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US-12625529-B2 - Screw down holder for compression attached memory modules

US12625529B2US 12625529 B2US12625529 B2US 12625529B2US-12625529-B2

Abstract

A holder for a compression attached memory module (CAMM) includes a spine and first and second beam protrusions. The spine encloses an end of the CAMM adjacent to a contact pad array of a CAMM printed circuit board (PCB) of the CAMM. The first beam protrusion extends from the spine away from the end of the CAMM. The second beam protrusion extends from the spine away from the end of the CAMM. When the CAMM is installed into the holder and installed into an information handling system, the first and second beam protrusions transfer a compression applied at the first and a compression applied at the second beam protrusions to a portion of the spine between the first beam protrusion and the second beam protrusion to limit a deformation of the CAMM PCB.

Inventors

  • Arnold Thomas Schnell
  • Jing-Tang Wu
  • Spike Tzeng

Assignees

  • DELL PRODUCTS L.P.

Dates

Publication Date
20260512
Application Date
20230508

Claims (20)

  1. 1 . A holder for a compression attached memory module (CAMM) printed circuit board (PCB), the holder comprising: a spine to enclose an end of the CAMM PCB adjacent to a contact pad array of the CAMM PCB; a first beam protrusion extending from the spine away from the end of the CAMM PCB; a second beam protrusion extending from the spine away from the end of the CAMM PCB, wherein when the CAMM PCB is installed into the holder and installed into an information handling system, the first and second beam protrusions transfer a compression applied at the first and a compression applied at the second beam protrusions to a portion of the spine between the first beam protrusion and the second beam protrusion to limit a deformation of the CAMM PCB; and a third beam protrusion extending from the spine away from the end of the CAMM PCB.
  2. 2 . The holder of claim 1 , wherein the first beam protrusion includes a first screw hole associated with a first screw hole of the CAMM PCB, and the second beam protrusion includes a second screw hole associated with a second screw hole of the CAMM PCB.
  3. 3 . The holder of claim 2 , wherein, when the CAMM PCB is installed into the holder and installed into an information handling system, the compression applied at the first beam protrusion and the compression applied at the second beam protrusion are applied via respective first and second screw holes.
  4. 4 . The holder of claim 1 , wherein the spine includes a detent structure to provide a prestress to the CAMM PCB.
  5. 5 . The holder of claim 4 , wherein the prestress further limits the deformation of the CAMM PCB.
  6. 6 . The holder of claim 1 , wherein the spine has an arch shape to provide a prestress to the CAMM PCB.
  7. 7 . The holder of claim 6 , wherein the prestress further limits the deformation of the CAMM PCB.
  8. 8 . The holder of claim 1 , wherein, when the CAMM PCB is installed into the holder and installed into an information handling system, the second and third beam protrusions transfer the compression applied at the second beam protrusion and a compression applied at the third beam protrusions to a portion of the spine between the second beam protrusion and the third beam protrusion to limit the deformation of the CAMM PCB.
  9. 9 . The holder of claim 8 , wherein the third beam protrusion includes a third screw hole associated with a third screw hole of the CAMM PCB.
  10. 10 . The holder of claim 9 , wherein, when the CAMM PCB is installed into the holder and installed into an information handling system, the compression applied at the third beam protrusion is applied via the third screw hole.
  11. 11 . A method for providing a holder for a compression attached memory module (CAMM) printed circuit board (PCB), the method comprising: providing, on the holder, a spine to enclose an end of the CAMM PCB adjacent to a contact pad array of the CAMM PCB; providing, on the holder, a first beam protrusion extending from the spine away from the end of the CAMM PCB; providing, on the holder, a second beam protrusion extending from the spine away from the end of the CAMM PCB wherein, when the CAMM PCB is installed into the holder and installed into an information handling system, the first and second beam protrusions transfer a compression applied at the first and a compression applied at the second beam protrusions to a portion of the spine between the first beam protrusion and the second beam protrusion to limit a deformation of the CAMM PCB; and providing, on the holder, a third beam protrusion extending from the spine away from the end of the CAMM.
  12. 12 . The holder of claim 11 , further comprising providing, on the spine, an arch shape to provide a prestress to further limit the deformation of the CAMM PCB.
  13. 13 . The method of claim 11 , further comprising: providing, on the first beam protrusion, a first screw hole associated with a first screw hole of the CAMM PCB; and providing, on the second beam protrusion, a second screw hole associated with a second screw hole of the CAMM PCB.
  14. 14 . The method of claim 13 wherein, when the CAMM PCB is installed into the holder and installed into an information handling system, the compression applied at the first beam protrusion and the compression applied at the second beam protrusion are applied via respective first and second screw holes.
  15. 15 . The method of claim 1 , further comprising providing, on the spine, a detent structure to provide a prestress to the CAMM PCB.
  16. 16 . The method of claim 15 , wherein the prestress further limits the deformation of the CAMM PCB.
  17. 17 . The method of claim 11 , wherein when the CAMM PCB is installed into the holder and installed into an information handling system, the second and third beam protrusions transfer the compression applied at the second beam protrusion and a compression applied at the third beam protrusions to a portion of the spine between the second beam protrusion and the third beam protrusion to limit the deformation of the CAMM PCB.
  18. 18 . The method of claim 17 , further comprising providing, on the third beam protrusion, a third screw hole associated with a third screw hole of the CAMM PCB.
  19. 19 . The method of claim 18 , wherein, when the CAMM PCB is installed into the holder and installed into an information handling system, the compression applied at the third beam protrusion is applied via the third screw hole.
  20. 20 . An information handling system, comprising: a main printed circuit board (PCB); a compression connector; a compression attached memory module (CAMM) having a CAMM PCB; and a CAMM holder including: a spine to enclose an end of the CAMM PCB adjacent to a contact pad array of the CAMM PCB; a first beam protrusion extending from the spine away from the end of the CAMM PCB; a second beam protrusion extending from the spine away from the end of the CAMM PCB wherein, when the CAMM PCB is installed into the holder and installed into an information handling system, the first and second beam protrusions transfer a compression applied at the first beam protrusion and a compression applied at the second beam protrusion to a portion of the spine between the first beam protrusion and the second beam protrusion to limit a deformation of the CAMM PCB; and a third beam protrusion extending from the spine away from the end of the CAMM.

Description

Related subject matter is contained in co-pending U.S. patent application Ser. No. 18/428,132 entitled “CARRIER MODULE FOR STACKED COMPRESSION ATTACHED MEMORY MODULES,” by Arnold Thomas Schnell et al., filed Jan. 31, 2024, the disclosure of which is hereby incorporated by reference. Related subject matter is contained in co-pending U.S. patent application Ser. No. 18/428,737 entitled “CARRIER MODULE FOR GROUNDING STACKED COMPRESSION ATTACHED MEMORY MODULES,” by Arnold Thomas Schnell et al., filed Jan. 31, 2024, the disclosure of which is hereby incorporated by reference. Related subject matter is contained in co-pending U.S. patent application Ser. No. 18/428,952 entitled “CARRIER MODULE TO PROVIDE A THERMAL SOLUTION FOR STACKED COMPRESSION ATTACHED MEMORY MODULES,” by Arnold Thomas Schnell et al., filed Jan. 31, 2024, the disclosure of which is hereby incorporated by reference. FIELD OF THE DISCLOSURE This disclosure generally relates to information handling systems, and more particularly relates to an I-beam holder for compression attached memory modules (CAMMs). BACKGROUND As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option is an information handling system. An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes. Because technology and information handling needs and requirements may vary between different applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software resources that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems. SUMMARY A holder for a compression attached memory module (CAMM) may include a spine and first and second beam protrusions. The spine may enclose an end of the CAMM adjacent to a contact pad array of a CAMM printed circuit board (PCB) of the CAMM. The first beam protrusion may extend from the spine away from the end of the CAMM. The second beam protrusion may extend from the spine away from the end of the CAMM. When the CAMM is installed into the holder and installed into an information handling system, the first and second beam protrusions may transfer a compression applied at the first and a compression applied at the second beam protrusions to a portion of the spine between the first beam protrusion and the second beam protrusion to limit a deformation of the CAMM PCB. BRIEF DESCRIPTION OF THE DRAWINGS It will be appreciated that for simplicity and clarity of illustration, elements illustrated in the Figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements are exaggerated relative to other elements. Embodiments incorporating teachings of the present disclosure are shown and described with respect to the drawings presented herein, in which: FIG. 1A is a block diagram of a top view of an information handling system as is known in the prior art; FIG. 1B is a block diagram of a side view of the information handling system of FIG. 1A; FIG. 1C is a block diagram of a sectional side view of the information handling system of FIG. 1A; FIG. 2 is a diagram illustrating a holder for compression attached memory modules (CAMMs) according to an embodiment of the current disclosure; FIG. 3 is a diagram illustrating a holder for CAMMs according to another embodiment of the current disclosure; FIG. 4 is a block diagram illustrating a side view of an information handling system according to an embodiment of the current disclosure; and FIG. 5 is a block diagram illustrating a generalized information handling system according to another embodiment of the present disclosure; The use of the same reference symbols in different drawings indicates similar or identical items. As used herein, the terms “compression dual in-line memory module” and “CAMM” may be understood to be equivalent to, and superseded by the terms “Compression Attached Memory Module” and “CAMM,” respectively, as may be understood by persons skilled in the art. DETAILED DESCRIPTION OF DRAWINGS The following description in combination with the Figures is provided to assist in understanding the teachings disclosed herein. The following discussion will focus on specific implementations and embodiments of the teachings. This focus is provide