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US-12626867-B2 - Multilayer ceramic electronic component

US12626867B2US 12626867 B2US12626867 B2US 12626867B2US-12626867-B2

Abstract

A multilayer ceramic capacitor includes two outer layer portions on sides of an inner layer portion, first and second side gap portions respectively adjacent to first and second lateral surfaces, and external electrodes respectively on first and second end surfaces. A dimension of the inner layer portion in a width direction is equal or substantially equal between first and second main surfaces in a lamination direction. In a cross section of lamination and width directions in a middle portion in a length direction, a dimension of the first side gap portion in the width direction is equal or substantially equal between sides on the first and second main surfaces in the lamination direction, and a dimension of the second side gap portion in the width direction gradually increases from the middle portion in the lamination direction toward the side of the second main surface.

Inventors

  • Hiroki Mizuno

Assignees

  • MURATA MANUFACTURING CO., LTD.

Dates

Publication Date
20260512
Application Date
20240327
Priority Date
20240304

Claims (20)

  1. 1 . A multilayer ceramic electronic component comprising: a multilayer body including an inner layer portion including a plurality of internal electrode layers and a plurality of internal dielectric layers that are laminated, a first main surface and a second main surface opposed to each other in a lamination direction, a first end surface and a second end surface opposed to each other in a length direction intersecting the lamination direction, a first lateral surface and a second lateral surface opposed to each other in a width direction intersecting the lamination direction and the length direction, two outer layer portions respectively on one of two sides of the inner layer portion in the lamination direction, and a first side gap portion adjacent to the first lateral surface of the inner layer portion and a second side gap portion adjacent to the second lateral surface of the inner layer portion; and external electrodes respectively on the first end surface and the second end surface; wherein a dimension of the inner layer portion in the width direction is equal or substantially equal between a side on the first main surface and a side on the second main surface in the lamination direction; and in a cross section of the lamination direction and the width direction in a middle portion in the length direction, a dimension in the width direction of the first side gap portion that is closest to the first main surface in the lamination direction is equal or substantially equal to a dimension in the width direction of the first side gap portion that is closest to the second main surface in the lamination direction, and a dimension of the second side gap portion in the width direction increases from the middle portion in the lamination direction toward the side of the second main surface.
  2. 2 . The multilayer ceramic electronic component according to claim 1 , wherein a variation in the dimension of the first side gap portion in the width direction along the lamination direction is about 5% or less.
  3. 3 . The multilayer ceramic electronic component according to claim 1 , wherein the dimension of the second side gap portion in the width direction increases from the first main surface toward the second main surface.
  4. 4 . The multilayer ceramic electronic component according to claim 1 , wherein a maximum dimension of the second side gap portion in the width direction is about 1.5 times or more a minimum dimension of the second side gap portion in the width direction.
  5. 5 . The multilayer ceramic electronic component according to claim 1 , wherein a dimension of the multilayer body in the length direction is about 0.2 mm or more and about 10 mm or less; a dimension of the multilayer body in the lamination direction is about 0.1 mm or more and about 10 mm or less; and a dimension of the multilayer body in the width direction is about 0.1 mm or more and about 10 mm or less.
  6. 6 . The multilayer ceramic electronic component according to claim 1 , wherein corner portions and ridge portions of the multilayer body are rounded.
  7. 7 . The multilayer ceramic electronic component according to claim 1 , wherein each of the plurality of internal dielectric layers includes a dielectric ceramic material.
  8. 8 . The multilayer ceramic electronic component according to claim 7 , wherein the dielectric ceramic material includes at least one of BaTiO 3 , CaTiO 3 , SrTiO 3 , or CaZrO 3 as a main component.
  9. 9 . The multilayer ceramic electronic component according to claim 8 , wherein the dielectric ceramic material includes at least one of a Mn compound, a Fe compound, a Cr compound, a Co compound, or a Ni compound as a subcomponent.
  10. 10 . The multilayer ceramic electronic component according to claim 1 , wherein a thickness of each of the plurality of dielectric layers is about 0.5 μm or more and about 15 μm or less.
  11. 11 . The multilayer ceramic electronic component according to claim 1 , wherein a number of the plurality of dielectric layers is 10 or more and 700 or less.
  12. 12 . The multilayer ceramic electronic component according to claim 1 , wherein a thickness of each of the plurality of internal electrode layers is about 0.2 μm or more and about 2.0 μm or less.
  13. 13 . The multilayer ceramic electronic component according to claim 1 , wherein a number of the plurality of internal electrode layers is 10 or more and 700 or less.
  14. 14 . The multilayer ceramic electronic component according to claim 1 , wherein each of the plurality of internal electrode layers includes at least one of Ni, Cu, Ag, Pd, or Au, or an alloy including at least one of Ni, Cu, Ag, Pd, or Au.
  15. 15 . The multilayer ceramic electronic component according to claim 1 , wherein each of the external electrodes includes a base electrode layer and a plated layer on the base electrode layer.
  16. 16 . The multilayer ceramic electronic component according to claim 15 , wherein the base electrode layer is a fired layer.
  17. 17 . The multilayer ceramic electronic component according to claim 16 , wherein the base electrode layer includes a metal component and at least one of a glass component or a ceramic component.
  18. 18 . The multilayer ceramic electronic component according to claim 17 , wherein the metal component includes at least one of Cu, Ni, Ag, Pd, Ag—Pd alloy or Au.
  19. 19 . The multilayer ceramic electronic component according to claim 17 , wherein the glass component includes at least one of B, Si, Ba, Mg, Al, or Li.
  20. 20 . The multilayer ceramic electronic component according to claim 17 , wherein the ceramic component includes at least one of BaTiO 3 , CaTiO 3 , (Ba, Ca) TiO 3 , SrTiO 3 , or CaZrO 3 .

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application claims the benefit of priority to Japanese Patent Application No. 2024-031821 filed on Mar. 4, 2024. The entire contents of this application are hereby incorporated herein by reference. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to multilayer ceramic electronic components. 2. Description of the Related Art In the related art, a multilayer ceramic capacitor is known as a multilayer ceramic electronic component. The multilayer ceramic capacitor includes a multilayer body including an inner layer portion including a plurality of internal dielectric layers and internal electrode layers that are alternately laminated, and side gap portions on both sides in the width direction of the inner layer portion, and external electrodes on both end surfaces of the multilayer body. Such a multilayer ceramic capacitor is manufactured, for example, by cutting a mother block formed by laminating a plurality of ceramic green sheets defining internal dielectric layers on each of which an electrically conductive paste defining an internal electrode layer is printed, into a predetermined size to manufacture a multilayer body, and providing external electrodes on the multilayer body (for example, refer to Japanese Unexamined Patent Application Publication No. 2000-357628). When the mother block is cut into a predetermined size, the mother block is cut in the length direction and the width direction. Here, the portion between the electrically conductive plates, in the width direction, defining a side gap portion on which the electrically conductive paste is not printed is cut from one side toward the other side in the lamination direction. At this time, the cutting blade is initially positioned substantially in the middle between the electrically conductive pastes, but there is a possibility that the cutting blade is displaced from the middle as it moves from one side in the lamination direction toward the other side (from the upper side to the lower side) and approaches the electrically conductive paste. Here, the adhesion strength between the electrically conductive paste and the ceramic green sheet is weaker than that of the portion where the ceramic green sheets defining the side gap portion are directly laminated. Therefore, when the cutting blade approaches the portion on which the electrically conductive paste is printed, a downward force is applied to the electrically conductive paste, and there is a possibility that the ceramic green sheet on which the electrically conductive paste is printed is separated from the ceramic green sheet laminated thereon, such that interlayer peeling occurs. In order to avoid such interlayer peeling, it is conceivable to gradually increase the width of the side gap portion from the upper side to the lower side in both directions in the width direction, thereby tolerating the displacement of the cutting blade in either direction in the width direction. However, in recent years, there is a demand for a reduction in size and a large capacitance of a multilayer ceramic capacitor. When the width of the side gap portion gradually increases from the upper side to the lower side in both directions in the width direction, the dimension of the electrically conductive paste in the width direction in the lower side, that is, the dimension of the internal electrode layer in the width direction, becomes small, resulting in a contradiction to the reduction in size and the large capacitance. SUMMARY OF THE INVENTION Example embodiments of the present invention provide multilayer ceramic electronic components that are each able to satisfy a demand for a reduction in size and an increased capacitance and to reduce the possibility of an occurrence of interlayer peeling. An example embodiment of the present invention provides a multilayer ceramic electronic component that includes a multilayer body including an inner layer portion including a plurality of internal electrode layers and a plurality of internal dielectric layers that are laminated, a first main surface and a second main surface opposed to each other in a lamination direction, a first end surface and a second end surface opposed to each other in a length direction intersecting the lamination direction, a first lateral surface and a second lateral surface opposed to each other in a width direction intersecting the lamination direction and the length direction, two outer layer portions respectively on one of two sides of the inner layer portion in the lamination direction, and a first side gap portion adjacent to the first lateral surface of the inner layer portion and a second side gap portion adjacent to the second lateral surface of the inner layer portion, and external electrodes respectively on the first end surface and the second end surface, in which a dimension of the inner layer portion in the width direction is equal or substantially equal betwe