US-12628285-B2 - External data storage device

US12628285B2US 12628285 B2US12628285 B2US 12628285B2US-12628285-B2

Abstract

The present technology provides an external data storage device comprising: a memory module including a plurality of semiconductor chips suitable for storing data received from an external device; a case including a plurality of surfaces surrounding the memory module; and a case stand suitable for supporting the case in an approximately vertical direction on a ground.

Inventors

Nam Hyeon CHOI
Seung Yeob Baek
Jun Heum BAE
Dong Hae LEE

Assignees

SK Hynix Inc.

Dates

Publication Date: 20260512
Application Date: 20231207
Priority Date: 20230426

Claims (15)

1 . An external data storage device comprising: a memory module including a plurality of semiconductor chips suitable for storing data received from an external device; a case including a plurality of surfaces surrounding the memory module; and a case stand suitable for supporting the case in a vertical direction on a ground, wherein the plurality of surfaces includes: a first planar surface and a second planar surface having the largest sizes among the plurality of surfaces; a first long-side surface and a second long-side surface, which contact the first and second planar surfaces, are parallel in a first direction and face each other; and a first short-side surface and a second short-side surface, which contact the first and second planar surfaces, are parallel in a second direction perpendicular to the first direction and face each other, and wherein the case further includes: a connector hole formed on a first end portion of either the first short-side surface or the second short-side surface, and configured to expose a connector of the memory module; and first and second case coupling portions each having a cylindrically shaped opening formed in a second end of a corresponding long-side surface of the first and second long-side surfaces.
2 . The external data storage device of claim 1 , wherein the case further includes a thermal vent, which is formed in an uppermost surface of the case to dissipate heat generated by the memory module, and wherein the uppermost surface is the farthest from the ground among the surfaces of the case when the case is positioned vertically on the ground by the case stand.
3 . The external data storage device of claim 1 , wherein the case further includes an air inlet, which is formed in a lowermost surface of the case and configured to introduce air into the case, and wherein the lowermost surface is the closest to the ground among the surfaces of the case when the case is positioned vertically on the ground by the case stand.
4 . The external data storage device of claim 1 , wherein the case stand supports the case in the vertical direction on the ground such that the case is positioned in a range between 60 and 90 degrees from the ground.
5 . The external data storage device of claim 2 , wherein an amount of heat that is dissipated through the thermal vent is maximum when the case is positioned at 90 degrees from the ground.
6 . The external data storage device of claim 1 , wherein the case stand includes: a first frame segment having a rod-shape extended in the first direction and including a first stand coupling portion corresponding to the first case coupling portion; a second frame segment having a rod-shape extended in the first direction and including a second stand coupling portion corresponding to the second case coupling portion; and a third frame segment having a rod-shape extended in the second direction and coupling first end portions of the first and second frame segments to each other, and wherein the first and second stand coupling portions are formed in respective second end portions of the first and second frame segments.
7 . The external data storage device of claim 6 , wherein each of lengths of the first and second frame segments is at least 50% of a corresponding length of the first and second long-side surfaces.
8 . The external data storage device of claim 6 , wherein each of the first and second stand coupling portions includes a cylindrically shaped protrusion.
9 . The external data storage device of claim 6 , wherein each of the first and second stand coupling portions includes a through hole.
10 . The external data storage device of claim 6 , wherein the case stand further includes a space for storing a cable, which connects the external device to the memory module through the connector hole.
11 . The external data storage device of claim 9 , further comprising a connecting portion configured to connect the first case coupling portion to the first stand coupling portion and the second case coupling portion to the second stand coupling portion.
12 . The external data storage device of claim 11 , wherein the connecting portion includes a hinge.
13 . The external data storage device of claim 1 , wherein the case stand stably supports the case when the case and the case stand make an angle in a range between 60 and 90 degrees.
14 . The external data storage device of claim 1 , wherein the memory module includes a solid state drive (SSD) module.
15 . An external data storage device comprising: a memory module including a plurality of semiconductor chips suitable for storing data received from an external device; a case including a plurality of surfaces surrounding the memory module; and a case stand suitable for supporting the case in a vertical direction on a ground, wherein the memory module further includes a connector for exchanging data with the external device, wherein the case further includes a connector hole for exposing the connector, and wherein the case stand entirely covers the connector hole when the case and the case stand make an angle of 0 degree.

Description

CROSS-REFERENCE TO RELATED APPLICATION This patent application claims the benefit of priority under 35 U. S. C. § 119(a) to Korean Patent Application No. 10-2023-0054618 filed on Apr. 26, 2023, which is incorporated herein by reference in its entirety. BACKGROUND 1. Field Various embodiments of the present invention relate to an external data storage device, and more particularly to an external data storage device that can be positioned in an approximately vertical direction on the ground, to improve the heat dissipation performance. 2. Discussion of the Related Art An external data storage device has excellent data storage and data transfer performance. However, if the external data storage device is operated for a long time and overheats, its performance may be degraded, or its lifespan may be reduced. As external data storage devices become increasingly miniaturized, heat dissipation performance is becoming increasingly important. SUMMARY Various embodiments of the present invention are directed to an apparatus capable of improving heat dissipation performance. Technical problems to be achieved in the present invention are not limited to the aforementioned technical problems and the other unmentioned technical problems will be clearly understood by those skilled in the art from the following description. Various embodiments of the present invention are directed to providing a memory device, a memory system, a controller included in the memory system, or a data processing system including the memory system. In an embodiment of the present invention, an external data storage device may comprise a memory module including a plurality of semiconductor chips suitable for storing data received from an external device; a case including a plurality of surfaces surrounding the memory module; and a case stand suitable for supporting the case in an approximately vertical direction on a ground. The case may further include a thermal vent, which is formed in an uppermost surface of the case to dissipate heat generated by the memory module, and wherein the uppermost surface may be the farthest from the ground among the surfaces of the case when the case is positioned vertically on the ground by the case stand. The case may further include an air inlet, which is formed in a lowermost surface of the case and configured to introduce air into the case, and wherein the lowermost surface may be the closest to the ground among the surfaces of the case when the case is positioned vertically on the ground by the case stand. In an embodiment of the present invention an external data storage device may comprise: a memory module including a plurality of semiconductor chips including a plurality of memory cell arrays; a case including a plurality of surfaces surrounding the memory module; and a case stand suitable for supporting the case from the ground, wherein an angle formed by the case and the case stand varies with reference to a rotation axis formed by a coupling of the case and the case stand, and wherein a first planar surface and a second planar surface, which have the largest sizes among the plurality of surfaces, are supported from the ground by the case stand. The case may further include a thermal vent, which is formed in an uppermost surface of the case to dissipate heat generated by the memory module, and wherein the uppermost surface is the farthest from the ground among the surfaces of the case when the case is positioned vertically on the ground by the case stand. The case may further include an air inlet, which is formed in a lowermost surface of the case and configured to introduce air into the case, and wherein the lowermost surface is the closest to the ground among the surfaces of the case when the case is positioned vertically on the ground by the case stand. Aspects of the present invention include some embodiments of the present invention. Various embodiments into which technical characteristics of the present invention have been incorporated may be derived and understood by a person having ordinary knowledge in the art based on the detailed description of the present invention. The above aspects of the invention include some of the preferred embodiments of the invention, and various embodiments incorporating the technical features of the invention may be derived and understood by one having ordinary skill in the art from the detailed description of the invention that follows. Furthermore, according to an embodiment of the present invention, the external data storage device may be used by standing approximately vertically on the ground to improve the heat dissipation performance by utilizing thermal radiation and the convection phenomenon. To improve the heat dissipation performance by utilizing thermal radiation and the convection phenomenon, the embodiments of the present invention may provide an external data storage device in which a thermal vent is formed. To improve the heat dissipation performance b