US-12628299-B2 - Structure of electronic apparatus and method for assembling electronic apparatus

Abstract

According to the present disclosure, an electronic apparatus comprises: a heat radiation member including a main body portion having a plate shape; an upper circuit board provided on a front surface portion of the main body portion; a lower circuit board provided on a rear surface portion of the main body portion; and a housing having a bottomed box shape in which the main body portion, the upper circuit board, and the lower circuit board are housed, wherein a guide portion is formed on the housing, and the guide portion guides the main body portion to a position in which contact between the lower circuit board and the housing is avoided when the main body portion is inserted from a through-hole of a wall surface portion of the housing into the housing in a state where the lower circuit board is attached to the main body portion.

Inventors

• Ayumu Iseda

Assignees

• NEC CORPORATION
• NEC PLATFORMS, LTD.

Dates

Publication Date

20260512

Application Date

20220117

Priority Date

20210318

Claims (9)

1. 1 . A structure of an electronic apparatus comprising: a heat radiation member including a main body portion having a plate shape; an upper circuit board provided on a front surface portion of the main body portion; a lower circuit board provided on a rear surface portion of the main body portion; and a housing having a bottomed box shape in which the main body portion, the upper circuit board, and the lower circuit board are housed, wherein a guide portion is formed on the housing, the guide portion guides the main body portion to a position in which contact between the lower circuit board and the housing is avoided when the main body portion is inserted from a through hole of a wall surface portion of the housing into the housing in a state where the lower circuit board is attached to the main body portion, and the upper circuit board is configured to, in a state in which the main body portion is in the housing, attach to the front surface portion of the main body portion.
2. 2 . The structure according to claim 1 , wherein the guide portion includes an inclined surface portion for guiding the main body portion in a direction in which the main body portion is held up when the main body portion is inserted from the through hole into the housing.
3. 3 . The structure according to claim 1 , wherein the guide portion is provided on both sides of the through hole.
4. 4 . The structure according to claim 1 , further comprising a waterproof member provided around the through hole.
5. 5 . The structure according to claim 1 , wherein the heat radiation member uses a heat pipe.
6. 6 . The structure according to claim 1 , further comprising a lid provided on a top portion of the housing.
7. 7 . A method for assembling an electronic apparatus, the method comprising: inserting a main body portion having a plate shape of a heat radiation member from a through hole of a wall surface portion of a housing having a bottomed box shape into the housing in a state where a lower circuit board is attached to a rear surface portion of the main body portion; attaching an upper circuit board to a front surface portion of the main body portion in a state where the main body portion is inserted into the housing; and guiding the main body portion to a position in which contact between the lower circuit board and the housing is avoided, by the main body portion abutting a guide portion of the housing when the main body portion is inserted from the through hole into the housing.
8. 8 . The assembly method according to claim 7 , further comprising guiding the main body portion in a direction in which the main body portion is held up, by the main body portion abutting an inclined surface portion of the guide portion when the main body portion is inserted from the through hole into the housing.
9. 9 . The assembly method according to- claim 7 , further comprising attaching the upper circuit board to the main body portion from above the housing by using an opening of a top portion of the housing.

Description

This application is a National Stage Entry of PCT/JP2022/001279 filed on Jan. 17, 2022, which claims priority from JP Patent Application 2021-044793 filed on Mar. 18, 2021, the contents of all of which are incorporated herein by reference, in their entirety. TECHNICAL FIELD The present disclosure relates to a structure of an electronic apparatus and a method for assembling the electronic apparatus. BACKGROUND ART In an electronic apparatus such as a communication device (for example, a base station device), a heat radiation member that uses a so-called “heat pipe” and includes a main body portion having a substantially plate shape is used. A member (for example, a circuit board) being a target of heat radiation is provided on both surface portions of such a main body portion having the substantially plate shape. The main body portion of the heat radiation member and the member being the target of heat radiation are housed in a housing having a substantially box shape (see, for example, a paragraph and FIG. 4 in PTL 1). CITATION LIST Patent Literature PTL 1: Japanese Unexamined Patent Application Publication No. H05-063385 SUMMARY OF INVENTION Technical Problem In general, when the electronic apparatus as described above is assembled, from a viewpoint of facilitating such assembly, work for vertically flipping the housing with respect to a horizontal plane is required to be made unnecessary. Meanwhile, when the electronic apparatus as described above is assembled, a circuit board may contact the housing, and thus a circuit part mounted on the circuit board may break. From a viewpoint of avoiding occurrence of such breakage, the contact between the circuit board and the housing is required to be avoided. An object of the present disclosure is, in view of the problem described above, to provide a structure and an assembly method that are able to avoid contact of a circuit board with a housing when work for vertically flipping the housing at a time of assembly of an electronic apparatus is made unnecessary. Solution to Problem A structure of an electronic apparatus according to one aspect of the present disclosure includes: a heat radiation member including a main body portion having a plate shape; an upper circuit board provided on a front surface portion of the main body portion; a lower circuit board provided on a rear surface portion of the main body portion; and a housing having a bottomed box shape in which the main body portion, the upper circuit board, and the lower circuit board are housed, wherein a guide portion is formed in the housing, and the guide portion guides the main body portion to a position in which contact between the lower circuit board and the housing is avoided when the main body portion is inserted into the housing from a through hole of a wall surface portion of the housing in a state where the lower circuit board is attached to the main body portion. A method for assembling an electronic apparatus according to one aspect of the present disclosure includes: a step of inserting a main body portion having a plate shape of a heat radiation member from a through hole of a wall surface portion of a housing having a bottomed box shape into the housing in a state where a lower circuit board is attached to a rear surface portion of the main body portion; a step of attaching an upper circuit board to a front surface portion of the main body portion in a state where the main body portion is inserted from the through hole into the housing; and guiding the main body portion to a position in which contact between the lower circuit board and the housing is avoided, by the main body portion abutting a guide portion of the housing when the main body portion is inserted from the through hole into the housing. Advantageous Effects of Invention According to the present disclosure, a structure and an assembly method that are able to avoid contact of a circuit board (particularly, a lower circuit board) with a housing are able to be provided when work for vertically flipping the housing at a time of assembly of an electronic apparatus is made unnecessary. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an explanatory diagram illustrating an overview of a structure of an electronic apparatus according to a first example embodiment. FIG. 2A is an explanatory diagram illustrating a first step in a method for assembling the electronic apparatus according to the first example embodiment. FIG. 2B is an explanatory diagram illustrating a second step in the method for assembling the electronic apparatus according to the first example embodiment. FIG. 2C is an explanatory diagram illustrating a third step in the method for assembling the electronic apparatus according to the first example embodiment. FIG. 2D is an explanatory diagram illustrating a fourth step in the method for assembling the electronic apparatus according to the first example embodiment. FIG. 3 is a perspective view illustrating an example of specific s