted on the PCB substrate and the TEC substrate through a flip chip. Preferably, the electronic integrated circuit board is mounted on the extended segment of the silicon photonic integrated circuit board through a flip chip. Preferably, a groove is formed in the PCB substrate; the TEC substrate is embedded into the groove; and an upper surface of the TEC substrate is flush with an upper surface of the PCB substrate. Preferably, the light emission assembly includes a laser and triangular prisms; two sides of the laser each are provided with one of the triangular prisms; the laser is mounted on the silicon photonic integrated circuit board in an upside-down manner; and mirror surfaces of two of the triangular prisms are symmetric with respect to the laser. Preferably, there are two light emission assemblies; the two light emission assemblies are spaced; and the two light emission assemblies are provided at a same side of the electronic integrated circuit board. Preferably, a monitor photo detector (MPD) is further integrated onto the silicon photonic integrated circuit board; and the MPD is connected to the light e