US-12628267-B2 - Microelectronic device package assemblies including stiffener devices, and related microelectronic devices and electronic systems

US12628267B2US 12628267 B2US12628267 B2US 12628267B2US-12628267-B2

Abstract

A microelectronic device package assembly includes a package board and a stiffener device attached to the package board. The package board has a first side and a second side. The stiffener device includes an upper stiffener, a lower stiffener, and one or more damper devices. The upper stiffener is above the first side of the package board and has a die side and a package side. The lower stiffener is interposed between the upper stiffener and the package board and has a damper side and a board side. The lower stiffener includes through-package anchors extending from the board side and through the package board. The one or more damper devices are interposed between and are in contact with each of the upper stiffener and the lower stiffener. Microelectronic devices and electronic systems are also described.

Inventors

Prasad Nagavenkata Nune
Christopher Glancey
Yeow Chon Ong
Hong Wan Ng

Assignees

MICRON TECHNOLOGY, INC.

Dates

Publication Date: 20260512
Application Date: 20240126

Claims (20)

1 . A microelectronic device package assembly, comprising: a package board having a first side and a second side; and a stiffener device attached to the package board and comprising: an upper stiffener above the first side of the package board and having a die side and a package side; a lower stiffener interposed between the upper stiffener and the package board and having a damper side and a board side, the lower stiffener comprising through-package anchors extending from the board side and through the package board; and a damper device interposed between and in contact with each of the upper stiffener and the lower stiffener.
2 . The microelectronic device package assembly of claim 1 , wherein: the package board has a rectangular first form factor aspect ratio; and the stiffener device has a rectangular second form factor aspect ratio greater than the first form factor aspect ratio.
3 . The microelectronic device package assembly of claim 1 , wherein the damper device comprises one or more of piston-containing devices and foam structures.
4 . The microelectronic device package assembly of claim 1 , wherein the damper device comprises one or more of piston-containing devices, each of the piston-containing devices comprising: an enclosure; top stems extending from a first side of the enclosure; a damper fluid within a chamber defined by the enclosure; and a piston partially within the chamber and contacting the damper fluid, the piston comprising a piston rod outwardly extending through and beyond the enclosure and having a connector configured to physically connect the piston rod to a coupling structure of the lower stiffener.
5 . The microelectronic device package assembly of claim 4 , wherein the piston rod comprises a threaded end configured to threadably connect with threading of the coupling structure of the lower stiffener.
6 . The microelectronic device package assembly of claim 1 , wherein the through-package anchors of the lower stiffener include anchor flukes in physical contact with the second side of the package board.
7 . The microelectronic device package assembly of claim 1 , further comprising fasteners extending through the upper stiffener and physically connected to top stems extending from the damper devices.
8 . The microelectronic device package assembly of claim 7 , wherein: the top stems comprise one or more of internally threaded top stems and expansion opening top stems; and the fasteners comprise one or more of externally threaded fasteners and expansion fasteners.
9 . The microelectronic device package assembly of claim 1 , further comprising adhesive material interposed between and in physical contact with the lower stiffener and the package board.
10 . The microelectronic device package assembly of claim 1 , wherein the stiffener device has one of a linear form factor, a cross-shaped form factor, T-bar-shaped form factor, H-bar-shaped form factor and U-bar-shaped form factor.
11 . The microelectronic device package assembly of claim 1 , further comprising an electrical contact array on the first side of the package board, the electrical contact array comprising one of a single rectangular electrical contact array, interspaced electrical contact sub-arrays neighboring at least a portion of the stiffener device, and a racetrack electrical contact array.
12 . A microelectronic device, comprising: a solid-state drive (SSD) memory device on an electrical contact array of a package board; and a package stiffener device above a first side of the package board, the package stiffener device horizontally positioned proximate the SSD memory device and comprising: an upper stiffener above the first side of the package board and including a die side and a package side; a lower stiffener including a damper side and a board side, the lower stiffener comprising through-package anchors vertically extending from the board side and completely through the package board; and a damper device vertically interposed between and physically contacting each of the upper stiffener and the lower stiffener.
13 . The microelectronic device of claim 12 , wherein the electrical contact array comprises one of a single rectangular electrical contact array, interspaced electrical contact sub-arrays straddling at least a portion of the package stiffener device, and a racetrack electrical contact array.
14 . The microelectronic device of claim 12 , wherein the SSD memory device comprises one of a motherboard-mounted device, a package board mounted device, and a memory system card.
15 . The microelectronic device of claim 12 , wherein the damper device of the package stiffener device is threadably connected to at least one of the upper stiffener and the lower stiffener.
16 . The microelectronic device of claim 12 , wherein the damper device of the package stiffener device comprises a foam structure.
17 . The microelectronic device of claim 12 , wherein the damper device of the package stiffener device comprises multiple piston-containing devices physically connected to each of the upper stiffener and the lower stiffener.
18 . The microelectronic device of claim 12 , wherein the upper stiffener of the package stiffener device has one of a rectangular vertical cross-sectional shape and an I-beam vertical cross-sectional shape.
19 . The microelectronic device of claim 18 , wherein the upper stiffener of the package stiffener device has the I-beam vertical cross-sectional shape, the I-beam vertical cross-sectional shape exhibiting one or more of a vertically central lacuna, top flange lacunae, and bottom flange lacunae.
20 . An electronic system, comprising: an input device; an output device; a processor device operably coupled to the input device and the output device; and a memory device package operably coupled to the processor device, and comprising: a solid-state drive (SSD) memory device over an electrical contact array of a package board; a package stiffener device physically attached to the package board and comprising: an upper stiffener; a lower stiffener between the upper stiffener and the package board, the lower stiffener comprising: a main body structure; and anchor structures integral with and vertically extending from the main body structure, the anchor structures physically attached to and vertically extending completely through the package board; and a damper device vertically between and in direct physical contact with each of the upper stiffener and the lower stiffener.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application Ser. No. 63/486,815, filed Feb. 24, 2023, the disclosure of which is hereby incorporated herein in its entirety by this reference. TECHNICAL FIELD The disclosure, in various embodiments, relates generally to the field of printed wiring board design for microelectronic devices. More specifically, the disclosure relates to printed wiring board designs for microelectronic device package assemblies including stiffener devices, a stiffener device including two stiffener structures and dampers between the two stiffener structures, and related to microelectronic devices and electronic systems. BACKGROUND Microelectronic memory devices such as solid state memory drives (SSD) often are subject to shock and vibration due to field use on small computing platforms such as smart phones, tablets, and laptop computers. SSDs are provided as plug-into-motherboard substrate devices, motherboard-mounted devices, or package board mounted devices that may couple to motherboards as memory system cards. One type of nonvolatile memory device is a “not and” (NAND) logic based memory device that is mounted on a motherboard or on a package board. Unfortunately, shock and vibration loading on such package boards, particularly in laptop computing devices or some hand-held computing devices, may result in bond pad cratering (losing planarity) because of significant transient stresses under such bond pads during such dynamic loads. Bending deflection of the boards during dynamic loads, may transfer stress under some bond pads and result in cratering. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A through 1C illustrate simplified, transverse cross-section elevation views at different processing stages of a method of forming a microelectronic device package, in accordance with embodiments of the disclosure. FIG. 2 illustrates a simplified, transverse cross-sectional elevation view of a microelectronic device package, in accordance with embodiments of the disclosure. FIG. 3 illustrates a simplified, transverse cross-sectional elevation view of a microelectronic device package, in accordance with embodiments of the disclosure. FIGS. 4 and 4A illustrate oblique elevation views of microelectronic package substrate stiffener assemblies, in accordance with several embodiments of the disclosure. FIG. 5 illustrates a simplified, cross-section elevation view of different upper stiffener structures, in accordance with embodiments of the disclosure. FIGS. 6A through 6E illustrate simplified top plan views of different microelectronic device package substrate assemblies including stiffener devices, in accordance with embodiments of the disclosure. FIG. 7 is a block diagram of an electronic system, in accordance with embodiments of the disclosure. DETAILED DESCRIPTION The following description provides specific details, such as material compositions, shapes, and sizes, in order to provide a thorough description of embodiments of the disclosure. However, a person of ordinary skill in the art would understand that the embodiments of the disclosure may be practiced without employing these specific details. Indeed, the embodiments of the disclosure may be practiced in conjunction with conventional microelectronic device fabrication techniques employed in the industry. In addition, the description provided below does not form a complete process flow for manufacturing a microelectronic device (e.g., a memory device). The structures described below do not form a complete microelectronic device. Only those process acts and structures necessary to understand the embodiments of the disclosure are described in detail below. Additional acts to form a complete microelectronic device from the structures may be performed by conventional fabrication techniques. Drawings presented herein are for illustrative purposes only, and are not meant to be actual views of any particular material, component, structure, device, or system. Variations from the shapes depicted in the drawings as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments described herein are not to be construed as being limited to the particular shapes or regions as illustrated, but include deviations in shapes that result, for example, from manufacturing. For example, a region illustrated or described as box-shaped may have rough and/or nonlinear features, and a region illustrated or described as round or curved may include some rough and/or linear features. Moreover, sharp angles that are illustrated may be rounded, and vice versa. Thus, the regions illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shape of a region and do not limit the scope of the present claims. The drawings are not necessarily to scale. Additionally, elements common between figures may r