US-12627922-B2 - Speaker module

Abstract

A speaker module includes a casing, a speaker unit and a vibration absorber. The speaker unit has a sound cavity. The speaker unit is disposed on the casing, and the speaker unit includes a first diaphragm. The vibration absorber is disposed in the casing, and the vibration absorber has a second diaphragm. When the first diaphragm vibrates, the airflow generated by the first diaphragm drives the second diaphragm to vibrate, and the vibration direction of the second diaphragm is opposite to the vibration direction of the first diaphragm, so as to absorb the vibration generated by the first diaphragm to the casing.

Inventors

• JIA-REN CHANG
• Ming-Chun Fang
• Ruey-Ching Shyu
• Chien-Chung Chen

Assignees

• ACER INCORPORATED

Dates

Publication Date

20260512

Application Date

20240201

Priority Date

20230824

Claims (18)

1. 1 . A speaker module, comprising: a casing, having a sound cavity; a speaker unit, disposed on the casing, wherein the speaker unit includes a first diaphragm; and a vibration absorber, disposed in the casing, wherein the vibration absorber has a second diaphragm; wherein when the first diaphragm vibrates, airflow generated by the first diaphragm drives the second diaphragm to vibrate, and a vibration direction of the second diaphragm is opposite to a vibration direction of the first diaphragm, so as to absorb the vibration generated by the first diaphragm to the casing; wherein the first diaphragm and the second diaphragm are arranged along a first axis, and when viewed along the first axis, the first diaphragm overlaps the second diaphragm; wherein the casing further includes a support structure and a bottom wall, the support structure is fixedly connected to the bottom wall, and the second diaphragm is movably connected to the support structure, wherein the support structure, the second diaphragm and the bottom wall form a chamber, and the chamber and the sound cavity do not communicate with each other.
2. 2 . The speaker module as claimed in claim 1 , wherein at least one opening is formed on the bottom wall, the at least one opening corresponds to the second diaphragm, and when viewed along the first axis, the at least one opening overlaps the first diaphragm and the second diaphragm; wherein when viewed along the first axis, the at least one opening is formed by the support structure.
3. 3 . The speaker module as claimed in claim 1 , wherein when viewed along a second axis perpendicular to the first axis, a distance between the second diaphragm and the bottom wall along the first axis is greater than or equal to 2 mm.
4. 4 . The speaker module as claimed in claim 1 , wherein a bottom opening is formed on the bottom wall of the casing, and the second diaphragm is disposed in the bottom opening; wherein when viewed along a second axis perpendicular to the first axis, a portion of the second diaphragm overlaps the bottom wall; wherein the vibration absorber further includes a counterweight fixedly connected to a bottom of the second diaphragm, and when viewed along the second axis, a portion of the counterweight overlaps the bottom wall.
5. 5 . The speaker module as claimed in claim 1 , wherein a texture, a shape and an elastic coefficient of the second diaphragm are equal to a texture, a shape and an elastic coefficient of the first diaphragm; wherein the vibration absorber further includes a counterweight fixedly connected to the second diaphragm, and the speaker unit further includes a coil configured to drive the first diaphragm, wherein a total weight of the counterweight and the second diaphragm is equal to a total weight of the first diaphragm and the coil.
6. 6 . A speaker module, comprising: a casing, having a sound cavity; a speaker unit, disposed on the casing, wherein the speaker unit includes a first diaphragm; and a vibration absorber, disposed in the casing, wherein the vibration absorber has a second diaphragm; wherein when the first diaphragm vibrates, airflow generated by the first diaphragm drives the second diaphragm to vibrate, and a vibration direction of the second diaphragm is opposite to a vibration direction of the first diaphragm, so as to absorb the vibration generated by the first diaphragm to the casing; wherein the speaker unit further includes a coil configured to drive the first diaphragm, the first diaphragm and the coil are arranged along a first axis, the first diaphragm and the second diaphragm are arranged along a second axis, and the first axis is perpendicular to the second axis, wherein when viewed along the first axis, the first diaphragm does not overlap the second diaphragm; wherein the casing includes a top wall and a covering member, the speaker unit is disposed on the top wall, and the covering member is fixedly connected to the top wall, wherein when viewed along the first axis, the covering member completely covers the second diaphragm; wherein a texture, a shape, and an elastic coefficient of the second diaphragm are equal to a texture, a shape, and an elastic coefficient of the first diaphragm.
7. 7 . The speaker module as claimed in claim 6 , wherein when viewed along the first axis, the covering member covers half of the first diaphragm; wherein the covering member and the top wall form a sound channel which is connected to the second diaphragm; wherein the sound channel and the sound cavity communicate with each other.
8. 8 . The speaker module as claimed in claim 6 , wherein when viewed along a third axis, an end of the covering member forms a guiding structure, and the third axis is perpendicular to the first axis and the second axis; wherein when viewed along the third axis, the guiding structure has a triangular structure, a bevel structure or an arc structure.
9. 9 . A speaker module, comprising: a casing, having a sound cavity; a speaker unit, disposed on the casing, wherein the speaker unit includes a first diaphragm; and a vibration absorber, disposed in the casing, wherein the vibration absorber has a second diaphragm; wherein when the first diaphragm vibrates, airflow generated by the first diaphragm drives the second diaphragm to vibrate, and a vibration direction of the second diaphragm is opposite to a vibration direction of the first diaphragm, so as to absorb the vibration generated by the first diaphragm to the casing; wherein the casing includes a upper cover and a lower cover, the upper cover and the lower cover are arranged along a first axis, wherein when viewed along the first axis, the first diaphragm and the second diaphragm are staggered from each other, and the first diaphragm does not overlap the second diaphragm.
10. 10 . The speaker module as claimed in claim 9 , wherein the speaker module is disposed on a housing of an electronic device, and a bottom wall of the lower cover is in direct contact with the housing.
11. 11 . The speaker module as claimed in claim 10 , wherein the speaker module further includes two buffer elements which are fixedly connected to opposite sides of the casing, and the two buffer elements are in direct contact with the housing.
12. 12 . The speaker module as claimed in claim 9 , wherein when viewed along a second axis, the sound cavity has a first height, and a second height is formed between a bottom of the speaker unit and the lower cover along the first axis, wherein the ratio of the second height to the first height is less than or equal to 1/10, and the first axis is perpendicular to the second axis.
13. 13 . The speaker module as claimed in claim 12 , wherein when viewed along the second axis, the second diaphragm is disposed on a bottom wall of the lower cover, and along the first axis, there is a gap between the second diaphragm and a housing of an electronic device, and the gap ranges from 1 mm to 2 mm.
14. 14 . The speaker module as claimed in claim 9 , wherein when viewed along the first axis, the first diaphragm and the second diaphragm are arranged along a second axis, and a first width of the first diaphragm along a third axis is greater than or equal to a second width of the second diaphragm along the third axis, wherein the first axis, the second axis and the third axis are perpendicular to each other.
15. 15 . The speaker module as claimed in claim 9 , wherein a resonant frequency of the second diaphragm is less than or equal to 100 Hz, and a weight of the second diaphragm is less than or equal to 1 gram.
16. 16 . The speaker module as claimed in claim 9 , wherein the second diaphragm has a central portion and a peripheral portion, the peripheral portion is circumferentially connected to the central portion, wherein when viewed along the first axis, a ratio of the width of the central portion to a total width of the second diaphragm along a third axis is less than or equal to 0.47, and a ratio of the width of the peripheral portion to the total width of the second diaphragm along the third axis is greater than or equal to 0.264, wherein the third axis is perpendicular to the first axis.
17. 17 . The speaker module as claimed in claim 9 , wherein the second diaphragm has a central portion and a peripheral portion, the peripheral portion is circumferentially connected to the central portion, wherein when viewed along the first axis, a ratio of the width of the central portion to a total width of the second diaphragm along a third axis is less than or equal to 0.5, and a ratio of the width of the peripheral portion to the total width of the second diaphragm along the third axis is greater than or equal to 0.25, wherein the third axis is perpendicular to the first axis.
18. 18 . The speaker module as claimed in claim 9 , wherein a center of the first diaphragm and a center of the second diaphragm are arranged along a second axis, and the second axis is perpendicular to the first axis.

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application claims the benefit of Taiwan Patent Application No. 112131808, filed Aug. 24, 2023, the entirety of which is incorporated by reference herein. BACKGROUND OF THE INVENTION Field of the Disclosure The present disclosure relates to a speaker module, and in particular it relates to a speaker module capable of reducing overall vibration displacement. Description of the Related Art As technology has developed, many of today's electronic devices (such as notebook computers) have become quite popular products. These notebook computers are among the most popular and widespread of today's consumer products. Users can execute various applications on notebook computers to achieve various purposes, such as watching videos, playing games, browsing the web, and reading e-books. Generally speaking, electronic devices such as notebook computers are equipped with at least one speaker module configured to provide sound, including music. However, existing speaker modules generate unnecessary vibration when emitting sound, causing the notebook computer to emit noise. Especially when low-frequency sound effects are emitted, the vibration generated by the speaker module will be particularly obvious, seriously affecting user experience. Therefore, how to design a speaker module that can reduce the noise generated by vibration is a topic that needs to be discussed. BRIEF SUMMARY OF THE INVENTION Accordingly, one objective of the present disclosure is to provide a speaker module to solve the above problems. The present disclosure provides a speaker module including a casing, a speaker unit and a vibration absorber. The speaker unit has a sound cavity. The speaker unit is disposed on the casing, and the speaker unit includes a first diaphragm. The vibration absorber is disposed in the casing, and the vibration absorber has a second diaphragm. When the first diaphragm vibrates, the airflow generated by the first diaphragm drives the second diaphragm to vibrate, and the vibration direction of the second diaphragm is opposite to the vibration direction of the first diaphragm, so as to absorb the vibration generated by the first diaphragm to the casing. BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. FIG. 1 is a schematic diagram of an electronic device 10 according to an embodiment of the present disclosure. FIG. 2 is a three-dimensional schematic diagram of the speaker module 100 according to an embodiment of the present disclosure. FIG. 3 is a schematic diagram of the speaker module 100 in another view according to an embodiment of the present disclosure. FIG. 4 is a schematic cross-sectional view of the speaker module 100 along the line A-A in FIG. 2 according to an embodiment of the present disclosure. FIG. 5 is a schematic cross-sectional view of the speaker module 100A along the line A-A in FIG. 2 according to another embodiment of the present disclosure. FIG. 6 is a schematic three-dimensional diagram of the speaker module 100B in another view according to another embodiment of the present disclosure. FIG. 7 is a chart illustrating the relationship between vibration displacement and frequency of the speaker modules of and a conventional speaker module according to different embodiments of the present disclosure. FIG. 8 is a chart illustrating the relationship between vibration displacement and frequency of the speaker module 100A and a conventional speaker module according to another embodiment of the present disclosure. FIG. 9 is a chart illustrating the relationship between phase and frequency of the first diaphragm 1041 and the second diaphragm 152 according to an embodiment of the present disclosure. FIG. 10 is a chart illustrating the relationship between frequency and sound pressure level of the speaker module 100A and a conventional speaker module according to another embodiment of the present disclosure. FIG. 11 is a chart illustrating the relationship between frequency and impedance of the speaker module 100A and a conventional speaker module according to another embodiment of the present disclosure. FIG. 12 is a chart illustrating the relationship between frequency and distortion ratio of the speaker module 100A and a conventional speaker module according to another embodiment of the present disclosure. FIG. 13 is a schematic cross-sectional view of a speaker module 100C according to another embodiment of the present disclosure. FIG. 14 is a schematic cross-sectional view of a speaker module 100D according to another embodiment of the present disclosure. FIG. 15 is a three-dimensional schematic diagram of a speaker mo