US-12627054-B2 - Antenna device

Abstract

A transparent antenna device includes a transparent substrate, an antenna electrode layer, an active device layer, a redistribution structure and a chip. The antenna electrode layer is located on the first surface of the transparent substrate and includes an antenna electrode located in a circuit layout region of the transparent antenna device. The active device layer is located above the second surface of the transparent substrate and includes an active device located in the circuit layout region. The redistribution structure is located on the active device layer and includes a signal line and a pad located in the circuit layout region. The chip is bonded to the pad of the redistribution structure and is located in the circuit layout region. The transparent antenna device has a light transmitting region located next to the circuit layout region.

Inventors

• Zong-Long Jhang
• Hsiu-Yin Cheng
• Yi-Hui Lin

Assignees

• AUO Corporation

Dates

Publication Date

20260512

Application Date

20241029

Priority Date

20240621

Claims (10)

1. 1 . A transparent antenna device, comprising: a transparent substrate having a first surface and a second surface opposite to the first surface; an antenna electrode layer, located on the first surface of the transparent substrate and comprising: an antenna electrode, located in a circuit layout region of the transparent antenna device; an active device layer, located on the second surface of the transparent substrate and comprising: an active device, located in the circuit layout region; a redistribution structure, located on the active device layer and comprising: a signal line and a pad, located in the circuit layout region; and a chip, bonded to the pad of the redistribution structure and located in the circuit layout region, wherein the transparent antenna device has a light transmitting region located next to the circuit layout region, and a transmittance of the light transmitting region is from 35% to 85%.
2. 2 . The transparent antenna device of claim 1 , further comprises: a conductive layer, located between the second surface of the transparent substrate and the active device layer, and comprising: a ground electrode, at least partially overlapping with the antenna electrode and electrically connected to the chip; and a connection electrode, electrically connected to the chip, wherein the ground electrode surrounds the connection electrode; and a conductive through hole, extending from the first surface to the second surface of the transparent substrate, and connected to the antenna electrode and the connection electrode.
3. 3 . The transparent antenna device of claim 2 , wherein a width of the conductive through hole on a side near the antenna electrode is different from a width of the conductive through hole on a side near the connection electrode.
4. 4 . The transparent antenna device of claim 1 , further comprises: a conductive through hole, extending from the pad of the redistribution structure to the first surface of the transparent substrate, wherein the conductive through hole passes through the active device layer and the transparent substrate, and is electrically connected to the antenna electrode and the pad.
5. 5 . The transparent antenna device of claim 1 , further comprises: a conductive layer, located between the second surface of the transparent substrate and the active device layer, and comprising: a ground electrode, at least partially overlapping with the antenna electrode, and electrically connected to the chip, wherein the ground electrode comprises an opening overlapping with the antenna electrode; wherein the redistribution structure further comprises a driving electrode, which overlaps the opening and antenna electrode.
6. 6 . The transparent antenna device of claim 1 , further comprises: an underfill material, located between the chip and the redistribution structure, and surrounding a joint between the chip and the redistribution structure.
7. 7 . The transparent antenna device of claim 1 , wherein the antenna electrode layer further comprises: a first metal mesh, electrically connected to the antenna electrode, wherein a line width to a line pitch of the first metal mesh is in a ratio of 1:1 to 1:50, wherein a first part of the first metal mesh is located in the circuit layout region, and a second part of the first metal mesh is located in the light transmitting region.
8. 8 . The transparent antenna device of claim 1 , further comprises: a conductive layer, located between the second surface of the transparent substrate and the active device layer, and comprising: a ground electrode, at least partially overlapping with the antenna electrode and electrically connected to the chip; and a second metal mesh, connected to the ground electrode, wherein a line width to a line pitch of the second metal mesh is in a ratio of 1:1 to 1:50, wherein the second metal mesh is at least partially located in the light transmitting region.
9. 9 . The transparent antenna device of claim 1 , further comprises: a conductive layer, located between the second surface of the transparent substrate and the active device layer, and comprising: a ground electrode, at least partially overlapping with the antenna electrode and electrically connected to the chip, wherein a width of the ground electrode is greater than a width of the antenna electrode.
10. 10 . The transparent antenna device of claim 1 , wherein the active device layer comprises: a semiconductor channel structure; a first dielectric layer, located on the semiconductor channel structure; a gate electrode, overlapping with the semiconductor channel structure; a plurality of source/drain electrodes, electrically connected to the semiconductor channel structure, wherein the active device comprises the semiconductor channel structure, the gate electrode and the source/drain electrodes; wherein the redistribution structure comprises: a first organic insulating layer, located above the active device layer; a first redistribution layer, located on the first organic insulating layer; a second organic insulating layer, located on the first organic insulating layer, wherein a thickness of the second organic insulating layer is greater than a thickness of the first dielectric layer; and a second redistribution layer, located on the second organic insulating layer and comprising the pad and the signal line.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims the priority benefit of U.S. provisional application Ser. No. 63/606,806, filed on Dec. 6, 2023 and Taiwan application serial no. 113123075, filed on Jun. 21, 2024. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification. BACKGROUND Technical Field The present invention relates to an antenna device. Description of Related Art Wireless communication technology is used everywhere in modern life. For example, smartphones are usually equipped with wireless wide area network (WWAN), digital television broadcasting system (DTV), global positioning system (GPS), wireless local area network (WLAN), near field communication (NFC), long term evolution (LTE) and wireless personal network (WLPN) and other wireless communication technology systems. In addition, the provision of wireless local area network (WLAN) environments in major cities or public spaces has become an essential facility, and many people even establish their own WLANs at home. Wireless communication devices use their built-in antennas to transmit or receive wireless signals. With the advancement of wireless communication technology, many manufacturers are committed to developing more efficient antenna devices. SUMMARY The present invention provides an antenna device, which has a light transmitting region, so users can see the landscape behind the antenna device through the antenna device. At least one embodiment of the present invention provides a transparent antenna device, which includes a transparent substrate, an antenna electrode layer, an active device layer, a redistribution structure and a chip. The transparent substrate has a first surface and a second surface opposite the first surface. The antenna electrode layer is located on the first surface of the transparent substrate and includes an antenna electrode located in a circuit layout region of the transparent antenna device. The active device layer is located above the second surface of the transparent substrate and includes an active device located in the circuit layout region. The redistribution structure is located on the active device layer and includes a signal line and a pad located in the circuit layout region. The chip is bonded to the pad of the redistribution structure and is located in the circuit layout region. The transparent antenna device has a light transmitting region located next to the circuit layout region, and the light transmitting region has a transmittance of 35% to 85%. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of an antenna device according to an embodiment of the present invention. FIGS. 2A to 2L are schematic cross-sectional views of various stages of the manufacturing process of an antenna unit according to an embodiment of the present invention. FIG. 3A is a schematic partial cross-sectional view of an antenna device according to an embodiment of the present invention. FIG. 3B is a schematic partial cross-sectional view of an antenna device according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of an antenna device according to an embodiment of the present invention. FIGS. 5A to 5H are schematic cross-sectional views of various stages of the manufacturing process of an antenna unit according to an embodiment of the present invention. FIG. 6A is a schematic partial cross-sectional view of an antenna device according to an embodiment of the present invention. FIG. 6B is a schematic partial cross-sectional view of an antenna device according to an embodiment of the present invention. FIG. 6C is a schematic partial cross-sectional view of an antenna device according to an embodiment of the present invention. FIG. 6D is a schematic partial cross-sectional view of an antenna device according to an embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of an antenna device according to an embodiment of the present invention. FIGS. 8A to 8C are schematic cross-sectional views of various stages of the manufacturing process of an antenna unit according to an embodiment of the present invention. FIG. 9 is a schematic top view of an antenna device according to an embodiment of the present invention. FIG. 10 is a schematic cross-sectional view of an antenna device according to an embodiment of the present invention. FIG. 11 is a schematic cross-sectional view of an antenna unit according to an embodiment of the present invention. FIG. 12 is a schematic cross-sectional view of an antenna unit according to an embodiment of the present invention. FIG. 13 is a schematic cross-sectional view of an antenna unit according to an embodiment of the present invention. FIG. 14 is a schematic top view of an antenna unit according to an embodiment of the present invention. DESCRIPTION OF THE EMBODIMENTS FIG. 1 is a schematic cross-sectiona