US-12628273-B2 - Flexible circuit tape and flexible circuit board thereof

US12628273B2US 12628273 B2US12628273 B2US 12628273B2US-12628273-B2

Abstract

A flexible circuit tape includes flexible circuit boards each including a substrate unit and a circuit unit. The circuit unit is disposed on a routing region of the substrate unit and includes circuit lines each having an inner lead and an outer lead. A second width between the two outermost outer leads accounts for 60.00-99.00% of a first width of the substrate unit. The first width is greater than or equal to 80 mm such that number of outer leads can be increased.

Inventors

Chih-Hsiung Hu
Chun-Te Lee
Shyh-Jen Guo

Assignees

CHIPBOND TECHNOLOGY CORPORATION

Dates

Publication Date: 20260512
Application Date: 20240710
Priority Date: 20230825

Claims (18)

1 . A flexible circuit tape comprising: a flexible carrier including a plurality of substrate units arranged in a first direction for transporting the flexible carrier, each of the plurality of substrate units includes a first side, a second side and a routing region which is located between the first and second sides in a second direction perpendicular to the first direction; and a circuit layer including a plurality of circuit units disposed on the routing region, a flexible circuit board includes one of the plurality of substrate units and one of the plurality of circuit units, each of the plurality of circuit units includes a plurality of first circuit lines each having a first inner lead and a first outer lead, the first inner lead is located on a chip mounting area within the routing region, the first outer lead is located outside the chip mounting area, wherein a first width between the first and second sides of each of the plurality of substrate units is greater than or equal to 80 mm in the second direction, and a second width from the first outer lead adjacent to the first side to the first outer lead adjacent to the second side accounts for 60.00-99.00% of the first width.
2 . The flexible circuit tape in accordance with claim 1 , wherein a first space between the first outer lead of the adjacent first circuit lines is less than or equal to 25 um in the second direction.
3 . The flexible circuit tape in accordance with claim 2 , wherein a width of the first outer lead is less than or equal to 25 um in the second direction.
4 . The flexible circuit tape in accordance with claim 3 , wherein a first thickness of each of the plurality of first circuit lines is less than or equal to 12 um.
5 . The flexible circuit tape in accordance with claim 4 , wherein a second thickness of the flexible carrier is less than or equal to 38 um.
6 . The flexible circuit tape in accordance with claim 1 , wherein each of the plurality of substrate units further includes a first transport region and a second transport region, the first transport region is located between the routing region and the first side, and the second transport region is located between the routing region and the second side in the second direction.
7 . The flexible circuit tape in accordance with claim 6 , wherein each of the plurality of substrate units further includes a third side, a fourth side, a third transport region and a fourth transport region, the third transport region is located between the first and third sides and the fourth transport region is located between the second and fourth sides in the second direction, a third width between the third and fourth sides is greater than or equal to 125 mm in the second direction, and the first width accounts for 50.00-98.00% of the third width.
8 . The flexible circuit tape in accordance with claim 1 , wherein each of the plurality of circuit units further includes a plurality of second circuit lines, the chip mounting area is located between the plurality of first and second circuit lines in the first direction, each of the plurality of second circuit lines includes a second inner lead located on the chip mounting area and a second outer lead located outside the chip mounting area, a fourth width from the second outer lead adjacent to the first side to the second outer lead adjacent to the second side accounts for 30.00-99.00% of the first width.
9 . The flexible circuit tape in accordance with claim 8 , wherein a first space between the first outer lead of the adjacent first circuit lines is less than or equal to 25 um in the second direction, and a second space between the second outer lead of the adjacent second circuit lines is greater than or equal to the first space.
10 . The flexible circuit tape in accordance with claim 1 , wherein the first and second sides are cutting sides of each of the plurality of substrate units.
11 . A flexible circuit board comprising: a substrate unit of a flexible carrier including a first side, a second side and a routing region which is located between the first and second sides in a second direction perpendicular to a first direction for transporting the flexible carrier; and a circuit unit disposed on the routing region and including a plurality of first circuit lines, each of the plurality of first circuit lines includes a first inner lead and a first outer lead, the first inner lead is located on a chip mounting area within the routing region, the first outer lead is located outside the chip mounting area, wherein a first width between the first and second sides of the substrate unit is greater than or equal to 80 mm in the second direction, and a second width from the first outer lead adjacent to the first side to the first outer lead adjacent to the second side accounts for 60.00-99.00% of the first width.
12 . The flexible circuit board in accordance with claim 11 , wherein a first space between the first outer lead of the adjacent first circuit lines is less than or equal to 25 um in the second direction.
13 . The flexible circuit board in accordance with claim 12 , wherein a width of the first outer lead is less than or equal to 25 um in the second direction.
14 . The flexible circuit board in accordance with claim 13 , wherein a first thickness of each of the plurality of first circuit lines is less than or equal to 12 um.
15 . The flexible circuit board in accordance with claim 14 , wherein a second thickness of the flexible carrier is less than or equal to 38 um.
16 . The flexible circuit board in accordance with claim 11 , wherein the circuit unit further includes a plurality of second circuit lines, the chip mounting area is located between the plurality of first and second circuit lines in the first direction, each of the plurality of second circuit lines includes a second inner lead located on the chip mounting area and a second outer lead located outside the chip mounting area, a fourth width from the second outer lead adjacent to the first side to the second outer lead adjacent to the second side accounts for 30.00-99.00% of the first width.
17 . The flexible circuit board in accordance with claim 16 , wherein a first space between the first outer lead of the adjacent first circuit lines is less than or equal to 25 um in the second direction, and a second space between the second outer lead of the adjacent second circuit lines is greater than or equal to the first space.
18 . The flexible circuit board in accordance with claim 11 , wherein the first and second sides are cutting sides of the substrate unit.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to R.O.C patent application No. 112209155 filed Aug. 25, 2023, the disclosure of which is hereby incorporated by reference in its entirety. FIELD OF THE INVENTION This invention relates to a flexible circuit tape and flexible circuit board, and more particularly to a flexible circuit tape and flexible circuit board with more circuit lines and outer leads. BACKGROUND OF THE INVENTION In conventional display, a circuit board is electrically connected to a display panel via a flexible circuit board, and a driver IC mounted on the flexible circuit board is used to control LEDs on the display panel. More LEDs with smaller size are necessary for minimization requirement of electronic product. More than one flexible circuit board is required to be electrically connected to the display panel for the more LEDs. However, assembly process and electronic control become difficult while bonding multiple flexible circuit boards to the display panel. In addition, due to restricted space in the electronic product, the flexible circuit boards may be over-bent and separate from the display panel to lower yield or reliability of the display. SUMMARY OF THE INVENTION One object of the present invention is to provide a flexible circuit tape and a flexible circuit board. Width of a substrate unit can be increased and width between two outermost outer leads of a circuit unit accounts for 60.00-99.00% of the width of the substrate unit such that more outer leads can be arranged on the circuit unit to be conformity with numbers of contacts of an external electronic component (e.g. display panel) for electrical connection of the flexible circuit board and the external electronic component. A flexible circuit tape of the present invention includes a flexible carrier and a circuit layer. The flexible carrier includes substrate units arranged in a first direction for transporting the flexible carrier, each of the substrate units includes a first side, a second side and a routing region which is located between the first and second sides in a second direction perpendicular to the first direction. The circuit layer includes circuit units disposed on the routing region, and a flexible circuit board involves one of the substrate units and one of the circuit units. Each of the circuit units includes first circuit lines each having a first inner lead and a first outer lead, the first inner lead is located on a chip mounting area within the routing region, the first outer lead is located outside the chip mounting area. A first width between the first and second sides of each of the substrate units in the second direction is greater than or equal to 80 mm, and a second width from the first outer lead adjacent to the first side to the first outer lead adjacent to the second side accounts for 60.00-99.00% of the first width. A flexible circuit board of the present invention includes a substrate unit and a circuit unit. The substrate unit includes a first side, a second side and a routing region which is located between the first and second sides in a second direction perpendicular to a first direction. The circuit unit is disposed on the routing region and includes first circuit lines each having a first inner lead and a first outer lead. The first inner lead is located on a chip mounting area within the routing region, and the first outer lead is located outside the chip mounting area. A first width between the first and second sides of the substrate unit in the second direction is greater than or equal to 80 mm, and a second width from the first outer lead adjacent to the first side to the first outer lead adjacent to the second side accounts for 60.00-99.00% of the first width. In the present invention, the first width of the substrate unit can be increased to allow more first outer leads to be arranged on the circuit unit such that numbers of the first outer leads on the flexible circuit board can be conformity with numbers of contacts on an external electronic component, e.g. display panel, and the flexible circuit board can be electrically connected to the external electronic component. Furthermore, difficulty of assembly and electricity control can be reduced during bonding the flexible circuit board with the display panel to allow the flexible circuit board to be put in an electronic product easily. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is top view diagram illustrating a flexible circuit tape in accordance with one embodiment of the present invention. FIG. 2 is a top view diagram illustrating a flexible circuit board in accordance with first embodiment of the present invention. FIG. 3 is a top view diagram illustrating a flexible circuit board in accordance with second embodiment of the present invention. FIG. 4 is a cross-section view diagram illustrating a flexible circuit board in accordance with one embodiment of the present invention. FIG. 5 is a cross-section vi