US-12626864-B2 - Capacitor assembly package structure and method of manufacturing the same, and electronic device

US12626864B2US 12626864 B2US12626864 B2US 12626864B2US-12626864-B2

Abstract

A capacitor assembly package structure and a method of manufacturing the same, and an electronic device are provided. The capacitor assembly package structure includes a capacitor assembly, a plurality of first insulating package bodies, a second insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures. The capacitor assembly has a plurality of stacking gaps. The first insulating package bodies are respectively received in the stacking gaps of the capacitor assembly. The second insulating package body is configured to cover the first insulating package bodies and the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. A solid content of each first insulating package body is less than a solid content of the second insulating package body so as to reduce the percentage of multiple pores formed in each stacking gap of the capacitor assembly.

Inventors

CHIEH LIN
YI-YING WANG

Assignees

APAQ TECHNOLOGY CO., LTD.

Dates

Publication Date: 20260512
Application Date: 20240320
Priority Date: 20230912

Claims (10)

1 . A capacitor assembly package structure, comprising: a capacitor assembly including a plurality of capacitor structures that are stacked in sequence and electrically connected to each other, wherein each of the capacitor structures has a positive electrode portion and a negative electrode portion, the capacitor assembly has a plurality of stacking gaps, and each of the stacking gaps is correspondingly formed between two adjacent ones of the capacitor structures; a plurality of first insulating package bodies configured to be respectively received in the stacking gaps of the capacitor assembly; a second insulating package body configured to cover the first insulating package bodies and the capacitor structures; and an electrode assembly including a first electrode structure and a second electrode structure, wherein the first electrode structure and the second insulating package body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, and the second electrode structure and the second insulating package body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure; wherein a solid content of each of the first insulating package bodies is less than a solid content of the second insulating package body; wherein a total volume of the first insulating package bodies is smaller than a volume of the second insulating package body; wherein each of the first insulating package bodies and the second insulating package body have the same or different insulating materials.
2 . The capacitor assembly package structure according to claim 1 , wherein each of the capacitor structures includes a metal foil, an insulating position-limiting layer disposed around a first portion of the metal foil, a conductive polymer layer for covering the first portion of the metal foil and contacting the insulating position-limiting layer, a carbon glue layer for covering the conductive polymer layer and contacting the insulating position-limiting layer, and a silver glue layer for covering the carbon glue layer and contacting the insulating position-limiting layer; wherein, a second portion of the metal foil of each of the capacitor structures is not covered by the insulating position-limiting layer, and the second portions of the metal foils of the capacitor structures are stacked in sequence or separate from each other; wherein the solid content of each of the first insulating package bodies is between 5% and 79%, and the solid content of the second insulating package body is between 80% and 95%; wherein the first insulating package bodies have the same insulating material, and the first insulating package bodies have the same solid content; wherein each of the first insulating package bodies includes a first insulating material and a plurality of first insulating particles mixed with the first insulating material, and the second insulating package body includes a second insulating material and a plurality of second insulating particles mixed with the second insulating material; wherein the first insulating material of each of the first insulating package bodies is silicone or epoxy resin, and each of the first insulating particles of each of the first insulating package bodies is silicon dioxide or aluminum trioxide; wherein the second insulating material of the second insulating package body is silicone or epoxy resin, and each of the second insulating particles of the second insulating package body is silicon dioxide or aluminum trioxide; wherein a density of the first insulating particles of each of the first insulating package bodies is smaller than a density of the second insulating particles of the second insulating package body; wherein the first insulating material of each of the first insulating package bodies and the second insulating material of the second insulating package body have the same insulating material or different insulating materials, and each of the first insulating particles of each of the first insulating package bodies and each of the second insulating particles of the second insulating package body have the same insulating material or different insulating materials; wherein the first insulating package bodies are configured to respectively fill the stacking gaps of the capacitor assembly, thereby reducing a percentage of pores formed within each of the stacking gaps of the capacitor assembly; wherein a filling rate of each of the stacking gaps filled by a corresponding one of the first insulating package bodies is between 85% and 95%.
3 . The capacitor assembly package structure according to claim 1 , wherein the electrode assembly is a conductive pin assembly or a terminal electrode assembly; wherein, when the electrode assembly is the conductive pin assembly, the first electrode structure of the electrode assembly includes a first embedded portion covered by the second insulating package body and a first exposed portion connected to the first embedded portion and exposed from the second insulating package body, the first embedded portion of the first electrode structure is electrically connected to the positive electrode portion of the capacitor structure, and the first exposed portion of the first electrode structure extends along an outer surface of the second insulating package body; wherein, when the electrode assembly is the conductive pin assembly, the second electrode structure of the electrode assembly includes a second embedded portion covered by the second insulating package body and a second exposed portion connected to the second embedded portion and exposed from the second insulating package body, the second embedded portion of the second electrode structure is electrically connected to the negative electrode portion of the capacitor structure, and the second exposed portion of the second electrode structure extends along the outer surface of the second insulating package body; wherein, when the electrode assembly is the terminal electrode assembly, the first electrode structure of the electrode assembly includes a first inner conductive layer configured to cover a first side portion of the second insulating package body and electrically contact the positive electrode portion of the capacitor structure, a first intermediate conductive layer configured to cover the first inner conductive layer, and a first outer conductive layer configured to cover the first intermediate conductive layer, the first inner conductive layer is one of a silver-containing material layer and a copper-containing material layer, the first intermediate conductive layer is a nickel-containing material layer, and the first outer conductive layer is a tin-containing material layer; wherein, when the electrode assembly is the terminal electrode assembly, the second electrode structure of the electrode assembly includes a second inner conductive layer configured to cover a second side portion of the second insulating package body and electrically contact the negative electrode portion of the capacitor structure, a second intermediate conductive layer configured to cover the second inner conductive layer, and a second outer conductive layer configured to cover the second intermediate conductive layer, the second inner conductive layer is one of a silver-containing material layer and a copper-containing material layer, the second intermediate conductive layer is a nickel-containing material layer, and the second outer conductive layer is a tin-containing material layer; wherein, when the electrode assembly is the terminal electrode assembly, the capacitor structures are carried by a conductive carrier substrate, and the negative electrode portion of the capacitor structure is electrically connected to the second electrode structure of the electrode assembly through the conductive carrier substrate.
4 . A method of manufacturing a capacitor assembly package structure, comprising: providing a capacitor assembly, wherein the capacitor assembly includes a plurality of capacitor structures that are stacked in sequence and electrically connected to each other, each of the capacitor structures has a positive electrode portion and a negative electrode portion, the capacitor assembly has a plurality of stacking gaps, and each of the stacking gaps is correspondingly formed between two adjacent ones of the capacitor structures; forming a plurality of first insulating package bodies that are configured to be respectively received in the stacking gaps of the capacitor assembly; and forming a second insulating package body that is configured to cover the first insulating package bodies and the capacitor structures; wherein a solid content of each of the first insulating package bodies is less than a solid content of the second insulating package body; wherein a total volume of the first insulating package bodies is smaller than a volume of the second insulating package body; wherein each of the first insulating package bodies and the second insulating package body have the same or different insulating materials.
5 . The method of manufacturing the capacitor assembly package structure according to claim 4 , wherein, in the step of providing the capacitor assembly, the capacitor structures are stacked and arranged on an electrode assembly; wherein the electrode assembly includes a first electrode structure and a second electrode structure, the first electrode structure and the second insulating package body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, and the second electrode structure and the second insulating package body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure; wherein the first electrode structure of the electrode assembly includes a first embedded portion covered by the second insulating package body and a first exposed portion connected to the first embedded portion and exposed from the second insulating package body, the first embedded portion of the first electrode structure is electrically connected to the positive electrode portion of the capacitor structure, and the first exposed portion of the first electrode structure extends along an outer surface of the second insulating package body; wherein the second electrode structure of the electrode assembly includes a second embedded portion covered by the second insulating package body and a second exposed portion connected to the second embedded portion and exposed from the second insulating package body, the second embedded portion of the second electrode structure is electrically connected to the negative electrode portion of the capacitor structure, and the second exposed portion of the second electrode structure extends along the outer surface of the second insulating package body.
6 . The method of manufacturing the capacitor assembly package structure according to claim 4 , wherein, after the step of forming the second insulating package body, an electrode assembly cooperates with the second insulating package body so as to electrically connect to the capacitor assembly; wherein the electrode assembly includes a first electrode structure and a second electrode structure, the first electrode structure and the second insulating package body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, and the second electrode structure and the second insulating package body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure; wherein the first electrode structure of the electrode assembly includes a first inner conductive layer configured to cover a first side portion of the second insulating package body and electrically contact the positive electrode portion of the capacitor structure, a first intermediate conductive layer configured to cover the first inner conductive layer, and a first outer conductive layer configured to cover the first intermediate conductive layer, the first inner conductive layer is one of a silver-containing material layer and a copper-containing material layer, the first intermediate conductive layer is a nickel-containing material layer, and the first outer conductive layer is a tin-containing material layer; wherein the second electrode structure of the electrode assembly includes a second inner conductive layer configured to cover a second side portion of the second insulating package body and electrically contact the negative electrode portion of the capacitor structure, a second intermediate conductive layer configured to cover the second inner conductive layer, and a second outer conductive layer configured to cover the second intermediate conductive layer, the second inner conductive layer is one of a silver-containing material layer and a copper-containing material layer, the second intermediate conductive layer is a nickel-containing material layer, and the second outer conductive layer is a tin-containing material layer; wherein, in the step of providing the capacitor assembly, the capacitor structures are carried by a conductive carrier substrate, and the negative electrode portion of the capacitor structure is electrically connected to the second electrode structure of the electrode assembly through the conductive carrier substrate.
7 . The method of manufacturing the capacitor assembly package structure according to claim 4 , wherein each of the capacitor structures includes a metal foil, an insulating position-limiting layer disposed around a first portion of the metal foil, a conductive polymer layer for covering the first portion of the metal foil and contacting the insulating position-limiting layer, a carbon glue layer for covering the conductive polymer layer and contacting the insulating position-limiting layer, and a silver glue layer for covering the carbon glue layer and contacting the insulating position-limiting layer; wherein, a second portion of the metal foil of each of the capacitor structures is not covered by the insulating position-limiting layer, and the second portions of the metal foils of the capacitor structures are stacked in sequence or separate from each other; wherein the solid content of each of the first insulating package bodies is between 5% and 79%, and the solid content of the second insulating package body is between 80% and 95%; wherein the first insulating package bodies have the same insulating material, and the first insulating package bodies have the same solid content; wherein each of the first insulating package bodies includes a first insulating material and a plurality of first insulating particles mixed with the first insulating material, and the second insulating package body includes a second insulating material and a plurality of second insulating particles mixed with the second insulating material; wherein the first insulating material of each of the first insulating package bodies is silicone or epoxy resin, and each of the first insulating particles of each of the first insulating package bodies is silicon dioxide or aluminum trioxide; wherein the second insulating material of the second insulating package body is silicone or epoxy resin, and each of the second insulating particles of the second insulating package body is silicon dioxide or aluminum trioxide; wherein a density of the first insulating particles of each of the first insulating package bodies is smaller than a density of the second insulating particles of the second insulating package body; wherein the first insulating material of each of the first insulating package bodies and the second insulating material of the second insulating package body have the same insulating material or different insulating materials, and each of the first insulating particles of each of the first insulating package bodies and each of the second insulating particles of the second insulating package body have the same insulating material or different insulating materials; wherein the first insulating package bodies are configured to respectively fill the stacking gaps of the capacitor assembly, thereby reducing a percentage of pores formed within each of the stacking gaps of the capacitor assembly; wherein a filling rate of each of the stacking gaps filled by a corresponding one of the first insulating package bodies is between 85% and 95%.
8 . An electronic device configured to use a capacitor assembly package structure, the capacitor assembly package structure comprising: a capacitor assembly including a plurality of capacitor structures that are stacked in sequence and electrically connected to each other, wherein each of the capacitor structures has a positive electrode portion and a negative electrode portion, the capacitor assembly has a plurality of stacking gaps, and each of the stacking gaps is correspondingly formed between two adjacent ones of the capacitor structures; a plurality of first insulating package bodies configured to be respectively received in the stacking gaps of the capacitor assembly; a second insulating package body configured to cover the first insulating package bodies and the capacitor structures; and an electrode assembly including a first electrode structure and a second electrode structure, wherein the first electrode structure and the second insulating package body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, and the second electrode structure and the second insulating package body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure; wherein a solid content of each of the first insulating package bodies is less than a solid content of the second insulating package body; wherein a total volume of the first insulating package bodies is smaller than a volume of the second insulating package body; wherein each of the first insulating package bodies and the second insulating package body have the same or different insulating materials.
9 . The electronic device according to claim 8 , wherein each of the capacitor structures includes a metal foil, an insulating position-limiting layer disposed around a first portion of the metal foil, a conductive polymer layer for covering the first portion of the metal foil and contacting the insulating position-limiting layer, a carbon glue layer for covering the conductive polymer layer and contacting the insulating position-limiting layer, and a silver glue layer for covering the carbon glue layer and contacting the insulating position-limiting layer; wherein, a second portion of the metal foil of each of the capacitor structures is not covered by the insulating position-limiting layer, and the second portions of the metal foils of the capacitor structures are stacked in sequence or separate from each other; wherein the solid content of each of the first insulating package bodies is between 5% and 79%, and the solid content of the second insulating package body is between 80% and 95%; wherein the first insulating package bodies have the same insulating material, and the first insulating package bodies have the same solid content; wherein each of the first insulating package bodies includes a first insulating material and a plurality of first insulating particles mixed with the first insulating material, and the second insulating package body includes a second insulating material and a plurality of second insulating particles mixed with the second insulating material; wherein the first insulating material of each of the first insulating package bodies is silicone or epoxy resin, and each of the first insulating particles of each of the first insulating package bodies is silicon dioxide or aluminum trioxide; wherein the second insulating material of the second insulating package body is silicone or epoxy resin, and each of the second insulating particles of the second insulating package body is silicon dioxide or aluminum trioxide; wherein a density of the first insulating particles of each of the first insulating package bodies is smaller than a density of the second insulating particles of the second insulating package body; wherein the first insulating material of each of the first insulating package bodies and the second insulating material of the second insulating package body have the same insulating material or different insulating materials, and each of the first insulating particles of each of the first insulating package bodies and each of the second insulating particles of the second insulating package body have the same insulating material or different insulating materials; wherein the first insulating package bodies are configured to respectively fill the stacking gaps of the capacitor assembly, thereby reducing a percentage of pores formed within each of the stacking gaps of the capacitor assembly; wherein a filling rate of each of the stacking gaps filled by a corresponding one of the first insulating package bodies is between 85% and 95%.
10 . The electronic device according to claim 8 , wherein the electrode assembly is a conductive pin assembly or a terminal electrode assembly.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATION This application claims the benefit of priority to Taiwan Patent Application No. 112134599, filed on Sep. 12, 2023. The entire content of the above identified application is incorporated herein by reference. Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference. FIELD OF THE DISCLOSURE The present disclosure relates to a capacitor, and more particularly to a capacitor assembly package structure, a method of manufacturing the capacitor assembly package structure, and an electronic device using the capacitor assembly package structure. BACKGROUND OF THE DISCLOSURE In general, a plurality of capacitor elements is stacked together to form a stacked solid electrolytic capacitor with a high electrical capacity. In addition, the stacked solid electrolytic capacitor of the related art includes a plurality of capacitor elements and a lead frame. Each capacitor element includes an anode part, a cathode part and an insulating part. The insulating part is insulated from the anode part and the cathode part. More specifically, the cathode parts of the capacitor elements are stacked on top of one another. However, there is still room for improvement in the related art of the wound capacitor. SUMMARY OF THE DISCLOSURE In response to the above-referenced technical inadequacy, the present disclosure provides a capacitor assembly package structure and a method of manufacturing the same, and an electronic device, to reduce the percentage of multiple pores formed in each stacking gap of a capacitor assembly (that is to say, to reduce the structural defect rate or structural defect conditions caused by the pores), thereby improving the structural stability of the capacitor assembly package structure (for example, the vibration resistance of multiple capacitor structures of the capacitor assembly package structure can be improved, so that the electrical characteristics of the capacitor assembly package structure provided by the present disclosure are not easily degraded by vibration), and to prevent excessive moisture from accumulating in the pores, thereby reducing the probability of structural cracks in the capacitor assembly package structure during the reflow process. In order to solve the above-mentioned problems, one of the technical aspects adopted by the present disclosure is to provide a capacitor assembly package structure, which includes a capacitor assembly, a plurality of first insulating package bodies, a second insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures that are stacked in sequence and electrically connected to each other, each of the capacitor structures has a positive electrode portion and a negative electrode portion, the capacitor assembly has a plurality of stacking gaps, and each of the stacking gaps is correspondingly formed between two adjacent ones of the capacitor structures. The first insulating package bodies are configured to be respectively received in the stacking gaps of the capacitor assembly. The second insulating package body is configured to cover the first insulating package bodies and the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure, the first electrode structure and the second insulating package body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, and the second electrode structure and the second insulating package body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure. A solid content of each of the first insulating package bodies is less than a solid content of the second insulating package body. A total volume of the first insulating package bodies is smaller than a volume of the second insulating package body. Each of the first insulating package bodies and the second insulating package body have the same or different insulating materials. In order to solve the above-mentioned problems, another one of the technical aspects adopted by the present disclosure is to provide a method of manufacturing a capacitor assembly package structure, which includes providing a capacitor assembly, in which the capacitor assembly includes a plurality of capacitor structures that are stacked in sequence and electrically connected to each other, each of the capacitor st