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US-12628317-B2 - Zettascale supercomputer

US12628317B2US 12628317 B2US12628317 B2US 12628317B2US-12628317-B2

Abstract

A zettascale supercomputer may be configured using an array of servers organized in computer pods comprising 4-60 servers per pod. Each server includes computer modules immersed in a tank in which cooling water is flowing. Copper bus bars deliver power to each pod in a range of 4-180 MW. Cooling water is delivered to each pod in a range of 200-24,000 gallons per minute. Supercomputers having an operating power in a range of 4 MW-10 GW are described.

Inventors

  • Peter C. Salmon

Assignees

  • Peter C. Salmon

Dates

Publication Date
20260512
Application Date
20230807

Claims (17)

  1. 1 . A supercomputer comprising: at least one computer pod comprising an array of servers, the array of servers comprising 10-200 servers, each server in the array of servers comprising: a tank in which cooling water is capable of flowing; and a plurality of computer modules in the tank, each of the plurality of computer modules including a conformable water-impermeable coating that coats the entire module except for an opening at the top, wherein the water- impermeable coating of each of the plurality of computer modules comprises plasma-activated covalent bonds between a layer of the coating and the underlying respective computer module.
  2. 2 . The supercomputer of claim 1 wherein each computer module comprises a substrate with semiconductor chips mounted thereon, wherein the semiconductor chips are selected from the group consisting of bare die, stacked devices, surface mount devices, and low-profile packaged devices.
  3. 3 . The supercomputer of claim 2 wherein the semiconductor chips are selected from the group consisting of digital devices, processors, memories, analog devices, radio frequency (RF) devices, optical devices, sensors, passive devices, power conversion devices, voltage regulators and current regulators.
  4. 4 . The supercomputer of claim 1 further comprising: a motherboard; and input/output connectors coupled to the motherboard, the input/output connectors comprising electrical and optical connectors.
  5. 5 . The supercomputer of claim 1 further comprising a set of copper bus bars carrying power from a power station to the at least one computer pod, wherein the copper bus bars carry power in a range of 4-180 MW to each of the at least one computer pod.
  6. 6 . The supercomputer of claim 5 wherein the copper bus bars carry DC power to each of the at least one computer pod at a voltage in a range of 100-1200 volts and a current in a range of 4,000-100,000 amperes.
  7. 7 . The supercomputer of claim 1 wherein each server comprises a hose input and a hose output.
  8. 8 . The supercomputer of claim 7 wherein each of the hose input and the hose output are sized to carry cooling water at a rate of 20-500 gallons per minute.
  9. 9 . The supercomputer of claim 1 wherein each computer pod is configurable with an adjustable number of columns and an adjustable number of rows.
  10. 10 . The supercomputer of claim 1 wherein the at least one computer pod comprises a single pod arranged in 2-6 columns and 2-16 rows of servers; the single pod operable with a compute power in a range of 4-180 megawatts.
  11. 11 . The supercomputer of claim 1 wherein the at least one computer pod comprises twelve to eighteen pods, the twelve to eighteen pods operable with a total compute power in a range of 500 megawatts to 10 gigawatts.
  12. 12 . The supercomputer of claim 1 wherein the at least one computer pod comprises a plurality of computer pods arranged in a circular configuration.
  13. 13 . The supercomputer of claim 1 wherein the at least one computer pod comprises a plurality of computer pods arranged in a rectangular configuration.
  14. 14 . The supercomputer of claim 1 , wherein each server of the plurality of servers is configured to execute instructions provided in memory to achieve a performance for the supercomputer in the range of 10 exaflops to 10 zettaflops.
  15. 15 . A supercomputer comprising: at least one computer pod comprising an array of servers, the array of servers comprising 10-200 servers, each server in the array of servers comprising: a tank in which cooling water is capable of flowing; and a plurality of computer modules in the tank, each of the plurality of computer modules including a conformable water-impermeable coating that coats the entire module except for an opening at the top, wherein the water-impermeable coating comprises at least one layer of parylene C.
  16. 16 . A supercomputer comprising: at least one computer pod comprising an array of servers, each server in the array of servers comprising: a tank in which cooling water is capable of flowing; and a plurality of computer modules in the tank, each of the plurality of computer modules including a water-impermeable coating that coats the entire module except for an opening at the top, wherein the water-impermeable coating comprises: a first layer comprising titanium dioxide; a second adhesion layer comprising a treatment of A-174 SILANE; and a third layer comprising parylene C.
  17. 17 . The supercomputer of claim 16 wherein the first layer is applied by atomic layer deposition and has a thickness of approximately 20 nanometers, wherein the third layer is applied by chemical vapor deposition and has a thickness of approximately 25 micrometers.

Description

PRIORITY CLAIM AND RELATED PATENT APPLICATIONS AND PATENTS This application claims priority to U.S. Prov. App. No. 63/399,171, filed Aug. 18, 2022, entitled “EXASCALE SUPERCOMPUTER,” hereby incorporated by reference in its entirety. This application is related to U.S. patent application Ser. No. 17/989,549, filed Nov. 17, 2022, which is a continuation of U.S. Pat. No. 11,546,991, filed Mar. 2, 2022, which is a continuation-in-part of U.S. Pat. No. 11,393,807, filed Jul. 8, 2021, which is a continuation-in-part of U.S. Pat. No. 10,966,338, filed Mar. 11, 2020, each entitled “DENSELY PACKED ELECTRONIC SYSTEMS,” and each hereby incorporated by reference in their entireties. U.S. Pat. No. 11,546,991 is also a continuation-in-part of U.S. Pat. No. 11,393,807, filed Jul. 8, 2021, entitled “DENSELY PACKED ELECTRONIC SYSTEMS,” which is a continuation-in part of U.S. Pat. No. 10,966,338, filed Mar. 11, 2020, entitled “DENSELY PACKED ELECTRONIC SYSTEMS,” which claims priority to U.S. Prov. App. No. 63/129,477, filed Dec. 22, 2020, entitled “GLASS CIRCUIT ASSEMBLY AND LAMINATE STRUCTURE,” U.S. Prov. App. No. 63/135,990, filed Jan. 11, 2021, entitled “DENSELY PACKED ELECTRONIC SYSTEMS,” U.S. Prov. App. No. 63/164,437, filed Mar. 22, 2021, entitled “AGILE RECONFIGURABLE ELECTRONIC SYSTEMS,” and U.S. Prov. App. No. 63/159,212, filed Mar. 10, 2021, entitled “ELECTRONIC ASSEMBLY HAVING INDEPENDENTLY OPERABLE CLUSTERS OF COMPONENTS,” and each hereby incorporated by reference in their entireties. This application is also related to U.S. patent application Ser. No. 17/982,393, filed Nov. 7, 2022, which is a continuation-in-part of U.S. Pat. No. 11,523,543, filed May 6, 2022, which is a continuation-in-part of U.S. Pat. No. 11,445,640, filed Feb. 25, 2022, each entitled “WATER COOLED SERVER,” and each hereby incorporated by reference in their entireties. This application is also related to U.S. Prov. App. No. 63/522,540, filed Jun. 22, 2023, entitled “MICROELECTRONIC MODULE,” hereby incorporated by reference in its entirety. This application is also related to U.S. Pat. No. 11,064,626, filed Oct. 14, 2020, which is a divisional of U.S. Pat. No. 10,966,338, filed Mar. 11, 2020, each entitled “DENSELY PACKED ELECTRONIC SYSTEMS,” and each hereby incorporated by reference in their entireties. TECHNICAL FIELD Embodiments of the application relate to supercomputers, and more particularly, to a zettascale supercomputer employing water cooling. BACKGROUND Prior art supercomputing systems include the SUMMIT-IBM Power System AC922 and the FRONTIER OLCF-5 supercomputer produced by Hewlett Packard Enterprise. Summit was ranked the world's fastest supercomputer from November 2018 through June 2019. Frontier was installed at the Oak Ridge National Laboratory in 2021 and was the world's fastest supercomputer in 2022. Both systems employ water cooling. The specified performances are Summit at 200 petaflops, and Frontier at 1.1 exaflops. SUMMARY In an embodiment of the present disclosure, a supercomputer comprises an array of servers in at least one computer pod; each server comprising a tank in which cooling water is flowing and a plurality of computer modules disposed within the tank, each computer module including a coating that is impermeable to water except for an opening at the top. In an embodiment, the supercomputer comprises a motherboard including both electrical and optical input/output connectors for connecting between computer modules and with external signals and power. In an embodiment, the supercomputer comprises a set of bus bars that carry power in a range of 4-180 MW from a power station to each computer pod. In an embodiment, the power carried by the bus bars is DC power, having a voltage in a range of 100-2000 volts and current in a range of 4,000-100,000 amperes. In an embodiment, each server comprises a hose input and a hose output, wherein the hose input couples with a first water conduit and the hose output couples with a second water conduit, and the first conduit carries cooling water at a lower temperature than the second conduit. The hose input and the hose output may each be sized to carry cooling water at a rate of 20-400 gallons per minute, with water pressure created by at least one pump. In alternate embodiments, the water-cooling conduits may comprise a straight pipe or a ring configuration. In an embodiment, each server comprises a plurality of computer modules disposed in a tank of water, wherein each computer module comprises a circuit assembly having semiconductor chips mounted on a substrate, and each module includes a water-impermeable coating that coats the entire module except for an opening at the top where input/output connections are made. In an embodiment, the water-impermeable coating comprises a first layer that is a conformable coating. In a further embodiment, the water-impermeable coating comprises a metal layer. In a further embodiment, the water-impermeable coating comprises plasma-activate