US-12628282-B2 - Method of manufacturing circuit board

US12628282B2US 12628282 B2US12628282 B2US 12628282B2US-12628282-B2

Abstract

A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Inventors

FU-YUN SHEN
MING-JAAN HO
Hsiao-Ting Hsu
Lin-Jie Gao

Assignees

QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
AVARY HOLDING (SHENZHEN) CO., LIMITED.

Dates

Publication Date: 20260512
Application Date: 20220815
Priority Date: 20181030

Claims (3)

1 . A method for manufacturing a circuit board, comprising: providing a single-sided board comprising a first insulating base, a copper layer covering a surface of the first insulating base, at least one first through hole each passing through the first insulating base to expose the copper layer, and at least one first conductive structure each infilled in one of the at least one first through hole; forming at least one middle structure, each of the middle structure being formed by: providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base arranged in that sequence; forming a wiring layer by the metal layer, the wiring layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base to expose one of the at least one connecting pad; and forming a second conductive structure infilled in each of the at least one second through hole, wherein the laminated board is formed by: providing the second insulating base, and roughening a surface of the second insulating base; forming a seed layer on the roughened surface of the second insulating base; forming a metal thickening layer on a surface of the seed layer facing away from the second insulating base, the seed layer and the metal thickening layer forming the metal shielding layer; forming the third insulating base on a surface of the metal shielding layer facing away from the second insulating base; and forming the metal layer on a surface of the third insulating base facing away from the metal shielding layer, thereby obtaining the laminated board; providing a double-sided board comprising a wiring layer, a fourth insulating base, and a first copper foil arranged in that sequence, the wiring layer of the double-sided board comprising at least one signal wire and at least one connecting pad, the double-sided board further comprising at least one third conductive structure each connecting one of the at least one connecting pad and the first copper foil of the double-sided board; and pressing the single-sided board, the at least one middle structure, and the double-sided board in that sequence to form the circuit board; wherein each of the at least one first conductive structure connects one of the at least one connecting pad of an adjacent middle structure, each of the at least one connecting pad of the double-sided board connects one second conductive structure of the adjacent middle structure; when the circuit board comprises at least two adjacent middle structures, the two adjacent middle structures connect with each other by connecting the second conductive structure of one of the adjacent middle structures with the corresponding connecting pad of the adjacent middle structure.
2 . The method of claim 1 , wherein each of the wiring layer in the laminated board and in the double-sided board comprises the at least one signal wire and at least two connecting pads, the at least one signal wire being located between the at least two connecting pads of each wiring layer.
3 . The method of claim 1 , wherein forming the at least one middle structure further comprising: before defining the second through hole, pressing an insulating removable layer on a surface of the second insulating base facing away from the metal shielding layer; defining the second through hole further passing through the insulating removable layer on the second insulating base; and after forming the second conductive structure, removing the insulating removable layer on the second insulating base wherein the second conductive structure protrudes from a surface of the second insulating base facing away from the metal shielding layer.

Description

FIELD The subject matter herein generally relates to a circuit board, especially relates to a method of manufacturing a circuit board. BACKGROUND Signals transmitted by the signal wires of the circuit board are susceptible to electromagnetic interference. At present, at least one shielding layer is pressed on the wiring layer and connects the wiring layer to protect signals transmitted from electromagnetic interference. However, the above-described method requires processes with high accuracy Therefore, there is room for improvement within the art. BRIEF DESCRIPTION OF THE DRAWINGS Implementations of the present disclosure will now be described, by way of embodiments only, with reference to the attached figures. FIG. 1 is a flowchart of a first embodiment of a method for manufacturing a circuit board. FIGS. 2-8 are cross-sectional views of illustrating respective steps of a first embodiment of a method for manufacturing the circuit board. FIG. 9 is a flowchart of an embodiment of a method for manufacturing a single-sided board. FIGS. 10-11 are cross-sectional views of illustrating respective steps of a method for manufacturing the single-sided board. FIG. 12 is a flowchart of an embodiment of a method for manufacturing a laminated board. FIGS. 13-14 are cross-sectional views of illustrating respective steps of a method for manufacturing the laminated board. FIG. 15 is a flowchart of an embodiment of a method for manufacturing a double-sided board. FIGS. 16-17 are cross-sectional views of illustrating respective steps of a method for manufacturing the double-sided board. FIG. 18 is a cross-sectional view of an insulating removable layer applied to form a middle structure of FIG. 6. FIG. 19 is a flowchart of a second embodiment of a method for manufacturing a circuit board. FIGS. 20-24 are cross-sectional views of illustrating respective steps of a second embodiment of a method for manufacturing the circuit board. FIG. 25 is a cross-sectional view of another embodiment of a method for manufacturing the circuit board. FIG. 26 is a cross-sectional view of an embodiment of a circuit board. DETAILED DESCRIPTION It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale, and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like. FIG. 1 illustrates a flowchart of a method in accordance with a first embodiment. The method for manufacturing a circuit board 100a (shown in FIG. 8) is provided by way of embodiments, as there are a variety of ways to carry out the method. Each block shown in FIG. 1 represents one or more processes, methods, or subroutines carried out in the method. Furthermore, the illustrated order of blocks is by example only and the order of the blocks can be changed. Additional blocks may be added or fewer blocks may be utilized, without departing from this disclosure. The method can begin at block 201. At block 201, referring to FIG. 2, a single-sided board 10 is provided. The single-sided board 10 comprises a first insulating base 11 and a copper layer 13 covering a surface of the first insulating base 11. At least one first through hole 101 is defined in the single-sided board 10. Each of the at least one first through hole 101 passes through the first insulating base 11 to expose the copper layer 13. The single-sided board 10 further comprises at least one first conductive structure 15 each fully infilled in the at least one first through hole 101. Each of the at least one first conductive structure 15 may protrude from a surface of the first insulating base 11 facing away from the copper layer 13. At block 202, referring to FIG. 3, a laminated board 20 is provided. The laminated board 20 comprises a metal layer 24, a third insulating base 23, a metal shielding layer 22, and a second insulating base 21 arranged in that sequence. At block 203, referring to FIG. 4, a wiring layer 240 is formed by the metal layer 24 of the laminated board 20, and comprises at least one signal wire 241 and at least o