US-12628314-B2 - Integrated heat dissipation module structure

US12628314B2US 12628314 B2US12628314 B2US 12628314B2US-12628314-B2

Abstract

An integrated heat dissipation module structure includes a metallic top cover, a metallic bottom cover, a working space, capillary structures and a working fluid in the working space. The top cover includes oppositely an outer heat-dissipating surface having a plurality of columnar heat dissipation structures protruding therefrom and an inner condensation surface surrounded by a top frame. The inner condensation surface has parallel top grooves. The bottom cover includes oppositely an outer heat-absorption surface having screw holes for locking electronic elements and an inner evaporation surface surrounded by a bottom frame. The inner evaporation surface has parallel bottom grooves, protrusive supporting structures disposed between the bottom grooves, and screw-hole protrusions corresponding to the screw holes. The capillary structures are disposed within the bottom grooves or both the bottom and top grooves. The working fluid is in the working space and the capillary structures.

Inventors

Tien-Lai Wang
Tzu-Yu Wang
Cheng-Yu Wang
Meng-Yu Lee

Assignees

TOP RANK TECHNOLOGY LIMITED

Dates

Publication Date: 20260512
Application Date: 20230502
Priority Date: 20230301

Claims (17)

1 . An integrated heat dissipation module structure, comprising: a metallic top cover, including oppositely an outer heat-dissipating surface and an inner condensation surface, the outer heat-dissipating surface having a plurality of columnar heat dissipation structures protruding therefrom, the inner condensation surface being surrounded by a top frame with a predetermined height, the top frame being furnished with an upper communicative groove, the inner condensation surface having thereon a plurality of top grooves parallel to each other; a metallic bottom cover, including oppositely an outer heat-absorption surface and an inner evaporation surface, the outer heat-absorption surface having thereon a screw hole for locking at least one heat-generating element, the inner evaporation surface being surrounded by a bottom frame with another predetermined height, and the bottom frame is furnished with a lower communicative groove, the inner evaporation surface having thereon a plurality of bottom grooves parallel to each other, a plurality of supporting structures protruding therefrom and disposed individually among the plurality of bottom grooves, and a screw-hole protrusion corresponding to the screw hole, the screw-hole protrusion recessed into the outer heat-absorption surface toward the inner evaporation surface and protruding from the inner evaporation surface but not penetrating through, the screw-hole protrusion being not higher than the supporting structures; a working space, being an airtight space formed by engaging the top frame of the metallic top cover and the bottom frame of the metallic bottom cover with the inner condensation surface of the metallic top cover to face the inner evaporation surface of the metallic bottom cover, the plurality of top grooves to overlap individually the plurality of bottom grooves, the plurality of supporting structures protruding from the inner evaporation surface to contact individually at the inner condensation surface among the plurality of top grooves and providing support to the working space; a vacuum channel being formed by connecting spatially the upper communicative groove and the lower communicative groove so as provide a channel for vacuuming the working space; a plurality of capillary structures, disposed individually inside the plurality of bottom grooves or both top grooves and bottom grooves; and a working fluid, being in the working space and the plurality of capillary structures; wherein the metallic top cover and the plurality of columnar heat dissipation structures are part of a single body made of metal, and the metallic bottom cover, the plurality of supporting structures, and the screw-hole protrusions are part of another single body made of metal.
2 . The integrated heat dissipation module structure of claim 1 , wherein the metallic top cover and the plurality of columnar heat dissipation structures are made as a unified piece from the single body made of metal by a cold-forging process, and the metallic bottom cover, the plurality of supporting structures, and the screw-hole protrusions are also made as a unified piece from the another single body made of metal by the cold-forging process.
3 . The integrated heat dissipation module structure of claim 2 , wherein the metal is pure copper.
4 . The integrated heat dissipation module structure of claim 2 , wherein the metal is pure copper, and each of the metallic top cover and the metallic bottom cover has Vickers hardness not lower than 90 HV.
5 . The integrated heat dissipation module structure of claim 2 , wherein the metal is pure copper, and each of the metallic top cover and the metallic bottom cover has thermal conductivity not lower than 400 W/(m-K).
6 . The integrated heat dissipation module structure of claim 2 , wherein the metal is pure copper, and each of the metallic top cover and the metallic bottom cover has thermal diffusivity not smaller than 90 mm 2 /sec.
7 . The integrated heat dissipation module structure of claim 2 , wherein each of the plurality of supporting structures is a post.
8 . The integrated heat dissipation module structure of claim 2 , wherein the metallic top cover and the metallic bottom cover are engaged firmly by welding.
9 . The integrated heat dissipation module structure of claim 2 , wherein the working fluid is pure water.
10 . The integrated heat dissipation module structure of claim 2 , wherein an air pressure of the working space is less than 1×10 −3 torr.
11 . The integrated heat dissipation module structure of claim 1 , wherein the outer heat-absorption surface of the metallic bottom cover further includes a plurality of screw holes and a plurality of screw-hole protrusions corresponding to the plurality of screw holes, the plurality of screw-hole protrusions recessed into the outer heat-absorption surface toward the inner evaporation surface and protruding therefrom the inner evaporating surface without penetrating through, the plurality of the screw-hole protrusions being not higher than the supporting structures.
12 . An integrated heat dissipation module structure, comprising: a metallic top cover, including oppositely an outer heat-dissipating surface and an inner condensation surface, the outer heat-dissipating surface having a plurality of columnar heat dissipation structures protruding therefrom, the inner condensation surface being surrounded by a top frame with a predetermined height, the top frame being furnished with an upper communicative groove, the inner condensation surface having thereon a plurality of top grooves parallel to each other; a metallic bottom cover, including oppositely an outer heat-absorption surface and an inner evaporation surface, the outer heat-absorption surface having thereon a plurality of screw holes for locking a plurality of heat-generating elements, the inner evaporation surface being surrounded by a bottom frame with another predetermined height, and the bottom frame is furnished with a lower communicative groove, the inner evaporation surface having thereon a plurality of bottom grooves parallel to each other and a plurality of screw-hole protrusions corresponding to the plurality of screw holes, the screw-hole protrusions recessed into the outer heat-absorption surface toward the inner evaporation surface and protruding from the inner evaporation surface but not penetrating through the outer heat-absorption surface and the inner evaporation surface; a working space, being an airtight space formed by engaging the top frame of the metallic top cover and the bottom frame of the metallic bottom cover with the inner condensation surface of the metallic top cover to face the inner evaporation surface of the metallic bottom cover, the plurality of top grooves to overlap individually the plurality of bottom grooves, the plurality of screw-hole protrusions protruding from the inner evaporation surface to contact individually at the inner condensation surface and providing support to the working space; a vacuum channel being formed by connecting spatially the upper communicative groove and the lower communicative groove so as provide a channel for vacuuming the working space; a plurality of capillary structures, disposed individually inside the plurality of bottom grooves or both top grooves and bottom grooves; and a working fluid, being in the working space and the plurality of capillary structures; wherein the metallic top cover and the plurality of columnar heat dissipation structures are part of a single body made of metal, and the metallic bottom cover, the plurality of supporting structures, and the plurality of screw-hole protrusions are part of another single body made of metal.
13 . The integrated heat dissipation module structure of claim 12 , wherein there are at least 10 of the screw holes corresponding to the same number of the screw-hole protrusions.
14 . The integrated heat dissipation module structure of claim 12 , wherein both the metallic top cover and the metallic bottom cover are made of copper.
15 . The integrated heat dissipation module structure of claim 12 , wherein the metallic top cover and the metallic bottom cover are engaged firmly by welding.
16 . The integrated heat dissipation module structure of claim 12 , wherein the working fluid is pure water.
17 . The integrated heat dissipation module structure of claim 12 , wherein an air pressure of the working space is less than 1×10 −3 torr.

Description

CROSS REFERENCE TO RELATED APPLICATION This application claims the benefits of Taiwan application Serial No. 112107211, filed Mar. 1, 2023, the disclosures of which are incorporated by references herein in its entirety. TECHNICAL FIELD The present disclosure relates in general to a heat dissipation module structure, and more particularly to an integrated heat dissipation module structure. BACKGROUND High-power electronic components are new-generation of semiconductor components, especially in the fields of high-speed rail transportation, smart grids or electric vehicles, and have gradually become the mainstream of the applications. For example, an insulated gate bipolar transistor (or IGBT) is used in high-frequency and high-power fields because of its low driving voltage, good ability to withstand high voltage, and high switching frequency. However, the operation of high-power electronic components is inevitably accompanied by the generation of a large amount of heat due to their high power density. If the heat accumulated in the power components cannot be dissipated effectively and in a timely manner, the reliability of electronic components will be greatly affected, which restricts the development of its application. Traditionally, the structure of a heat dissipation module for power elements or chips, such as IBGT/diode, regularly has the power elements or chips welding on one surface of a ceramic substrate covered with metal layers on both sides. The commonly used material of the ceramic substrate are aluminum oxide and aluminum nitride. The metal layers on the substrate are mainly used for fabricating circuit layout, heat conduction and heat dissipation. The other side of the ceramic substrate is welded to one surface of a copper base plate through solder, and the other surface of the copper base plate is then coated with a layer of heat-conducting paste or heat-conducting silicone grease and bonded to a heat sink. When the power components are in operation, a large amount of heat will be simultaneously generated. In the power module with this heat dissipation structure, the generated large amount of heat will be transmitted to the copper base plate through the ceramic substrate. Then, through the thermal conductive paste or thermal grease, the heat will be further transmitted to the heat sink, and rapidly dissipated. However, because of the insufficient heat conduction efficiency of thermal conductive paste or thermal grease, the generated heat cannot be efficiently transferred from the copper base plate to the heat sink and dissipated. It is then accumulated in the copper base plate, resulting in temperature rising. Because of the great difference in thermal expansion coefficient between the ceramic substrate and the copper base plate, the rising temperature will result in different degrees of distortion for the ceramic substrate and copper base plate, making their welding interface being destroyed. The heat conduction is thus hindered, eventually leading the whole component overtemperature and failure. In view of the above problems, industries like Semikron have developed another heat dissipation module, which removes the copper base plate, and allows the ceramic substrate assembled with power components or chips directly bonds to the heat sink through thermal paste or thermal grease. Thus, it can therefore avoid abnormalities caused by differences in thermal expansion coefficients. However, due to the difficulty of processing and the physical properties of the material, most of the heat sink makers use aluminum or aluminum alloys as materials, and adopt extrusion processing to produce heat sinks. It should be noted that the thermal diffusivity of aluminum or aluminum alloy is much smaller than that of copper. Hence, when the small-volume power components rapidly generate great amounts of heat in one spot area, the heat will not spread efficiently to the entire heat sink without the rapid lateral diffusion of the copper base plate. This will make the heat sink unable to exert its maximum heat dissipation efficiency with maximum area. In another heat dissipation module, in order to quickly spread the great amount of high dense, rapidly generated heat to a larger area on the heat sink, the industry replaces the copper base plate with a copper vapor chamber. One surface of the ceramic substrate is welded with heat-generating power elements while the other surface of that is directly welded or bonded on to the heat absorbing surface of a vapor chamber. The heat sink is pasted on the heat dissipation surface of the vapor chamber through thermal paste. When a large amount of heat is rapidly generated from the power element and transferred to the vapor chamber, the working fluid existing in the working space of the vapor chamber will quickly absorb the heat and quickly vaporize into steam. The heat dissipation surface of the vapor chamber is connected to a heat sink, thus when the steam rises rapidly and