US-12627024-B2 - Antenna package

Abstract

An electronic device includes a first layer with an antenna and a second metal layer that extends over the entire first layer. The second metal layer includes at least one laterally-closed cavity that is located vertically above the antenna. The cavity is filled, at least in part, by a resin material. A first plate supporting a second metal plate extends over the cavity with the second metal plate positioned vertically above the antenna. The first metal plate may be supported by a ledge within the cavity. Alternatively, the second metal plate is embedded in the resin filling the cavity, with the second metal plate positioned vertically above the antenna.

Inventors

• Deborah COGONI

Assignees

• STMicroelectronics (Alps) SAS

Dates

Publication Date

20260512

Application Date

20231219

Priority Date

20200825

Claims (18)

1. 1 . An electronic device, comprising: a first layer comprising an antenna; a second layer made of metal and extending over the first layer and comprising at least one laterally-closed cavity, said laterally-closed cavity being located vertically above the antenna; a resin material filling said laterally-closed cavity; wherein said resin material comprises a laser direct structuring material; and a conductive plate formed at an upper surface of the laser direct structuring material filling the laterally-closed cavity.
2. 2 . The device according to claim 1 , wherein the upper surface of the laser direct structuring material filling the laterally-closed cavity includes a laser activated region, and wherein the conductive plate comprises a plating material at the laser activated region.
3. 3 . The device according to claim 1 , wherein said second layer includes at least one hole separate from the laterally-closed cavity, and wherein the resin material extends over an upper surface of the second layer and includes a foot portion that extends into said at least one hole.
4. 4 . The device according to claim 3 , wherein said at least one hole forms a via extending through the second layer.
5. 5 . The device according to claim 3 , wherein said at least one hole extends perpendicular to an upper surface of the first layer.
6. 6 . The device according to claim 3 , wherein said at least one hole extends non-perpendicular to an upper surface of the first layer.
7. 7 . The device according to claim 1 , wherein a peripheral wall of the first layer is coplanar with a peripheral wall of the second layer.
8. 8 . The device according to claim 1 , wherein a lateral wall of said at least one laterally-closed cavity forms an acute angle with respect to an upper surface of the first layer.
9. 9 . The device according to claim 1 , wherein a lateral wall of said at least one laterally-closed cavity forms an obtuse angle with respect to an upper surface of the first layer.
10. 10 . The device according to claim 1 , wherein the upper surface of the laser direct structuring material filling the laterally-closed cavity is coplanar with an upper surface of the second layer.
11. 11 . The device according to claim 1 , wherein said second layer is bonded to said first layer by an adhesive layer.
12. 12 . A method of making an electronic device, comprising: forming a first layer comprising an antenna; forming a second layer made of metal and comprising at least one laterally-closed cavity; mounting the second layer over the first layer with said laterally-closed cavity being located vertically above the antenna; filling said laterally-closed cavity with a resin material; wherein said resin material comprises a laser direct structuring material; laser activating a region at an upper surface of the laser direct structuring material filling the laterally-closed cavity; and performing a plating process to produce a conductive plate at the laser activated region.
13. 13 . The method according to claim 12 , further comprising forming at least one hole separate from the laterally-closed cavity in the second layer, and filling said at least one hole with the resin material.
14. 14 . The method according to claim 13 , wherein said at least one hole extends perpendicular to an upper surface of the first layer.
15. 15 . The method according to claim 13 , wherein said at least one hole extends non-perpendicular to an upper surface of the first layer.
16. 16 . The method according to claim 13 , further comprising forming said at least one laterally-closed cavity with a lateral wall that forms an acute angle with respect to an upper surface of the first layer.
17. 17 . The method according to claim 13 , further comprising forming said at least one laterally-closed cavity with a lateral wall that forms an obtuse angle with respect to an upper surface of the first layer.
18. 18 . The method according to claim 13 , wherein mounting comprises bonding said second layer to said first layer using an adhesive layer.

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser. No. 17/408,982, filed Aug. 23, 2021, which claims the priority benefit of French Application for Patent No. 2008676, filed on Aug. 25, 2020, the contents of which are hereby incorporated by reference in their entireties to the maximum extent allowable by law. TECHNICAL FIELD The present disclosure generally concerns electronic devices and, more particularly, devices comprising an antenna located in a package and methods of manufacturing the same. BACKGROUND An antenna is an element enabling to radiate (emitter) or to capture (receiver) electromagnetic waves. The antenna is an essential element in a radioelectric system. There is a need in the art to address disadvantages of known antenna devices. SUMMARY An embodiment provides an electronic device comprises: a first layer comprising an antenna; a second metal layer extending over the entire first layer and comprising at least one laterally-closed cavity, said cavity being located opposite the antenna; a first plate extending opposite the cavity; and a second metal plate, resting on the first plate, located opposite the antenna. Another embodiment provides a method of manufacturing an electronic device comprising: forming a first layer comprising an antenna; forming a second metal layer extending over the entire first layer and comprising at least one laterally-closed cavity, said cavity being located opposite the antenna; laying a first plate extending opposite the cavity on the second layer; and laying a second metal plate, resting on the first plate, located opposite the antenna. According to an embodiment, the first plate is made of glass. According to an embodiment, the first plate entirely covers the second layer and the cavity. According to an embodiment, the cavity is filled with resin. According to an embodiment, the lateral walls of the first plate are coplanar with the lateral walls of the second layer. According to an embodiment, the lateral walls of the first layer are coplanar with the lateral walls of the second layer. According to an embodiment, the cavity comprises an edge having the first plate resting thereon. According to an embodiment, the portion of the cavity under the level of the edge is filled with resin. According to an embodiment, the method comprises placing the second plate on the edge. According to an embodiment, the method comprises bonding the second layer to the first layer. According to an embodiment, the method comprises bonding the second plate to the upper surface of the first plate before laying the first plate. BRIEF DESCRIPTION OF THE DRAWINGS The foregoing features and advantages, as well as others, will be described in detail in the following description of specific embodiments given by way of illustration and not limitation with reference to the accompanying drawings, in which: FIG. 1A is a perspective view of an embodiment of an antenna device; FIG. 1B is a cross-section view of the embodiment of FIG. 1A; FIG. 2A is a perspective view illustrating a step of manufacturing of the embodiment of FIGS. 1A and 1B; FIG. 2B is a perspective view illustrating another step of manufacturing of the embodiment of FIGS. 1A and 1B; FIG. 2C is a cross-section view illustrating another step of manufacturing of the embodiment of FIGS. 1A and 1B; FIG. 2D is a cross-section view illustrating another step of manufacturing of the embodiment of FIGS. 1A and 1B; FIG. 2E is a cross-section view illustrating another step of manufacturing of the embodiment of FIGS. 1A and 1B; FIG. 3A is a perspective view of another embodiment of an antenna device; FIG. 3B is a cross-section view of the embodiment of FIG. 3A; FIG. 4A is a perspective view of another embodiment of an antenna device; FIG. 4B is a cross-section view of the embodiment of FIG. 4A; FIG. 5A is a perspective view of another embodiment of an antenna device; FIG. 5B is a cross-section view of the embodiment of FIG. 5A; FIG. 5C is an exploded view of the embodiment of FIGS. 5A and 5B; FIG. 6A is a perspective view of another embodiment of an antenna device; FIG. 6B is a cross-section view of the embodiment of FIG. 6A; FIG. 7 is a cross-section view of a variant of the embodiment of FIGS. 6A and 6B FIG. 8 is another cross-section view of a variant of the embodiment of FIGS. 6A and 6B; and FIGS. 9A-9D represent top views of variants of the embodiment of FIGS. 6A and 6B. DETAILED DESCRIPTION Like features have been designated by like references in the various figures. In particular, the structural and/or functional features that are common among the various embodiments may have the same references and may dispose identical structural, dimensional and material properties. For the sake of clarity, only the steps and elements that are useful for an understanding of the embodiments described herein have been illustrated and described in detail. In particular, the applications of the des