US-12626854-B2 - Electronic component and electronic device

Abstract

An electronic component includes a body, an inner conductor inside the body, and an outer electrode that lies on part of at least a first main surface of the body and includes an underlying electrode and a plating electrode with which the underlying electrode is covered. The underlying electrode includes a first underlying electrode on part of the first main surface and connected directly to the inner conductor and a second underlying electrode at part of the first main surface away from the first underlying electrode and closer than the first underlying electrode to the center of the body in the length direction and not connected directly to the inner conductor. The plating electrode includes first and second plating electrodes. The first underlying electrode is covered with the first plating electrode, and the second underlying electrode is covered with the second plating electrode.

Inventors

• Yoshifumi Maki
• Atsuo HIRUKAWA
• Daisuke Otsuka

Assignees

• MURATA MANUFACTURING CO., LTD.

Dates

Publication Date

20260512

Application Date

20220523

Priority Date

20210525

Claims (20)

1. 1 . An electronic component, comprising: a body having a first end surface, a second end surface, a first main surface, a second main surface, a first side surface, and a second side surface, the first and second end surfaces being located on opposite sides in a length direction, the first and second main surfaces being located on opposite sides in a height direction orthogonal to the length direction, and the first and second side surfaces being located on opposite sides in a width direction orthogonal to the length direction and orthogonal to the height direction; an inner conductor inside the body; and an outer electrode on at least a portion of the first main surface of the body, wherein the outer electrode includes an underlying electrode and a plating electrode which covers the underlying electrode, the underlying electrode includes: a first underlying electrode on a portion of the first main surface of the body and is connected directly to the inner conductor, wherein the first underlying electrode has a first portion on the first end surface of the body and a second portion on the first main surface of the body, and a second underlying electrode that has a portion at the first main surface of the body, and is spaced away from the second portion of the first underlying electrode and is closer than the first underlying electrode to a center of the body in the length direction and is not connected directly to the inner conductor, and the plating electrode includes: a first plating electrode which covers the first underlying electrode, and a second plating electrode which covers the second underlying electrode.
2. 2 . The electronic component according to claim 1 , wherein the second underlying electrode is on and over a portion of the first main surface of the body, and spaced away from the first underlying electrode and closer than the first underlying electrode to the center of the body in the length direction.
3. 3 . The electronic component according to claim 2 , wherein the first plating electrode and the second plating electrode are in contact with each other.
4. 4 . The electronic component according to claim 2 , wherein The first plating electrode and the second plating electrode are spaced away from each other.
5. 5 . The electronic component according to claim 2 , wherein the first underlying electrode on the portion of the first main surface of the body extends continuously over a portion of the first end surface of the body, the underlying electrode further includes a third underlying electrode that has a portion at the first end surface of the body, and is spaced away from the first underlying electrode, and is closer than the first underlying electrode to the second main surface of the body in the height direction and is not connected directly to the inner conductor, and the plating electrode further includes a third plating electrode which covers the third underlying electrode.
6. 6 . The electronic component according to claim 2 , wherein the inner conductor includes a coil conductor.
7. 7 . An electronic device, comprising: the electronic component according to claim 2 ; a substrate a land electrode disposed on a surface of the substrate; and solder that electrically connects between the outer electrode of the electronic component and the land electrode on the substrate, wherein the solder continuously covers the first plating electrode and the second plating electrode.
8. 8 . The electronic component according to claim 1 , wherein the first plating electrode and the second plating electrode are in contact with each other.
9. 9 . The electronic component according to claim 8 , wherein the first underlying electrode on the portion of the first main surface of the body extends continuously over a portion of the first end surface of the body, the underlying electrode further includes a third underlying electrode that has a portion at the first end surface of the body, and is spaced away from the first underlying electrode, and is closer than the first underlying electrode to the second main surface of the body in the height direction and is not connected directly to the inner conductor, and the plating electrode further includes a third plating electrode which covers the third underlying electrode.
10. 10 . An electronic device, comprising: the electronic component according to claim 3 ; a substrate a land electrode disposed on a surface of the substrate; and solder that electrically connects between the outer electrode of the electronic component and the land electrode on the substrate, wherein the solder continuously covers the first plating electrode and the second plating electrode.
11. 11 . The electronic component according to claim 1 , wherein the first plating electrode and the second plating electrode are spaced away from each other.
12. 12 . The electronic component according to claim 11 , wherein a distance between the first plating electrode and the second plating electrode in the length direction is from 3 μm to 20 μm.
13. 13 . The electronic component according to claim 1 , wherein the first underlying electrode on the portion of the first main surface of the body extends continuously over a portion of the first end surface of the body, the underlying electrode further includes a third underlying electrode that has a portion at the first end surface of the body, and is spaced away from the first underlying electrode, and is closer than the first underlying electrode to the second main surface of the body in the height direction and is not connected directly to the inner conductor, and the plating electrode further includes a third plating electrode which covers the third underlying electrode.
14. 14 . The electronic component according to claim 13 , wherein the first plating electrode and the third plating electrode are in contact with each other.
15. 15 . The electronic component according to claim 13 , wherein the first plating electrode and the third plating electrode are spaced away from each other.
16. 16 . The electronic component according to claim 15 , wherein a distance between the first plating electrode and the third plating electrode in the height direction is from 3 μm to 20 μm.
17. 17 . The electronic component according to claim 1 , wherein the inner conductor includes a coil conductor.
18. 18 . An electronic device, comprising: the electronic component according to claim 1 ; a substrate provided with a land electrode disposed on a surface of the substrate; and solder that electrically connects between the outer electrode of the electronic component and the land electrode on the substrate, wherein the solder continuously covers the first plating electrode and the second plating electrode.
19. 19 . The electronic device according to claim 18 , wherein the first underlying electrode on the portion of the first main surface of the body extends continuously over a portion of the first end surface of the body, the underlying electrode further includes a third underlying electrode that has a portion at the first end surface of the body, and is spaced away from the first underlying electrode, and is closer than the first underlying electrode to the second main surface of the body in the height direction and is not connected directly to the inner conductor, the plating electrode further includes a third plating electrode which covers the third underlying electrode, and the solder continuously covers the first plating electrode and the third plating electrode.
20. 20 . An electronic component, comprising: a body having a first end surface, a second end surface, a first main surface, a second main surface, a first side surface, and a second side surface, the first and second end surfaces being located on opposite sides in a length direction, the first and second main surfaces being located on opposite sides in a height direction orthogonal to the length direction, and the first and second side surfaces being located on opposite sides in a width direction orthogonal to the length direction and orthogonal to the height direction; an inner conductor inside the body; and an outer electrode on at least a portion of the first main surface of the body, wherein the outer electrode includes an underlying electrode and a plating electrode which covers the underlying electrode, the underlying electrode includes: a first underlying electrode on a portion of the first main surface of the body and is connected directly to the inner conductor, and a second underlying electrode that has a portion at the first main surface of the body, and is spaced away from the first underlying electrode and is closer than the first underlying electrode to a center of the body in the length direction and is not connected directly to the inner conductor, and the plating electrode includes: a first plating electrode which covers the first underlying electrode, and a second plating electrode which covers the second underlying electrode, wherein the first plating electrode and the second plating electrode extend continuously from a region over the first underlying electrode to a region over the second underlying electrode.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims benefit of priority to Japanese Patent Application No. 2021-087838, filed May 25, 2021, the entire content of which is incorporated herein by reference. BACKGROUND Technical Field The present disclosure relates to an electronic component and an electronic device. Background Art An electronic component or, more specifically, a multilayer coil component including outer electrodes is disclosed in Japanese Unexamined Patent Application Publication No. 2019-186255. The outer electrodes of the multilayer coil component disclosed in Japanese Unexamined Patent Application Publication No. 2019-186255 are each obtained by application of plating to an underlying electrode. Electronic components such as the multilayer coil component that includes an outer electrode as disclosed in Japanese Unexamined Patent Application Publication No. 2019-186255 may be soldered onto substrates, in which case tensile stress caused by thermal contraction of the solder can be exerted on the outer electrode. Due to the tensile stress, plating (a plating electrode) serving as the outer electrode would come off, and as a result, the reliability of the electronic component would be impaired. SUMMARY The present disclosure therefore provides an electronic component designed such that an outer electrode of the electronic component is less likely to come off when the electronic component is soldered onto a substrate. The present disclosure also provides an electronic device including the electronic component. An electronic component according to the present disclosure includes a body, an inner conductor, and an outer electrode. The body has a first end surface, a second end surface, a first main surface, a second main surface, a first side surface, and a second side surface. The first and second end surfaces are located on opposite sides in a length direction. The first and second main surfaces are located on opposite sides in a height direction orthogonal to the length direction. The first and second side surfaces are located on opposite sides in a width direction orthogonal to the length direction and orthogonal to the height direction. The inner conductor is located inside the body. The outer electrode lies on part of at least the first main surface of the body. The outer electrode includes an underlying electrode and a plating electrode with which the underlying electrode is covered. The underlying electrode includes a first underlying electrode and a second underlying electrode. The first underlying electrode lies on part of the first main surface of the body and is connected directly to the inner conductor. The second underlying electrode is provided to part of the first main surface of the body in a manner so as to be discretely located away from the first underlying electrode and closer than the first underlying electrode to the center of the body in the length direction and is not connected directly to the inner conductor. The plating electrode includes a first plating electrode and a second plating electrode. The first underlying electrode is covered with the first plating electrode. The second underlying electrode is covered with the second plating electrode. An electronic device according to the present disclosure includes the electronic component according to the present disclosure, a substrate, and solder. The substrate is provided with a land electrode disposed on a surface of the substrate. The solder forms an electrical connection between the outer electrode of the electronic component and the land electrode on the substrate. The first plating electrode and the second plating electrode are covered with the solder, with no gap between one part and another part of the solder extending over the first and second plating electrodes. The electronic component provided by the present disclosure is designed such that the outer electrode of the electronic component is less likely to come off when the electronic component is soldered onto the substrate. The electronic device provided by the present disclosure is designed to include the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic perspective view of an electronic component according to Embodiment 1 of the present disclosure; FIG. 2 is a schematic sectional view of an example of a portion of the electronic component taken along line A1-A2 in FIG. 1; FIG. 3 is a schematic perspective view of a body and a coil in FIG. 2, illustrating an example of a state in which the body and the coil are disassembled; FIG. 4 is a schematic plan view of the body and the coil in FIG. 2, illustrating an example of a state in which the body and the coil are disassembled; FIG. 5 is a schematic sectional view of an electronic device according to Embodiment 1 of the present disclosure; FIG. 6 is an enlarged sectional view of a region B in FIG. 5, schematically illustrating a first example; FIG. 7 is an enlarged section