US-12628279-B2 - Conductive module

Abstract

A conductive module includes: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a first potting agent that covers a connection part between the electronic component and the flexible printed wiring board; and a second potting agent that overlaps the first potting agent from the opposite side of the flexible printed wiring board, and covers the first potting agent and the electronic component. The first potting agent has higher flexibility as compared with the second potting agent.

Inventors

• Hidehiko Shimizu

Assignees

• YAZAKI CORPORATION

Dates

Publication Date

20260512

Application Date

20230519

Priority Date

20220526

Claims (8)

1. 1 . A conductive module comprising: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a first potting agent that covers a connection part between the electronic component and the flexible printed wiring board; and a second potting agent that directly contacts and overlaps the first potting agent from the opposite side of the flexible printed wiring board, and covers the first potting agent and the electronic component, wherein the first potting agent has higher flexibility as compared with the second potting agent.
2. 2 . The conductive module according to claim 1 , wherein the first potting agent integrally covers the connection part and the electronic component.
3. 3 . The conductive module according to claim 2 , further comprising: a metal plate that includes a frame part surrounding the electronic component and being fixed to the flexible printed wiring board, wherein a region surrounded by the frame part is filled with the first potting agent and the second potting agent.
4. 4 . The conductive module according to claim 3 , wherein the first potting agent is filled to cover the entire region surrounded by the frame part in a plan view to form a first potting layer, and the second potting agent is filled to overlap the first potting layer to form a second potting layer.
5. 5 . The conductive module according to claim 3 , wherein the metal plate is a conductive busbar including a connection part fixed to a battery cell, the connection part projects from the frame part toward a lateral side of the flexible printed wiring board, and the frame part is connected to the circuit pattern.
6. 6 . The conductive module according to claim 1 , further comprising: a metal plate that includes a frame part surrounding the electronic component and being fixed to the flexible printed wiring board, wherein a region surrounded by the frame part is filled with the first potting agent and the second potting agent.
7. 7 . The conductive module according to claim 6 , wherein the first potting agent is filled to cover the entire region surrounded by the frame part in a plan view to form a first potting layer, and the second potting agent is filled to overlap the first potting layer to form a second potting layer.
8. 8 . The conductive module according to claim 6 , wherein the metal plate is a conductive busbar including a connection part fixed to a battery cell, the connection part projects from the frame part toward a lateral side of the flexible printed wiring board, and the frame part is connected to the circuit pattern.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) The present application claims priority to and incorporates by reference the entire contents of Japanese Patent Application No. 2022-085747 filed in Japan on May 26, 2022. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive module. 2. Description of the Related Art In the related art, there is known a conductive module including a flexible printed wiring board. Japanese Patent Application Laid-open No. 2002-093995 discloses a technique of configuring a power circuit board in which each busbar made of a metallic body is arranged on a surface of a metal board via a flexible board, an IGBT is connected to each busbar, and a three-phase inverter circuit is mounted. In the conductive module in which an electronic component is mounted on the flexible printed wiring board, it is desirable to protect a connection part between the electronic component and the flexible printed wiring board. SUMMARY OF THE INVENTION The present invention aims at providing a conductive module that can protect the connection part between the electronic component and the flexible printed wiring board. In order to achieve the above mentioned object, a conductive module according to one aspect of the present invention includes a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a first potting agent that covers a connection part between the electronic component and the flexible printed wiring board; and a second potting agent that overlaps the first potting agent from the opposite side of the flexible printed wiring board, and covers the first potting agent and the electronic component, wherein the first potting agent has higher flexibility as compared with the second potting agent. The above and other objects, features, advantages and technical and industrial significance of this invention will be better understood by reading the following detailed description of presently preferred embodiments of the invention, when considered in connection with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a conductive module according to an embodiment; FIG. 2 is a cross-sectional view of the conductive module according to the embodiment; FIG. 3 is a plan view of the conductive module before a potting layer is formed; FIG. 4 is a plan view of the conductive module to which a metal plate is attached; FIG. 5 is a plan view of the conductive module to which a first potting agent is applied; FIG. 6 is a cross-sectional view of the conductive module to which the first potting agent is applied; FIG. 7 is a plan view of the conductive module to which the first potting agent is applied; FIG. 8 is a cross-sectional view of the conductive module to which the first potting agent is applied; FIG. 9 is a cross-sectional view of the conductive module according to the embodiment; FIG. 10 is a cross-sectional view of the conductive module according to the embodiment; and FIG. 11 is a plan view of the conductive module according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following describes a conductive module according to an embodiment of the present invention in detail with reference to the drawings. The present invention is not limited to the embodiment. Constituent elements in the following embodiment encompass a constituent element that is easily conceivable by those skilled in the art, or substantially the same constituent element. Embodiment With reference to FIG. 1 to FIG. 11, the following describes the embodiment. The present embodiment relates to a conductive module. FIG. 1 is a plan view of the conductive module according to the embodiment, FIG. 2 is a cross-sectional view of the conductive module according to the embodiment, FIG. 3 is a plan view of the conductive module before a potting layer is formed, FIG. 4 is a plan view of the conductive module to which a metal plate is attached, FIG. 5 is a plan view of the conductive module to which the first potting agent is applied, FIG. 6 is a cross-sectional view of the conductive module to which the first potting agent is applied, FIG. 7 is a plan view of the conductive module to which the first potting agent is applied, FIG. 8 is a cross-sectional view of the conductive module to which the first potting agent is applied, FIG. 9 and FIG. 10 are cross-sectional views of the conductive module according to the embodiment, and FIG. 11 is a plan view of the conductive module according to the embodiment. FIG. 2 illustrates a II-II cross section of FIG. 1. FIG. 6 illustrates a VI-VI cross section of FIG. 5. FIG. 8 illustrates a VIII-VIII cross section of FIG. 7. As illustrated in FIG. 1 and FIG. 2, a conductive module 1 according to the present embodiment includes a flexible printed wiring board 2, an electronic component 3, a metal