Search

US-12627300-B2 - Method and apparatus for maintaining communication performance in correspondence with internal temperature in electronic device

US12627300B2US 12627300 B2US12627300 B2US 12627300B2US-12627300-B2

Abstract

The electronic device according to an embodiment of the present disclosure can comprise: a communication circuit; an oscillator set to generate a clock related to the communication circuit; a plurality of electronic components arranged in the vicinity of the oscillator; a plurality of temperature sensing devices each corresponding to each of the plurality of electronic components; and a processor. According to one embodiment, the processor can operate to: collect, from the plurality of temperature sensing devices, temperature data related to the plurality of electronic components; predict a temperature change related to the plurality of electronic components on the basis of the collected temperature data; determine, on the basis of the predicted temperature change, a reference electronic component to be referred to in the oscillator clock generation; and control the oscillator clock generation on the basis of temperature data on the determined reference electronic component.

Inventors

  • Kihoon KANG
  • Hyungpil KUM
  • Donghwan SEO
  • Hyeonchang SON
  • Sejeong Oh
  • Jinbae Lee
  • Kyeongmun JO

Assignees

  • SAMSUNG ELECTRONICS CO., LTD.

Dates

Publication Date
20260512
Application Date
20240913
Priority Date
20220315

Claims (20)

  1. 1 . An electronic device comprising: a communication circuit; an oscillator configured to generate a clock corresponding to the communication circuit; a plurality of electronic components adjacent to the oscillator; a plurality of temperature sensing devices corresponding to the plurality of electronic components, respectively; and a processor connected to the communication circuit, the oscillator, the electronic components, and the temperature sensing devices, wherein the processor is configured to: collect, from the plurality of temperature sensing devices, temperature data corresponding to the plurality of electronic components; predict a temperature change corresponding to the plurality of electronic components based on the collected temperature data; determine a reference electronic component to be referred to by the oscillator for clock generation, based on the predicted temperature change; and control the clock generation of the oscillator based on temperature data of the determined reference electronic component.
  2. 2 . The electronic device of claim 1 , wherein the processor is further configured to collect the temperature data from the plurality of temperature sensing devices for each designated sample.
  3. 3 . The electronic device of claim 1 , wherein the processor is further configured to: determine a temperature change trend for each electronic component among the plurality of electronic components based on the temperature data corresponding to each of the plurality of electronic components; and predict a future temperature change for each electronic component among the plurality of electronic components based on the temperature change trend for each electronic component.
  4. 4 . The electronic device of claim 1 , wherein the processor is further configured to determine an electronic component among the plurality of electronic components having a greatest temperature change range as the reference electronic component, based on the predicted temperature change corresponding to each electronic component among the plurality of electronic components.
  5. 5 . The electronic device of claim 1 , wherein the processor is further configured to provide temperature data corresponding to the determined reference electronic component to the oscillator so that the oscillator is configured to generate a clock based on the temperature data of the determined reference electronic component.
  6. 6 . The electronic device of claim 5 , wherein the oscillator is further configured to: predict a future temperature change based on the temperature data from the processor; and generate a clock based on the predicted temperature change.
  7. 7 . The electronic device of claim 1 , wherein the processor is further configured to: control an operation of the oscillator based on first temperature data of a first electronic component having been designated as the reference electronic component; change the reference electronic component based on temperature data corresponding to each electronic component among the plurality of electronic components; and control an operation of the oscillator based on second temperature data of a second electronic component having been changed to a reference electronic component.
  8. 8 . The electronic device of claim 7 , wherein the processor is further configured to: obtain a weight for each electronic component of the plurality of electronic components; determine a weight priority; and determine the second electronic component corresponding to a highest priority weight as a reference electronic component, and wherein the weight is proportional to a difference value between a maximum value and a minimum value in temperature data and inversely proportional to a distance between the oscillator and each of the electronic components.
  9. 9 . The electronic device of claim 8 , wherein the processor is further configured to: obtain the maximum value and the minimum value while shifting samples one sample at a time, the samples having been generated for a predetermined time period with respect to the temperature sensing devices corresponding to the plurality of electronic components, respectively; obtain the difference value based on a difference between the maximum value and the minimum value; obtain a weight for each electronic component among the plurality of electronic components based on the difference value and the distance between each electronic component and the oscillator; and determine a highest weight among the obtained weights for respective electronic components as the highest priority weight.
  10. 10 . The electronic device of claim 7 , wherein the processor is further configured to: determine whether an event corresponding to a change of the reference electronic component has occurred based on the predicted temperature change; and determine a change of the reference electronic component based on a temperature change preceding a temperature change of the oscillator among temperature changes of the plurality of electronic components, and wherein the event comprises an event corresponding to a temperature change preceding a future temperature change of the oscillator among the temperature changes of the plurality of electronic components.
  11. 11 . An operating method of an electronic device, the method comprising: collecting temperature data corresponding to a plurality of electronic components from a plurality of temperature sensing devices corresponding to the plurality of electronic components, respectively; predicting a temperature change with respect to the plurality of electronic components based on the collected temperature data; determining a reference electronic component to be referred to for clock generation of an oscillator based on the predicted temperature change; and controlling clock generation of the oscillator based on temperature data of the determined reference electronic component.
  12. 12 . The method of claim 11 , wherein the predicting of the temperature change comprises: determining a temperature change trend for each electronic component among the plurality of electronic components based on the temperature data corresponding to each electronic component among the plurality of electronic components; and predicting a future temperature change for each electronic component among the plurality of electronic components based on the temperature change trend for each electronic component.
  13. 13 . The method of claim 11 , wherein the determining of the reference electronic component comprises determining an electronic component among the plurality of electronic components having a greatest temperature change range as the reference electronic component, based on the predicted temperature change for each electronic component among the plurality of electronic components.
  14. 14 . The method of claim 11 , wherein the controlling of the clock generation of the oscillator comprises providing temperature data corresponding to the determined reference electronic component to the oscillator so that the oscillator is configured to generate a clock based on the temperature data of the determined reference electronic component.
  15. 15 . The method of claim 11 , further comprising: controlling an operation of the oscillator based on first temperature data of a first electronic component having been designated as the reference electronic component; changing the reference electronic component based on temperature data corresponding to each electronic component among the plurality of electronic components; and controlling an operation of the oscillator based on second temperature data of a second electronic component having been changed to the reference electronic component.
  16. 16 . The method of claim 11 , further comprising collecting the temperature data for each designated sample.
  17. 17 . The method of claim 11 , further comprising: predicting, by an oscillator, a future temperature change based on the temperature data; and generating a clock based on the predicted temperature change.
  18. 18 . The method of claim 15 , further comprising: obtaining a weight for each electronic component of the plurality of electronic components; determining a weight priority; and determining the second electronic component corresponding to a highest priority weight as a reference electronic component, and wherein the weight is proportional to a difference value between a maximum value and a minimum value in temperature data and inversely proportional to a distance between the oscillator and each of the electronic components.
  19. 19 . The method of claim 18 , further comprising: obtaining the maximum value and the minimum value while shifting samples one sample at a time, the samples having been generated for a predetermined time period with respect to the temperature sensing devices corresponding to the plurality of electronic components, respectively; obtaining the difference value based on a difference between the maximum value and the minimum value; obtaining a weight for each electronic component among the plurality of electronic components based on the difference value and the distance between each electronic component and the oscillator; and determining a highest weight among the obtained weights for respective electronic components as the highest priority weight.
  20. 20 . The method of claim 15 , further comprising: determining whether an event corresponding to a change of the reference electronic component has occurred based on the predicted temperature change; and determining a change of the reference electronic component based on a temperature change preceding a temperature change of the oscillator among temperature changes of the plurality of electronic components, and wherein the event comprises an event corresponding to a temperature change preceding a future temperature change of the oscillator among the temperature changes of the plurality of electronic components.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a bypass continuation of International Application No. PCT/KR2023/002434, filed on Feb. 21, 2023, which is based on and claims priority to Korean Patent Application No. 10-2022-0032264, filed on Mar. 15, 2022, and Korean Patent Application No. 10-2022-0097350, filed on Aug. 4, 2022, in the Korean Intellectual Property Office, the disclosures of which are incorporated by reference herein in their entireties. BACKGROUND 1. Field Embodiments of the present disclosure relate to a method and an apparatus for maintaining performance (e.g., communication performance) of an electronic device in correspondence with an internal temperature of the electronic device. 2. Description of Related Art In accordance with development of digital technologies, various types of electronic devices, such as a personal digital assistant (PDA), an electronic notebook, a smartphone, a tablet personal computer (PC), a wearable device and/or a laptop PC, are widely used. These electronic devices have been continuously developed in terms of hardware and/or software of the electronic devices to support and increase functions thereof. Recently, an electronic device uses a sensor (e.g., a thermistor or a temperature sensor) capable of measuring a temperature inside the electronic device to monitor heat generation of the electronic device and provide information (e.g., heat generation information) related to the use of the electronic device, based on a monitoring result. According to an embodiment, an electronic device may include a sensor (e.g., a thermistor) mounted therein through an electronic component (or semiconductor) or an instrument (e.g., a circuit board) to design a semiconductor and measure a temperature of the corresponding electronic component. According to an embodiment, in the electronic device, the thermistor may be designed as a chip and may represent a semiconductor configured to measure (or detect) a temperature using a principle that resistance changes depending on temperature. According to an embodiment, the electronic device may apply a voltage to the thermistor, convert a value according to voltage distribution into an electrical signal, and determine a temperature using the electrical signal through a processor. Furthermore, various services are provided to electronic devices as a result of technology development and wireless network performance improvement. For example, recently, a positioning service using electronic devices has attracted attention. The positioning service may be a general term for identifying a location of user and providing various services based on the location. For example, conventional positioning services may include a location tracking service that tracks a location of a user by tracking a location of an electronic device through a global navigation satellite system (GNSS) and a geofencing service that determines entry or exit from a specific point-of-interest (POI). The GNSS may refer to a system configured to use a satellite and provide information on a location, altitude, and/or speed of an object on the ground. Recently, as electronic devices provide GNSS-based location function services, the importance of GNSS accuracy is emerging. SUMMARY One or more embodiments provide a method and an apparatus for maintaining performance (e.g., communication performance) of an electronic device in correspondence with an internal temperature of the electronic device. One or more embodiments also provide a method and an apparatus for determining an electronic component related to clock occurrence (oscillation or generation) of an oscillator, based on temperature data of various electronic components in an electronic device and operating to cause the oscillator to generate an accurate clock, based on the temperature data of the determined electronic component. One or more embodiments also provide a method and an apparatus for controlling clock generation of an oscillator, based on a temperature of a peripheral heat generation source (e.g., a PMIC, a PAM, a battery, and/or a processor) of the oscillator in an electronic device. One or more embodiments also provide a method and an apparatus for controlling clock generation of an oscillator, based on temperature data related to a peripheral heat generation source of the oscillator and distance data between the peripheral heat generation source and the oscillator. According to an aspect of an embodiment, there is provided an electronic device including a communication circuit, an oscillator configured to generate a clock corresponding to the communication circuit, a plurality of electronic components adjacent to the oscillator, a plurality of temperature sensing devices corresponding to the plurality of electronic components, respectively, and a processor connected to the communication circuit, the oscillator, the electronic components, and the temperature sensing devices, wherein the processor i