US-12628323-B2 - Assembly for electric field generation or electric field conversion via capacitive coupling

US12628323B2US 12628323 B2US12628323 B2US 12628323B2US-12628323-B2

Abstract

An assembly for electrical field power generation or for electrical field power conversion is provided. The assembly comprises an electrically conductive plate, a dielectric layer and a shield plate. The electrically conductive plate defines at least one area of conductive material. The dielectric layer defines a first side and a second side. The at least one conductive material is in electric contact with the first side of the dielectric layer. The shield plate electrically insulates the second side of the dielectric layer.

Inventors

Amram BEN-HAIM
Marcel Chanu
Cedric HAMEL-BRUNEAU

Assignees

AWL-ELECTRICITY INC

Dates

Publication Date: 20260512
Application Date: 20240815

Claims (12)

1 . An assembly for electrical field generation, the assembly comprising: an electrically conductive plate, the electrically conductive plate defining at least one area of conductive material; a dielectric layer, the dielectric layer defining a first side and a second side, the at least one area of conductive material being in electric contact with the first side of the dielectric layer wherein the dielectric layer comprises a plurality of stacked sub-layers with different electrical permittivity and defines a plurality of apertures defining a honeycomb structure; and a shield plate, the shield plate electrically insulating the second side of the dielectric layer.
2 . The assembly of claim 1 , wherein the dielectric layer is made of one of: polyethylene, epoxy or glass-reinforced epoxy laminate material.
3 . The assembly of claim 1 , wherein the dielectric layer defines an indentation for receiving the electrically conductive plate.
4 . The assembly of claim 1 , wherein the plurality of apertures of the honeycomb structure is one of: filled with dry air or made into a vacuum.
5 . The assembly of claim 1 , further comprising a protective plate positioned above the dielectric layer and the electrically conductive plate.
6 . The assembly of claim 5 , wherein the protective plate is made of another dielectric material.
7 . An assembly for electrical field conversion, the assembly comprising: an electrically conductive plate, the electrically conductive plate including at least one conductive material; a dielectric layer, the dielectric layer defining a first side and a second side, the at least one conductive material being in electric contact with the first side of the dielectric layer, wherein the dielectric layer comprises a plurality of stacked sub-layers with different electrical permittivity and defines a plurality of apertures defining a honeycomb structure; and a shield plate, the shield plate electrically insulating the second side of the dielectric layer.
8 . The assembly of claim 7 , wherein the dielectric layer is made of one of: polyethylene, epoxy or glass-reinforced epoxy laminate material.
9 . The assembly of claim 7 , wherein the dielectric layer defines an indentation for receiving the electrically conductive plate.
10 . The assembly of claim 7 , wherein the plurality of apertures of the honeycomb structure is one of: filled with dry air or made into a vacuum.
11 . The assembly of claim 7 , further comprising a protective plate positioned above the dielectric layer and the at least one electrically conductive plate.
12 . The assembly of claim 11 , wherein the protective plate is made of another dielectric material.

Description

TECHNICAL FIELD The present disclosure relates to the field of electric field generation and electric field conversion. More specifically, the present disclosure presents an assembly for electric field generation or electric field conversion via capacitive coupling. BACKGROUND Wireless power transfer of electrical energy is based on the capability of transferring electrical energy by generating an electric field for the electric power to be transferred) and converting the electric field potential into electricity, without establishing a conductive contact therebetween. Wireless power transfer avoids the use of an electrical connector (e.g. an electrical power outlet or a Universal Serial Bus (USB) cable). Various techniques for implementing wireless power transfer have been known for a long time (although implementation of these techniques on an industrial and commercial scale are more recent). One of these techniques is based on electric field coupling systems, which use electrically conductive plates for implementing the wireless power transfer functionality. The wireless power transfer functionality is based on a coupling of electric fields between the conductive plates. The quality of electric field coupling systems can be improved by generating a high-frequency electric field and/or relying on highly sensitive circuits (resonant/High Q). The performance, reliability and safety of electric field coupling systems is affected by various factors, including parasitic capacitance from the environment of the electric field power generator and/or the electric field absorbing unit, as well as the difficulty to have a reliable capacitance in the components of the electric field power generator and/or electric field conversion unit. Therefore, there is a need for a new assembly for wireless electrical power transfer via capacitive coupling. SUMMARY According to a first aspect, the present disclosure provides an assembly for electrical field power generation. The assembly comprises an electrically conductive plate, the electrically conductive plate defining at least one area of conductive material. The assembly further comprises a dielectric layer. The dielectric layer defines a first side and a second side. The at least one conductive material is in electric contact with the first side of the dielectric layer. The assembly further comprises a shield plate. The shield plate electrically insulates the second side of the dielectric layer. According to a second aspect, the present disclosure provides an assembly for electrical field potential conversion. The assembly comprises an electrically conductive plate. The electrically conductive plate includes at least one conductive material. The assembly further comprises a dielectric layer. The dielectric layer defines a first side and a second side. The at least one conductive material is in electric contact with the first side of the dielectric layer. The assembly further comprises a shield plate. The shield plate electrically insulates the second side of the dielectric layer. In a particular aspect, the dielectric layer is made of one of: polyethylene, epoxy or glass-reinforced epoxy laminate material. In another particular aspect, the dielectric layer defines an indentation for receiving the electrically conductive plate. In yet another particular aspect, at least one of the electrically conductive plate, the dielectric layer and the shield plate defines a plurality of apertures. In a particular aspect, the plurality of apertures defines a honeycomb structure. In yet another aspect, the plurality of apertures of the honeycomb structure is one of: filled with dry air or made into a vacuum. In another particular aspect, the dielectric layer comprises a plurality of stacked sub-layers with different electrical permittivity. In a particular aspect, the assembly further comprises a protective plate positioned above the dielectric layer and the at least one electrically conductive plate. In another particular aspect, the protective plate is made of another dielectric material. BRIEF DESCRIPTION OF THE DRAWINGS Embodiments of the disclosure will be described by way of example only with reference to the accompanying drawings, in which: FIG. 1 is a perspective exploded view is of components of an assembly; FIG. 2 is a perspective view of a subset of the components of the assembly of FIG. 1; FIG. 3 is a perspective view of an alternative dielectric material; FIG. 4 is a modeling of an overall capacitance of the present assembly; and FIG. 5 is of a top view of an exemplary mesh structure. DETAILED DESCRIPTION The foregoing and other features will become more apparent upon reading of the following non-restrictive description of illustrative embodiments thereof, given by way of example only with reference to the accompanying drawings. Various aspects of the present disclosure generally address one or more of the problems related to the improvement of the design and functionalities