US-12628312-B2 - Heat dissipation apparatus, device, rack, and system

US12628312B2US 12628312 B2US12628312 B2US 12628312B2US-12628312-B2

Abstract

A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.

Inventors

Xinhu GONG
Gaoliang XIA

Assignees

HUAWEI TECHNOLOGIES CO., LTD.

Dates

Publication Date: 20260512
Application Date: 20240122

Claims (19)

1 . A heat dissipation apparatus, comprising: a heat-conducting plate, wherein the heat-conducting plate comprises a first surface and a second surface that are opposite to each other, and a liquid channel is disposed on the first surface; a mounting base, wherein an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that comprises the second surface is disposed on the mounting base, and an area of the second surface of the heat-conducting plate is greater than or equal to a surface area of a to-be-heat-dissipated chip, and the second surface is a surface of the heat-conducting plate that is used to conduct heat for the chip; and a pressing plate configured to fasten the heat-conducting plate in the accommodation cavity, wherein the pressing plate is detachably connected to the mounting base, the pressing plate seals the liquid channel disposed on the first surface of the heat-conducting plate to form a sealing cavity accommodating the liquid channel, and a liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.
2 . The heat dissipation apparatus based on claim 1 , wherein the heat-conducting plate further comprises: a substrate configured to be clamped into the accommodation cavity; and a heat dissipation structure disposed on the substrate, wherein the heat dissipation structure is the liquid channel.
3 . The heat dissipation apparatus based on claim 2 , wherein a first position-limiting protrusion is disposed in the accommodation cavity of the mounting base, and a second position-limiting protrusion clamped with the first position-limiting protrusion is disposed on the substrate.
4 . The heat dissipation apparatus based on claim 2 , wherein a position-limiting protrusion is disposed on the substrate, and the position-limiting protrusion abuts against a surface of the mounting base.
5 . The heat dissipation apparatus based on claim 2 , wherein the pressing plate is sealed with and connected to the substrate by a sealing gasket.
6 . The heat dissipation apparatus based on claim 1 , further comprising: a pressing cover, wherein the pressing cover is detachably connected to the mounting base, and the pressing cover is pressed onto the heat-conducting plate.
7 . The heat dissipation apparatus based on claim 6 , wherein the pressing cover presses the liquid outlet connector and the liquid inlet connector onto the pressing plate.
8 . The heat dissipation apparatus based on claim 7 , wherein bosses that are in a one-to-one correspondence with the liquid inlet connector and the liquid outlet connector are disposed on the pressing plate, each boss has a mounting groove, the liquid inlet connector or the liquid outlet connector has a convex shoulder assembled in the mounting groove, and the pressing cover presses the convex shoulder into the mounting groove.
9 . The heat dissipation apparatus based on claim 8 , wherein, when the pressing cover does not tightly press the convex shoulder into the mounting groove, the convex shoulder is configured to rotate relative to the mounting groove.
10 . The heat dissipation apparatus based on claim 9 , wherein a side wall of the mounting groove has a plurality of position-limiting protrusions, and the convex shoulder has a position-limiting groove fitting with each position-limiting protrusion; or the side wall of the mounting groove has a plurality of position-limiting grooves, and the convex shoulder has a position-limiting protrusion fitting with each position-limiting groove.
11 . The heat dissipation apparatus based on claim 6 , wherein a stiffness of the pressing cover is greater than a stiffness of the pressing plate.
12 . The heat dissipation apparatus based on claim 1 , wherein at least one of the liquid inlet connector and the liquid outlet connector is rotationally connected to the pressing plate.
13 . The heat dissipation apparatus based on claim 2 , wherein an accommodation groove that accommodates the heat dissipation structure is disposed on the pressing plate.
14 . The heat dissipation apparatus based on claim 1 , wherein the pressing plate is a rectangle, and the liquid inlet connector and the liquid outlet connector are disposed in a diagonal manner.
15 . The heat dissipation apparatus based on claim 1 , wherein a floating screw configured to connect to a chip is disposed on the mounting base.
16 . The heat dissipation apparatus based on claim 1 , wherein the sealing cavity is filled with liquid that flows in the liquid channel.
17 . The heat dissipation apparatus based on claim 1 , wherein the heat dissipation apparatus is connected to a cooling system, cold liquid in the cooling system enters the sealing cavity of the heat dissipation apparatus, heat generated by the chip is transferred to the liquid by using the heat-conducting plate, the liquid absorbs the heat, and then flows back to the cooling system for cooling.
18 . A device, wherein the device comprises: a mainboard; a chip mounted on the mainboard; and a heat dissipation apparatus comprising: a heat-conducting plate, wherein the heat-conducting plate comprises a first surface and a second surface that are opposite to each other, and a liquid channel is disposed on the first surface; a mounting base, wherein an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that comprises the second surface is disposed on the mounting base; and a pressing plate configured to fasten the heat-conducting plate in the accommodation cavity, wherein the pressing plate is detachably connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, the sealing cavity is configured to accommodate the liquid channel, and a liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate, wherein the heat dissipation apparatus is connected to the mainboard and configured to dissipate heat for the chip.
19 . The device based on claim 18 , wherein the device is connected to a cooling system, the cooling system comprises a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe is sealed with and connected to a liquid inlet connector of the heat dissipation apparatus, the liquid outlet pipe is sealed with and connected to a liquid outlet connector of the heat dissipation apparatus, and the cooling system further comprises: a power apparatus configured to enable liquid to flow in a liquid channel; and a cooling apparatus configured to cool the liquid.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser. No. 17/552,722, filed on Dec. 16, 2021, which is a continuation of International Patent Application No. PCT/CN2019/103899, filed on Aug. 31, 2019. Both of the aforementioned applications are hereby incorporated by reference in their entireties. TECHNICAL FIELD The embodiments relate to the field of heat dissipation technologies, and in particular, to a heat dissipation apparatus, a device, a rack, and a system. BACKGROUND With rapid development of the information technology (IT) field, a computing speed of a chip in a device (for example, a server and a storage device) is becoming faster. However, as a processing capability of the chip is improved, heat generated by the chip also increases. For a conventional device, heat is usually dissipated for the chip in a liquid cooling heat dissipation manner. In the liquid cooling heat dissipation manner, a liquid cooling heat dissipation apparatus needs to be installed on the chip, and heat is dissipated from the chip by circulating liquid inside the heat dissipation apparatus. When the liquid heat dissipation apparatus is assembled, the liquid heat dissipation apparatus usually uses an integrated structure and is fastened to the chip by using a floating screw. However, when the heat dissipation apparatus with the integrated structure is used to perform heat dissipation for chips with different specifications, the apparatus needs to be correspondingly adapted according to a specification of each chip. In addition, a component layout in a device in which the chip is located needs to be considered. SUMMARY The embodiments provide a device, a rack, and a system to improve adaptability of the heat dissipation apparatus. According to a first aspect, the embodiments provide a heat dissipation apparatus. The heat dissipation apparatus is configured to dissipate heat for a chip. The heat dissipation apparatus uses a separated structure and includes a heat-conducting plate, a mounting base, and a pressing plate. The mounting base, the heat-conducting plate, and the pressing plate are disposed in a sandwich laminated manner, and the heat-conducting plate is located between the mounting base and the pressing plate. The heat-conducting plate includes a first surface and a second surface that are disposed opposite to each other, the mounting base is configured to bear the heat-conducting plate, and an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes the second surface is disposed on the mounting base. The heat-conducting plate is used as a main structure of the heat dissipation apparatus, and a liquid channel is disposed on the first surface of the heat-conducting plate and is configured for liquid flowing. The pressing plate is configured to fasten the heat-conducting plate into the accommodation cavity of the mounting base. The pressing plate is detachably connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel. In addition, a liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate. During use, the liquid inlet connector and outlet connector are separately connected to an external pipe. Liquid flows into the liquid channel through the liquid inlet connector to dissipate heat for the chip, and then flows out of the external pipe through the liquid outlet connector to form a circulation. In the foregoing structure, the entire heat dissipation apparatus uses a modularized standard separated structure, and the pressing plate and the mounting base may be made into standard parts. When heat dissipation is performed on chips having different heat dissipation requirements, only a corresponding heat-conducting plate needs to be selected as required, and the mounting base and the pressing plate may still be used. Compared with an integral liquid heat dissipation apparatus, the heat dissipation apparatus eliminates the need to select different liquid heat dissipation apparatuses for different chips, enhances universality, and improves adaptability of the heat dissipation apparatus. In addition, a modularized standard is used to reduce production difficulty of the heat dissipation apparatus and make a manufacturing process easier. In a possible implementation, the heat-conducting plate includes a substrate configured to be clamped into the accommodation cavity, and a heat dissipation structure firmly disposed on the substrate, and the heat dissipation structure is the liquid channel. The substrate and an accommodating groove are relatively fastened through fitting between the substrate and the accommodating groove. In another possible implementation, an accommodation groove that accommodates th