US-12626863-B2 - Electronic component and capacitor

Abstract

An electronic component includes an electronic component element and a barrier layer encapsulating the electronic component element. The barrier layer includes a clay layer containing clay. The clay layer is provided to surround the electronic component element. The clay layer may reduce a quantity of water passing through the barrier layer. The barrier layer includes a resin layer containing a resin. The clay layer and the resin layer are preferably stacked one on top of the other. The resin layer is preferably thicker than the clay layer.

Inventors

• Takayuki Hattori
• Yukihiro Shimasaki
• Hiroki Takeoka

Assignees

• PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Dates

Publication Date

20260512

Application Date

20210902

Priority Date

20200914

Claims (12)

1. 1 . A capacitor comprising: a capacitor element including an external electrode; an external connection terminal connected to the external electrode; and a barrier layer encapsulating the capacitor element such that the external connection terminal protrudes from the barrier layer, wherein: the barrier layer includes a clay layer formed of a coating film containing mineral particles and a binder, and a resin layer containing resin, the clay layer and the resin layer are stacked one on top of the other, the clay layer is located closer to the capacitor element than the resin layer is, and is provided on a peripheral surface of the capacitor element, and on the external electrode, and the clay layer covers all of outer surfaces of the capacitor element except for a part with which the external connection terminal is connected.
2. 2 . The capacitor of claim 1 , wherein the resin layer is thicker than the clay layer.
3. 3 . The capacitor of claim 1 , wherein the mineral particles include either plate-shaped particles or flake-shaped particles.
4. 4 . The capacitor of claim 1 , wherein the mineral particles include at least one selected from the group consisting of mica, vermiculite, montmorillonite, iron montmorillonite, beidellite, saponite, hectorite, stevensite, and nontronite.
5. 5 . The capacitor of claim 1 , wherein the binder includes at least one selected from the group consisting of polypropylene, polyethylene sulfide, polyimide, polyamide, polyethylene terephthalate, epoxy resins, fluororesins, polyester resins, polyurethane resins, acrylic resins, phenoxy resins, polyacetal, and polyvinyl alcohol.
6. 6 . The capacitor of claim 1 , wherein content of the mineral particles in the clay layer is equal to or greater than 50% by mass with respect to an entire mass of the clay layer.
7. 7 . The capacitor of claim 1 , wherein the capacitor element includes a pair of metallized films, in each of which an electrode film is formed on a dielectric film, and the pair of metallized films are wound into a roll to make the electrode films face each other with the dielectric film interposed between the electrode films.
8. 8 . The capacitor of claim 2 , wherein the mineral particles include either plate-shaped particles or flake-shaped particles.
9. 9 . The capacitor of claim 1 , wherein: the external electrode comprises a first external electrode and a second external electrode, the external connection terminal comprises a first external connection terminal connected to the first external electrode and a second external connection terminal connected to the second external electrode.
10. 10 . The capacitor of claim 9 , wherein the resin layer covers all of outer surfaces of the clay layer except for parts through which the first and second external connection terminals protrude.
11. 11 . The capacitor of claim 9 , wherein: the first external electrode is provided at an upper surface of the capacitor element, the second external electrode is provided at a bottom surface of the capacitor element, and the second external connection terminal extend along a side surface of the capacitor element.
12. 12 . The capacitor of claim 9 , wherein the resin layer is an outermost layer of the capacitor.

Description

CROSS-REFERENCE OF RELATED APPLICATIONS This application is the U.S. National Phase under 35 U.S.C. § 371 of International Patent Application No. PCT/JP2021/032357, filed on Sep. 2, 2021, which in turn claims the benefit of Japanese Patent Application No. 2020-154057, filed on Sep. 14, 2020, the entire disclosures of which Applications are incorporated by reference herein. TECHNICAL FIELD The present disclosure generally relates to an electronic component and a capacitor, and more particularly relates to an electronic component including an electronic component element and a barrier layer and a capacitor. BACKGROUND ART Patent Literature 1 discloses a case molded capacitor. The case molded capacitor includes a capacitor element, lead terminals, a molding resin, and a case. The capacitor element is a wound film capacitor element and is housed in a case made of polyphenylene sulfide (PPS). The molding resin fills the gap inside the case and encapsulates the capacitor element. The lead terminals are electrically connected to the capacitor element and extended out of the case through parts of the molding resin. CITATION LIST Patent Literature Patent Literature 1: JP 2006-294788 A SUMMARY OF INVENTION The case molded capacitor of Patent Literature 1 attempts to shield the capacitor element from a humidity environment using the molding resin and the case. To ensure sufficient moisture resistance (or humidity resistance), however, the respective thicknesses of the case and the molding resin need to be increased, which requires a lot of resin. This makes it difficult to reduce the overall size of the capacitor. It is therefore an object of the present disclosure to provide an electronic component and a capacitor, both of which may easily have their overall size reduced. An electronic component according to an aspect of the present disclosure includes: an electronic component element; and a barrier layer encapsulating the electronic component element. The barrier layer includes a clay layer containing clay. The clay layer is provided to surround the electronic component element. A capacitor according to another aspect of the present disclosure includes a capacitor element as the electronic component element of the electronic component described above. BRIEF DESCRIPTION OF DRAWINGS FIG. 1A is a front view illustrating an electronic component according to an exemplary embodiment of the present disclosure; FIG. 1B is a cross-sectional view illustrating the electronic component according to the exemplary embodiment; FIG. 1C is a cross-sectional view illustrating the electronic component according to the exemplary embodiment; FIG. 2A is a cross-sectional view illustrating the electronic component according to the exemplary embodiment; FIG. 2B is a cross-sectional view illustrating the electronic component according to the exemplary embodiment; FIG. 2C is a cross-sectional view illustrating the electronic component according to the exemplary embodiment; FIG. 3A is a schematic perspective view illustrating an exemplary mineral particle; FIG. 3B is a schematic cross-sectional view illustrating an exemplary clay layer; FIG. 4A is a perspective view illustrating a process step of a method for manufacturing a wound capacitor element; FIG. 4B is a perspective view of the wound capacitor element; FIG. 5A is a perspective view illustrating a process step of a method for manufacturing a stacked capacitor element; FIG. 5B is a partially cutaway perspective view of the stacked capacitor element; FIG. 5C is a perspective view of the stacked capacitor element; FIGS. 6A and 6B are cross-sectional views illustrating a manufacturing process of the electronic component shown in FIGS. 1A-1C; FIG. 7A is a cross-sectional view illustrating an electronic component according to a second embodiment of the present disclosure; FIG. 7B is a cross-sectional view illustrating the electronic component according to the second embodiment; FIG. 7C is a cross-sectional view illustrating the electronic component according to the second embodiment; FIGS. 8A-8C are cross-sectional views illustrating a manufacturing process of the electronic component shown in FIGS. 7A-7C; FIG. 9A is a cross-sectional view illustrating an electronic component according to a third embodiment of the present disclosure; FIG. 9B is a cross-sectional view illustrating an electronic component according to a fourth embodiment of the present disclosure; and FIG. 9C is a cross-sectional view illustrating an electronic component according to a fifth embodiment of the present disclosure. DESCRIPTION OF EMBODIMENTS First Embodiment (1) Overview An electronic component 1 according to an exemplary embodiment includes an electronic component element 2 and a barrier layer 3 encapsulating the electronic component element 2 (refer to FIG. 1A). The barrier layer 3 includes a clay layer 31 containing clay. The clay layer 31 is provided to surround the electronic component element 2. In this con