US-12628311-B2 - Immersed liquid cooling device

US12628311B2US 12628311 B2US12628311 B2US 12628311B2US-12628311-B2

Abstract

The invention discloses an immersed liquid cooling device, which includes a liquid cooling radiator with a first liquid box at one end thereof combined with the open end of a liquid storage box, so that a heat dissipation radiator pipe set at the other end is immersed in the cooling fluid in the liquid storage box. The liquid storage box is externally equipped with a cooling chip and a heat sink. When the cooling chip is energized, the cooling chip will reduce the cooling fluid in the liquid storage box to a freezing temperature, so that the cooling fluid can quickly cool down the working fluid in the heat dissipation radiator pipe set, thereby preventing the heat dissipation radiator pipe set from being affected by the ambient temperature in its heat dissipation efficiency.

Inventors

Tsung-Hsien Huang

Assignees

Tsung-Hsien Huang

Dates

Publication Date: 20260512
Application Date: 20240327
Priority Date: 20240312

Claims (13)

1 . An immersed liquid cooling device, comprising: a liquid storage box being a metal box with a peripheral wall, a rear wall and a front opening forming a liquid storage chamber, said liquid storage chamber being filled with a cooling fluid; at least one cooling chip, each said cooling chip having a hot surface and an opposing cold surface and being selectively arranged outside said rear wall or said peripheral wall of said liquid storage box with the cold surface thereof selectively attached to the outside of said rear wall or said peripheral wall of said liquid storage box; a heat sink with a base thereof attached to the hot surface of each said cooling chip; a liquid cooling radiator comprising a first liquid box, a second liquid box and a heat dissipation radiator pipe set, said first liquid box being internally divided into a hot liquid chamber and a cold liquid chamber and comprising a box wall provided with a hot liquid inlet and a cold liquid outlet respectively connecting said hot liquid chamber and said cold liquid chamber, said second liquid box comprising a return chamber therein, said heat dissipation radiator pipe set comprising a plurality of first radiator pipes and second radiator pipes, said first radiator pipes and said second radiator pipes having respective one ends thereof respectively connected to said hot liquid chamber and said cold liquid chamber of said first liquid box respective opposite ends thereof connected to said return chamber of said second liquid box; and wherein said second liquid box of said liquid cooling radiator and said heat dissipation radiator pipe set are placed into said liquid storage chamber from said front opening of said liquid storage box, and then the outer peripheral wall of said first liquid box seals said front opening of said liquid storage box, so that said heat dissipation radiator pipe set is immersed in the cooling fluid in said liquid storage box.
2 . The immersed liquid cooling device as claimed in claim 1 , wherein said liquid storage chamber of said liquid storage box has two opposite inner walls thereof respectively provided with two rails; said heat dissipation radiator pipe set has two opposite sides thereof respectively provided with a positioning frame, each said positioning frame being limited between the said two rails on the respective said inner wall of said liquid storage chamber of said liquid storage box.
3 . The immersed liquid cooling device as claimed in claim 2 , wherein each said positioning frame comprises a straight plate fastened to the respective one side of said heat dissipation radiator pipe set, and a plurality of positioning protruding plates perpendicular to said straight plate so that said positioning protruding plates are limited between the respective said two rails.
4 . The immersed liquid cooling device as claimed in claim 2 , wherein each of said rails has a front end surface, and a fitting portion is provided between the front end surfaces of said rails and said front opening of said liquid storage box; said first liquid box is inserted into said front opening with an end surface thereof abutting the said front end surfaces of said rails.
5 . The immersed liquid cooling device as claimed in claim 2 , wherein each of said rails has a front end surface, and a fitting portion is provided between the front end surfaces of said rails and said front opening of said liquid storage box; said first liquid box is inserted into said front opening with an end surface thereof abutting the said front end surfaces of said rails.
6 . The immersed liquid cooling device as claimed in claim 4 , wherein said first liquid box and said front opening of said liquid storage box are welded together.
7 . The immersed liquid cooling device as claimed in claim 1 , wherein one of said rear wall and said peripheral wall of said liquid storage box is provided with at least one groove, each said groove having a groove base; each said cooling chip is embedded in one respective said groove with the cold surface thereof attached to said groove base of the respective said groove.
8 . The immersed liquid cooling device as claimed in claim 6 , wherein the number of said at least one cooling chip is multiple, and the number of said at least one groove located on one of said rear wall and said peripheral wall of said liquid storage box corresponds to the number of said cooling chips.
9 . The immersed liquid cooling device as claimed in claim 1 , wherein said first liquid box comprises a first box body and a first box cover, and said second liquid box comprises a second box body and a second box cover, said first box cover and said second box cover being respectively provided with a plurality of pipe sockets respectively communicating with said first box body and said second box body; said first radiator pipes and said second radiator pipes have respective two ends thereof respectively inserted and welded to said pipe sockets.
10 . The immersed liquid cooling device as claimed in claim 8 , wherein said first box body is internally provided with a hot liquid spacer and a cold liquid spacer arranged in parallel with an insulated space formed between said hot liquid spacer and said cold liquid spacer, the hot liquid spacer is separated from the cold liquid spacer, and wherein said hot liquid spacer and sid cold liquid spacer are separate from said hot liquid chamber and said cold liquid chamber.
11 . The immersed liquid cooling device as claimed in claim 1 , wherein said heat dissipation radiator pipe set further comprises a plurality of radiating fins respective set between each two adjacent said first radiator pipes and said second radiator pipes.
12 . The immersed liquid cooling device as claimed in claim 1 , wherein said heat sink comprises a fan disposed on one side thereof and used to drive cold air flow through said heat sink for heat dissipation.
13 . The immersed liquid cooling device as claimed in claim 1 , wherein said liquid cooling radiator comprises a liquid pump arranged in one of said hot liquid chamber and cold liquid chamber of said first liquid box.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid cooling device used in the field of processor heat dissipation technology, and in particular, to an immersed liquid cooling device that improves the heat dissipation efficiency of the liquid cooling device for the processor through the cooling effect of thermoelectric materials. 2. Description of the Related Art Heat dissipating devices, such as those shown in US20060185378A1 and US20130299139A1, usually have a liquid cooling head for fitting on the surface of the processor, a liquid cooling radiator for heat dissipation, and two liquid pipes connected between the liquid cooling head and the liquid cooling radiator, and a liquid pump drives the working fluid to circulate between the liquid cooling head and the liquid cooling radiator. When the working fluid passes through the liquid cooling head, it takes away the heat of the processor, and then flows into the liquid cooling radiator for heat dissipation, so that the working fluid cools down and then flows to the liquid cooling head. According to this circular flow, heat is dissipated. The structure of a liquid cooling radiator is shown in U.S. Pat. No. 11,774,192 B2, which has a liquid inlet box, a liquid collecting box, a plurality of exhaust pipes and a fan. The liquid inlet box is divided into a hot liquid chamber and a cold liquid chamber by a partition. The wall of the liquid inlet box is provided with a hot liquid inlet and a cold liquid outlet that connect the hot liquid chamber and the cold liquid chamber. The hot liquid inlet and the cold liquid outlet are respectively connected to the liquid cooling head through the above-mentioned liquid pipes. The exhaust pipes are connected between the liquid inlet box and the liquid collection box, and the fans are set outside the exhaust pipes. Therefore, when the high-temperature working fluid enters the liquid inlet box from the hot liquid inlet and flows to the liquid collecting box, and then flows back from the liquid collecting box to the liquid inlet box and cold liquid outlet, and fans are used to supply air to the exhaust pipes for air cooling and heat dissipation, causing the working fluid to cool down. However, the conventional liquid cooling radiator technology that uses fans to dissipate heat from the working fluid is easily affected by the ambient temperature. For example, when the room temperature is too high, the air cooling efficiency of the liquid cooling radiator will decrease, which directly affects the heat dissipation efficiency of the liquid cooling device for the processor. SUMMARY OF THE INVENTION The main object of the present invention is to provide an immersed liquid cooling device. The first liquid box at one end of a liquid cooling radiator is welded and assembled to the open end of a liquid storage box, so that the second liquid box at the other end of the liquid cooling radiator and the heat dissipation radiator pipe set are immersed in the cooling fluid inside the liquid storage box. There is a cooling chip on the outside of the liquid storage box, which cools the cooling fluid in the liquid storage box to a freezing temperature, so that the cooling fluid can quickly cool down the working fluid circulating in the heat dissipation radiator pipe set. This allows the liquid cooling radiator to dissipate heat without being affected by the ambient temperature, thereby improving the heat dissipation efficiency of the liquid cooling device for the processor. Another object of the present invention is to provide an immersed liquid cooling device, which allows the liquid cooling radiator to be stably installed into the liquid storage box through the positioning rails in the liquid storage box and the positioning frame structures on both sides of the liquid cooling radiator. Still another object of the present invention is to provide an immersed liquid cooling device, which improves the internal heat resistance structure of the liquid box at one end of the liquid cooling radiator so that the hot liquid flowing through the hot liquid chamber will not conduct heat to the cold liquid chamber and the cooling liquid will not be heated by the hot liquid in the hot liquid chamber. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic three-dimensional view of the first embodiment of the immersed liquid cooling device of the present invention. FIG. 2 is a front exploded schematic diagram of the first embodiment of the immersed liquid cooling device of the present invention. FIG. 3 is an exploded schematic diagram of the first embodiment of the immersed liquid cooling device according to the present invention. FIG. 4 is a schematic three-dimensional view of the front end of the liquid storage box in FIG. 2 of the present invention. FIG. 5 is an exploded schematic diagram of the liquid cooling radiator in FIG. 2 of the present invention. FIG. 6 is a schematic cross-sectional view of the immersed liqu