US-12628268-B2 - Conductive film and display panel
Abstract
A conductive film includes a substrate and a conductive layer. The conductive layer is disposed on the substrate and comprises a plurality of wires spaced apart and parallel to each other. At least one of the wires is provided with a stress dispersing structure. The stress dispersing structure is configured to disperse a stress generated when the conductive film is bent. A display panel comprises the conductive film.
Inventors
- Xin Liu
- Hongyuan Xu
- Juncheng Xiao
Assignees
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Dates
- Publication Date
- 20260512
- Application Date
- 20220415
- Priority Date
- 20220328
Claims (19)
- 1 . A conductive film, comprising: a substrate; and a conductive layer disposed on the substrate and comprising a plurality of wires spaced apart and parallel to each other, wherein at least one of the wires is provided with a stress dispersing structure, and the stress dispersing structure is configured to disperse a stress generated when the conductive film is bent; wherein a surface of each of the wires facing the substrate is a curved surface.
- 2 . The conductive film according to claim 1 , wherein the stress dispersing structure comprises: a first stress dispersing structure comprising a plurality of first through holes which are arranged at intervals in an extending direction of the wires and vertically penetrate the at least one of the wires.
- 3 . The conductive film according to claim 2 , wherein the stress dispersing structure further comprises: a second stress dispersing structure comprising a plurality of second through holes which are arranged at intervals in the extending direction of the wires and vertically penetrate the at least one of the wires.
- 4 . The conductive film according to claim 3 , wherein the first through holes and the second through holes are staggered.
- 5 . The conductive film according to claim 3 , wherein a projected shape of each of the first through holes and the second through holes on the substrate is an ellipse, a circle, a rounded triangle, or a rounded rectangle.
- 6 . The conductive film according to claim 1 , wherein the stress dispersing structure comprises a plurality of upper convex parts and a plurality of lower concave parts connected end to end.
- 7 . The conductive film according to claim 1 , further comprising: a protective layer disposed on a surface of the conductive layer away from the substrate.
- 8 . The conductive film according to claim 7 , wherein the protective layer comprises a first protective layer and a second protective layer, the first protective layer is disposed on the surface of the conductive layer away from the substrate, and the second protective layer is disposed on a surface of the first protective layer away from the substrate.
- 9 . The conductive film according to claim 7 , wherein a material of the first protective layer is Sn.
- 10 . The conductive film according to claim 7 , wherein a material of the second protective layer is a waterproof coating.
- 11 . The conductive film according to claim 1 , wherein a material of the substrate is selected from one or more of glass, polyimide, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate.
- 12 . A display panel, comprising: a conductive film configured to electrically connect at least two subcomponents of the display panel and comprising: a substrate; and a conductive layer disposed on the substrate and comprising a plurality of wires spaced apart and parallel to each other, wherein at least one of the wires is provided with a stress dispersing structure, and the stress dispersing structure is configured to disperse a stress generated when the conductive film is bent; wherein a surface of each of the wires facing the substrate is a curved surface.
- 13 . The display panel according to claim 12 , wherein the stress dispersing structure comprises: a first stress dispersing structure comprising a plurality of first through holes which are arranged at intervals in an extending direction of the wires and vertically penetrate the at least one of the wires.
- 14 . The display panel according to claim 13 , wherein the stress dispersing structure further comprises: a second stress dispersing structure comprising a plurality of second through holes which are arranged at intervals in the extending direction of the wires and vertically penetrate the at least one of the wires.
- 15 . The display panel according to claim 14 , wherein the first through holes and the second through holes are staggered.
- 16 . The display panel according to claim 14 , wherein a projected shape of each of the first through holes and the second through holes on the substrate is an ellipse, a circle, a rounded triangle, or a rounded rectangle.
- 17 . The display panel according to claim 12 , wherein the stress dispersing structure comprises a plurality of upper convex parts and a plurality of lower concave parts connected end to end.
- 18 . The display panel according to claim 12 , wherein the conductive film further comprises: a protective layer disposed on a surface of the conductive layer away from the substrate.
- 19 . The display panel according to claim 12 , wherein the conductive film is a chip on film (COF) or a flexible printed circuit (FPC).
Description
RELATED APPLICATIONS This application is a National Phase of PCT Patent Application No. PCT/CN2022/087026 having International filing date of Apr. 15, 2022, which claims the benefit of priority of Chinese Patent Application No. 202210314291.6 filed on Mar. 28, 2022. The contents of the above applications are all incorporated by reference as if fully set forth herein in their entirety. FIELD AND BACKGROUND OF THE INVENTION The present disclosure relates to the technical field of display, and particularly to a conductive film and a display panel. Light-emitting diodes (LEDs) are common light-emitting devices that emit light through energy released by recombination of electrons and holes, and are widely used in the field of lighting. Mini-LEDs are new LED display technology derived from small-pitch LEDs, also known as sub-millimeter light-emitting diodes. Mini-LEDs are a leading display technology in the industry. Mini-LEDs with multi-zone local dimming technology can achieve a high dynamic contrast ratio. Mini-LEDs with high color gamut have a display effect comparable to that of organic light-emitting diodes (OLEDs), and have inherent advantages over organic light-emitting diodes in terms of service life. Currently, with development of Mini-LED direct-display large-screen technology, for better visual effects, requirements for seams between single panels are getting higher, and gradually tend to zero seam technology. Bending properties of conductive films play a key role in zero seam technology. The bending properties of current conductive films are low, and problems such as cracks are prone to occur during a bending process. SUMMARY OF THE INVENTION A purpose of the present disclosure is to provide a conductive film and a display panel, which can solve a problem that current conductive films are prone to cracks during a bending process due to their low bending properties. In order to solve the above problem, the present disclosure provides a conductive film comprising a substrate and a conductive layer. The conductive layer is disposed on the substrate and comprises a plurality of wires spaced apart and parallel to each other. At least one of the wires is provided with a stress dispersing structure. The stress dispersing structure is configured to disperse a stress generated when the conductive film is bent. In an embodiment, a surface of each of the wires facing the substrate is a flat surface. In an embodiment, the stress dispersing structure comprises a first stress dispersing structure. The first stress dispersing structure comprises a plurality of first through holes arranged at intervals in an extending direction of the wires and vertically penetrating the at least one of the wires. In an embodiment, the stress dispersing structure further comprises a second stress dispersing structure. The second stress dispersing structure comprises a plurality of second through holes arranged at intervals in the extending direction of the wires and vertically penetrating the at least one of the wires. In an embodiment, the first through holes and the second through holes are staggered. In an embodiment, a projected shape of each of the first through holes and the second through holes on the substrate is an ellipse, a circle, a rounded triangle, or a rounded rectangle. In an embodiment, a surface of each of the wires facing the substrate is a curved surface. In an embodiment, the stress dispersing structure comprises a plurality of upper convex parts and a plurality of lower concave parts connected end to end. In an embodiment, the conductive film further comprises a protective layer disposed on a surface of the conductive layer away from the substrate. In order to solve the above problem, the present disclosure further provides a display panel comprising the conductive film provided by the present disclosure. The conductive film is configured to electrically connect at least two subcomponents of the display panel. The conductive film is a chip on film (COF) or a flexible printed circuit (FPC). In the present disclosure, at least one of the wires is provided with the stress dispersing structure. The stress dispersing structure disperses the stress generated when the conductive film is bent, which prevents cracks in the wires, inhibits spread of cracks, improves bending resistance of the conductive film, and prolongs a service life of the conductive film. BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS In order to more clearly illustrate technical solutions in embodiments of the present disclosure, a brief description of accompanying drawings used in a description of the embodiments of the present disclosure will be given below. Obviously, the accompanying drawings in the following description are merely some embodiments of the present disclosure. For those skilled in the art, other drawings may be obtained from these accompanying drawings without creative labor. FIG. 1 is a schematic plan view of a conductive