US-12627912-B2 - Electronic device including insulating structure for speaker

US12627912B2US 12627912 B2US12627912 B2US 12627912B2US-12627912-B2

Abstract

An electronic device includes: a housing, a speaker, and an enclosure surrounding the speaker, the enclosure including a heat dissipation portion comprising a thermally conductive material facing the speaker and spaced apart from the speaker. The electronic device includes a support disposed between the speaker and the enclosure, the support including a first portion disposed on the speaker, a second portion facing the heat dissipation portion in the enclosure, and a third portion connecting the first portion and the second portion. An area of the first portion may be greater than an area of the second portion.

Inventors

Incheol BAEK
Jungsik Park

Assignees

SAMSUNG ELECTRONICS CO., LTD.

Dates

Publication Date: 20260512
Application Date: 20230804
Priority Date: 20221109

Claims (20)

1 . An electronic device comprising: a speaker configured to output audio; an enclosure enclosing at least a portion of the speaker, the enclosure including a heat dissipation portion thermally connected to a rear plate of the electronic device, wherein the rear plate is thermally conductive; a supporting member contacted with a rear side of the speaker to support the speaker, wherein the supporting member is thermally conductive; and a heat insulating member disposed between the supporting member and the heat dissipation portion of the enclosure and contacted with both the supporting member and the heat dissipation portion of the enclosure, wherein an area of a first portion of the supporting member contacted with the rear side of the speaker is wider than an area of a second portion of the supporting member contacted with the heat insulating member such that a rate of heat flow through the heat insulating member is reduced and an amount of heat transferred to the heat dissipation portion of the enclosure via the heat insulating member is limited.
2 . The electronic device of claim 1 , wherein the heat insulating member is elastic, and wherein the heat insulating member is compressed by the supporting member and the heat dissipation portion.
3 . The electronic device of claim 2 , wherein the supporting member includes a third portion connecting the first portion of the supporting member and the second portion of the supporting member, the third portion having curved shape.
4 . The electronic device of claim 3 , wherein a thickness of the third portion of the supporting member is thinner than at least one of the first portion of the supporting member and the second portion of the supporting member.
5 . The electronic device of claim 1 , wherein the first, second, and third portion of the supporting member defines at least a portion of an air gap configured for increasing a surface area of the supporting member contacted with air.
6 . The electronic device of claim 5 , wherein the first portion of the supporting member includes an opening that allows the rear side of the speaker to be thermally connected with the at least one air gap.
7 . The electronic device of claim 1 , wherein the supporting member has a frustum shape.
8 . The electronic device of claim 1 , wherein the area of the second portion of the supporting member contacting the heat insulating member and facing the heat dissipation portion is wider than an area of the heat insulating member contacting the heat dissipation portion.
9 . The electronic device of claim 1 further comprising: a heat dissipation member, wherein the heat dissipation member includes: a first region disposed between the heat dissipation portion and the rear plate of the electronic device; and a second region extending from the first region and spaced apart from the enclosure, wherein the second region reduces heat transferred from the heat dissipation portion to the rear plate of the electronic device by dissipating at least a portion of heat transferred from the heat dissipation portion to the first region.
10 . The electronic device of claim 9 , wherein the first region overlaps the second portion of the supporting member.
11 . The electronic device of claim 1 , wherein the supporting member further includes rubber, and wherein the rubber is deformable by vibration generated from the speaker when the audio is output.
12 . The electronic device of claim 1 , wherein the enclosure further includes: an audio hole portion defining an audio hole facing the front side of the speaker to provide a path for the audio output from the speaker; and a supporting portion disposed along a periphery of the audio hole portion and supporting the front side of the speaker; and wherein a thickness of the supporting portion is thinner than a distance between the rear side of the speaker and the heat dissipation portion.
13 . The electronic device of claim 12 , wherein the enclosure further includes a resonance space surrounding at least a portion of the speaker configured to resonate the audio output from the speaker, and wherein, the supporting portion of the enclosure seals the resonance space.
14 . The electronic device of claim 1 , wherein a thermal conductivity of the heat dissipation portion is greater than a thermal conductivity of the supporting member.
15 . The electronic device of claim 1 , wherein the heat dissipation portion includes metal.
16 . An electronic device comprising: a speaker configured to output audio; an enclosure surrounding at least a portion of the speaker and including a heat dissipation portion facing a rear side of the speaker, the heat dissipation portion being spaced apart from the rear side of the speaker and including metal; and a supporting member disposed between the rear side of the speaker and the heat dissipation portion of the enclosure, wherein the supporting member includes: a first portion disposed on the rear side of the speaker, a second portion facing the heat dissipation portion, and a third portion connecting the first portion and the second portion, wherein an area of the first portion of the supporting member disposed on the rear side of the speaker is wider than an area of the second portion of the supporting member facing the heat dissipation portion such that a rate of heat flow to the heat dissipation portion through the supporting member is reduced, and wherein the first, second, and third portions of the supporting member define at least a portion of an air gap configured for increasing a surface area of the supporting member contacted with air.
17 . The electronic device of claim 16 , wherein the supporting member has a frustum shape.
18 . The electronic device of claim 16 further comprising: a heat insulating member comprising a thermally insulating material disposed between the supporting member and the heat dissipation portion to reduce heat transferred from the speaker to the heat dissipation portion when the audio is output, wherein the heat insulating member is contacted with both the second portion of the supporting member and the heat dissipation portion.
19 . The electronic device of claim 18 , wherein a rigidity of the supporting member is greater than a rigidity of the heat insulating member, and wherein the heat insulating member is deformable by vibration generated from the speaker when the audio is output.
20 . The electronic device of claim 16 further comprising: a heat dissipation member, wherein the heat dissipation member includes: a first region disposed between the heat dissipation portion and the rear plate of the electronic device; and a second region extending from the first region and spaced apart from the enclosure, wherein the second region reduces heat transferred from the heat dissipation portion to the rear plate of the electronic device by dissipating at least a portion of heat transferred from the heat dissipation portion to the first region.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of International Application No. PCT/KR2023/010694 designating the United States, filed on Jul. 24, 2023, in the Korean Intellectual Property Receiving Office and claiming priority to Korean Patent Application Nos. 10-2022-0149087, filed on Nov. 9, 2022, in the Korean Intellectual Property Office, and 10-2022-0173159, filed on Dec. 12, 2022, in the Korean Intellectual Property Office, the disclosures of each of which are incorporated by reference herein in their entireties. BACKGROUND Field The present disclosure relates to an electronic device including an insulating structure for a speaker. Description of Related Art An electronic device may include a speaker for providing an audio signal to a user. The speaker may be configured to output the audio signal to provide auditory information to the user. Operation of the speaker in the electronic device may cause generation of heat from the speaker. SUMMARY According to an embodiment, an electronic device may include a housing including a first surface on which a display is disposed, and a second surface opposite to the first surface. The electronic device may include a speaker configured to output audio, the speaker including a third surface facing the first surface and a fourth surface facing the second surface and including a yoke. The electronic device may include an enclosure including a heat dissipation portion facing the fourth surface of the speaker and spaced apart from the fourth surface, the enclosure being configured to surround at least a portion of the speaker. The electronic device may include a supporting member disposed between the fourth surface of the speaker and the enclosure, the supporting member including a first portion disposed on the fourth surface, a second portion facing the heat dissipation portion, and a third portion connecting the first portion and the second portion. An area of the first portion disposed on the fourth surface is greater than an area of the second portion facing the heat dissipation portion. According to an embodiment, an electronic device may include: a housing including a first surface and a second surface opposite to the first surface. The electronic device may include a speaker including a third surface facing the first surface, and a fourth surface facing the second surface, the speaker being configured to output audio. The electronic device may include an enclosure including a heat dissipation portion including metal facing the fourth surface of the speaker and spaced apart from the fourth surface, the enclosure being configured to surround at least a portion of the speaker. The electronic device may include a supporting member disposed between the fourth surface of the speaker and the enclosure, the supporting member including a first portion disposed on the fourth surface, a second portion facing the heat dissipation portion, and a third portion connecting the first portion and the second portion. An area of the first portion disposed on the fourth surface is greater than an area of the second portion facing the heat dissipation portion. The third portion of the supporting member may include at least one air gap configured to pass air in the enclosure to reduce heat transferred from the first portion to the second portion. BRIEF DESCRIPTION OF THE DRAWINGS The above and other aspects, features and advantages of certain embodiments of the present disclosure will be more apparent from the following detailed description, taken in conjunction with the accompanying drawings. FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment. FIG. 2 is a diagram illustrating an electronic device according to an embodiment. FIG. 3 is an exploded perspective view of an electronic device according to an embodiment. FIG. 4A is a partially exploded perspective view of an example electronic device. FIG. 4B illustrates an internal structure of an example electronic device. FIG. 5 is a cross-sectional view of an example electronic device for line A-A′ of FIG. 4B. FIGS. 6A, 6B, and 6C illustrates a supporting member of a speaker of an example electronic device. DETAILED DESCRIPTION FIG. 1 is a block diagram of an electronic device in a network environment according to an example of the disclosure. Referring to FIG. 1, an electronic device 101 in a network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or at least one of an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an example, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an example, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an aud