US-12627381-B2 - Systems and methods for optical communication on a processor
Abstract
A computing device may include a substrate. A computing device may include a processing unit supported by the substrate. A computing device may include an optical transmitter supported by the substrate and in electrical communication with the processing unit.
Inventors
- Maria Leena Kyllikki VIITANIEMI
- Christian L Belady
- Teresa A. NICK
- Winston Allen SAUNDERS
- Nicholas Andrew KEEHN
- Eric C. Peterson
- Vaidehi ORUGANTI
- Bharath Ramakrishnan
- Husam Atallah ALISSA
Assignees
- MICROSOFT TECHNOLOGY LICENSING, LLC
Dates
- Publication Date
- 20260512
- Application Date
- 20231031
Claims (19)
- 1 . A computing device comprising: a substrate; a processing unit supported by the substrate, the processing unit including: a first die, a second die, and a microfluidic volume positioned between the first die and the second die; and an optical transmitter supported by the substrate and in electrical communication with the processing unit.
- 2 . The computing device of claim 1 , wherein the optical transmitter includes an array of light sources.
- 3 . The computing device of claim 2 , wherein the array of light sources is a two-dimensional array.
- 4 . The computing device of claim 2 , wherein the optical transmitter is configured to transmit an optical signal in a plurality of wavelengths.
- 5 . The computing device of claim 1 further comprising an optical receiver supported by the substrate and in electrical communication with the processing unit.
- 6 . The computing device of claim 1 , wherein the optical transmitter is coupled to the processing unit.
- 7 . The computing device of claim 6 , wherein the optical transmitter is coupled to a lateral surface of the processing unit.
- 8 . The computing device of claim 6 , wherein the optical transmitter is coupled to a top surface of the processing unit.
- 9 . The computing device of claim 1 further comprising an optical element positioned on the optical transmitter and configured to direct an optical signal emitted by the optical transmitter.
- 10 . The computing device of claim 1 further comprising an optical waveguide in optical communication with the optical transmitter.
- 11 . The computing device of claim 10 , wherein the optical waveguide is at least partially embedded in the substrate.
- 12 . The computing device of claim 10 , wherein the optical waveguide is a fiber optic.
- 13 . The computing device of claim 1 , further comprising electrochemical fluid in the microfluidic volume.
- 14 . A computing system comprising: a substrate; a processing unit supported by the substrate; an optical transmitter supported by the substrate and in electrical communication with the processing unit; an optical receiver supported by the substrate and in electrical communication with the processing unit; and a microfluidic volume in the processing unit and configured to receive electrochemical fluid, wherein the processing unit includes a first die and a second die, and the microfluidic volume is positioned at least partially between the first die and the second die.
- 15 . The computing system of claim 14 , wherein the optical receiver is positioned on a lateral surface of the processing unit.
- 16 . The computing system of claim 14 , wherein the optical transmitter is positioned on a lateral surface of the processing unit.
- 17 . The computing system of claim 14 , wherein the optical transmitter is connected to the processing unit by a via embedded in the substrate.
- 18 . The computing system of claim 14 , wherein the optical receiver is connected to the processing unit by a via embedded in the substrate.
- 19 . A computing system comprising: a substrate; a processing unit supported by the substrate, wherein the processing unit includes a first die and a second die; an optical transmitter supported by the processing unit and in electrical communication with the processing unit; an optical receiver supported by the processing unit and in electrical communication with the processing unit; and a microfluidic volume in the processing unit and configured to receive electrochemical fluid and the microfluidic volume is positioned between the first die and the second die.
Description
BACKGROUND Background and Relevant Art Conventional processing units and computing devices communicate with other processing units and computing devices through electrical wires and cabling. As the density of compute resources, such as in server configurations and/or in datacenters, increases, the available space for ports and cabling decreases. BRIEF SUMMARY In some aspects, the techniques described herein relate to a computing device including: a substrate; a processing unit supported by the substrate; and an optical transmitter supported by the substrate and in electrical communication with the processing unit. In some aspects, the techniques described herein relate to a computing system including: a substrate; a processing unit supported by the substrate; an optical transmitter supported by the substrate and in electrical communication with the processing unit; an optical receiver supported by the substrate and in electrical communication with the processing unit; and a microfluidic volume in the processing unit and configured to receive electrochemical fluid. In some aspects, the techniques described herein relate to a computing system including: a substrate; a processing unit supported by the substrate; an optical transmitter supported by the processing unit and in electrical communication with the processing unit; an optical receiver supported by the processing unit and in electrical communication with the processing unit; and a microfluidic volume in the processing unit and configured to receive electrochemical fluid. This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter. Additional features and advantages will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the teachings herein. Features and advantages of the disclosure may be realized and obtained by means of the instruments and combinations particularly pointed out in the appended claims. Features of the present disclosure will become more fully apparent from the following description and appended claims or may be learned by the practice of the disclosure as set forth hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS In order to describe the manner in which the above-recited and other features of the disclosure can be obtained, a more particular description will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. For better understanding, the like elements have been designated by like reference numbers throughout the various accompanying figures. While some of the drawings may be schematic or exaggerated representations of concepts, at least some of the drawings may be drawn to scale. Understanding that the drawings depict some example embodiments, the embodiments will be described and explained with additional specificity and detail through the use of the accompanying drawings in which: FIG. 1-1 is a perspective view of a computing device including a processing unit, according to at least one embodiment of the present disclosure. FIG. 1-2 is a perspective view of a first computing device communicating with a second computing device via optical signals, according to at least one embodiment of the present disclosure. FIG. 2 is a perspective view is a side view of a first computing device and a second computing device arranged in an opposing configuration, according to at least one embodiment of the present disclosure. FIG. 3 is a side cross-sectional view of a computing device including a processing unit on a substrate, according to at least one embodiment of the present disclosure. FIG. 4-1 is a schematic representation of an electrochemical generator, according to at least one embodiment of the present disclosure. FIG. 4-2 is a schematic representation of an electrochemical generation system, according to at least one embodiment of the present disclosure. FIG. 5 is a side cross-sectional view of a stacked die processing unit with a first die and a second die with a microfluidic volume positioned therebetween, according to at least one embodiment of the present disclosure. FIG. 6 is a side cross-sectional view of a computing device with on-die electrochemical generation with an optical transmitter and an optical receiver, according to at least one embodiment of the present disclosure. FIG. 7 is a side cross-sectional view of a computing device with an optical element on the substrate to direct the optical signal emitted therefrom, according to at least one embodiment of the present disclosure. FIG. 8 is a side cross-sectional view of a computing device with a processing unit supporting an optical transmitter and an optical re