US-12625569-B2 - Electronic device housing and electronic device including the same

US12625569B2US 12625569 B2US12625569 B2US 12625569B2US-12625569-B2

Abstract

An electronic device housing includes an instrument, a first primer layer provided to cover the instrument, a film layer provided on the first primer layer, a second primer layer provided on the film layer, and a coating layer provided on the second primer layer. The film layer includes at least one overwrap at which the film layer overlaps that is configured to surround the first primer layer.

Inventors

Hyunjung JUNG
Hangyu HWANG
Hyeonseok Yoon
Hyoin KIM

Assignees

SAMSUNG ELECTRONICS CO., LTD.

Dates

Publication Date: 20260512
Application Date: 20221024
Priority Date: 20211014

Claims (17)

1 . An electronic device housing, comprising: an instrument; a first primer layer provided to cover the instrument; a film layer provided on the first primer layer; a second primer layer provided on the film layer; and a coating layer provided on the second primer layer, wherein the film layer has at least one overwrap at which the film layer overlaps and is configured to surround the first primer layer.
2 . The electronic device housing of claim 1 , wherein the instrument comprises a hollow structure, and wherein the first primer layer is provided on an outer surface of the instrument.
3 . The electronic device housing of claim 1 , wherein the instrument comprises at least one of polyamide, polyacetal, polycarbonate, polyethylene terephthalate, or polyphenylene oxide.
4 . The electronic device housing of claim 1 , wherein the first primer layer comprises at least one of an acrylic resin, an epoxy resin, or a polyester resin.
5 . The electronic device housing of claim 1 , wherein the first primer layer has a thickness of about 1 μm or greater.
6 . The electronic device housing of claim 1 , wherein the film layer comprises at least one metal among aluminum, magnesium, gold, silver, tin, indium, chromium, and copper.
7 . The electronic device housing of claim 1 , wherein the film layer has a thickness of about 1 μm to about 5 μm.
8 . The electronic device housing of claim 1 , wherein the film layer is formed, as films comprising metal particles surround the first primer layer and heat is applied thereto.
9 . The electronic device housing of claim 1 , wherein a width of the at least one overwrap is less than or equal to about 1 mm.
10 . The electronic device housing of claim 1 , wherein the film layer comprises a first layer, a second layer, and a third layer, wherein the first layer is provided on the first primer layer, wherein the second layer is provided on the first layer, wherein the third layer is provided on the second layer such that the third layer is disposed between the second layer and the second primer layer, wherein the first layer comprises at least one of an acrylic resin, an epoxy resin, or a polyester resin, wherein the second layer comprises metal particles, wherein the third layer comprises at least one of an acrylic resin, a polyester resin, an acrylate resin, a modified urethane acrylate resin, or an amine acrylic resin, and wherein a sum of thicknesses of the first layer, the second layer, and the third layer is about 1 μm to about 5 μm.
11 . The electronic device housing of claim 1 , wherein the second primer layer comprises at least one of an acrylic resin, a polyester resin, an acrylate resin, a modified urethane acrylate resin, or an amine acrylic resin.
12 . The electronic device housing of claim 1 , wherein the second primer layer has a thickness of about 3 μm or greater.
13 . The electronic device housing of claim 1 , wherein the second primer layer is thicker than the first primer layer.
14 . The electronic device housing of claim 1 , wherein the second primer layer comprises a first resin and a second resin, wherein the first resin has a glass transition temperature of about 0° C. to about 30°° C., and wherein the second resin has a glass transition temperature of about 80° C. to about 100° C.
15 . The electronic device housing of claim 1 , wherein the coating layer comprises at least one of a urethane resin, a thermosetting resin, or an ultraviolet (UV) curable resin, and wherein the coating layer has a thickness of about 15 μm to about 40 μm.
16 . The electronic device housing of claim 1 , further comprising: a color layer provided between the second primer layer and the coating layer, wherein the color layer comprises at least one of SiO 2 , TiO 2 , Al 2 O 3 , Nb 2 O 5 , MgF 2 , Ti 2 O 5 , SnO 2 , ZnO, Ta 2 O 5 , MgO, Si 3 N 4 , ITO, lIN, AlON, TIN, Ti 3 O 5 , or ZrO 2 , and wherein the color layer has a thickness of about 3 μm to about 10 μm.
17 . An electronic device surrounded by an electronic device housing, wherein the electronic device housing comprising: an instrument; a first primer layer provided to surround the instrument; a film layer provided on the first primer layer; a second primer layer provided on the film layer; and a coating layer provided on the second primer layer, wherein the film layer has at least one overwrap at which the film layer overlaps and is configured to surround the first primer layer.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a bypass continuation application of International Application No. PCT/KR2022/012218 designating the United States, filed on Aug. 17, 2022, in the Korean Intellectual Property Receiving Office and claiming priority to Korean Patent Application No. 10-2021-0136545 filed on Oct. 14, 2021, in the Korean Intellectual Property Office, the disclosures of which are incorporated by reference herein in their entireties. BACKGROUND 1. Field The disclosure relates generally to an electronic device housing and an electronic device including the electronic device housing. 2. Description of the Related Art There are various types of electronic devices. For example, an electronic device may receive an input from a user through a touchscreen, providing the user with an additional input means, for example, a pen, to allow the user to make a more precise touch input or hovering input. The user may input information to the touchscreen of the electronic device using the pen. Such a pen-type electronic device may include a coil inside thereof by which the information is input to the screen through coil-based electromagnetic induction. The electronic device of this type may include a housing and a support member formed of various materials, which may protect components provided inside the electronic device from an external impact. The housing and the support member may also be portable and be manufactured to be viewed as more favorable and stylish on the outside by users. In general, metal deposition may be used to implement a metallic texture on a surface of an instrument used as a housing of an electronic device (hereinafter also referred to as an electronic device housing). To deposit metal, metal deposition may be performed by seating the instrument on a jig in a deposition machine and then depositing metal particles thereon. In this case, a deviation in the deposition of the metal particles may occur depending on a direction of the instrument seated on the jig and a position of the jig. To protect a thin deposited layer and secure durability, post-processing may be performed, through which a primer layer may be formed to strengthen a chemical bond specific to a painted layer including organic matters. In this case, a primer may be additionally applied and the entire coating layer may thus become thicker. In addition, the amount of paint to be sprayed may increase, and a portion of the paint may flow down by gravity to be lumpy, which may result in poor appearance. SUMMARY One or more example embodiments may address at least the above problems and/or disadvantages and other disadvantages not described above. Also, the example embodiments are not required to overcome the disadvantages described above, and an example embodiment may not overcome any of the problems described above. Provided are systems, methods and devices where the exterior of the instrument may be formed using metallic paint, and may thus have a relatively lower level of luminance than the actual metal deposited layer. Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments. According to an aspect of the disclosure, an electronic device housing may include an instrument, a first primer layer provided to cover the instrument, a film layer provided on the first primer layer, a second primer layer provided on the film layer, and a coating layer provided on the second primer layer. The film layer may include at least one overwrap at which the film layer overlaps that is configured to surround the first primer layer. The instrument may include a hollow structure, and the first primer layer may be provided on an outer surface of the instrument. The instrument may include at least one of polyamide, polyacetal, polycarbonate, polyethylene terephthalate, or polyphenylene oxide. The first primer layer may include at least one of an acrylic resin, an epoxy resin, or a polyester resin. The first primer layer may have a thickness of about 1 μm or greater. The film layer may include at least one metal among aluminum, magnesium, gold, silver, tin, indium, chromium, and copper. The film layer may have a thickness of about 1 μm to about 5 μm. The film layer may be formed as a film including metal particles surrounds the first primer layer and heat is applied thereto. The width of the at least one overwrap may be less than or equal to about 1 mm. The film layer may include a first layer, a second layer, and a third layer, the first layer may be provided on the first primer layer, the second layer may be provided on the first layer, the third layer may be provided on the second layer such that the third layer is disposed between the second layer and the second primer layer, the first layer may include at least one of an acrylic resin, an epoxy resin, or a polyester resin, the second laye