US-12628354-B2 - Package dies including vertical interconnects for signal and power distribution in a three-dimensional (3D) integrated circuit (IC) package

US12628354B2US 12628354 B2US12628354 B2US 12628354B2US-12628354-B2

Abstract

A 3D IC package includes a first package die having a first side coupled to a package substrate and a second side coupled to a second package die. The first package die includes vertical interconnects to provide interconnections between the second package die and the package substrate. The vertical interconnects each extend vertically between a first die contact on the first side of the first package die and a second die contact on the second side of the first package die. The second package die couples to the second die contacts of the first package die to form power and/or signal interconnects between the package substrate and the second package die. Horizontal interconnects in a distribution layer on the first side of the first package die distribute power and signals horizontally between the first die contacts and the vertical interconnects.

Inventors

Mustafa Badaroglu
Zhongze Wang

Assignees

QUALCOMM INCORPORATED

Dates

Publication Date: 20260512
Application Date: 20230220

Claims (20)

1 . A three-dimensional (3D) integrated circuit (IC) package, comprising a first package die, comprising: a plurality of vertical interconnects extending through the first package die in a first direction between a first side of the first package die and a second side of the first package die; a distribution layer comprising horizontal interconnects extending in a second direction orthogonal to the first direction, the distribution layer disposed on metallization layers on the first side of the first package die and coupled to the plurality of vertical interconnects; first die contacts disposed on the first side of the first package die and coupled to the horizontal interconnects; second die contacts disposed on the second side of the first package die, coupled to the plurality of vertical interconnects, and configured to couple to a second package die; a first semiconductor substrate, wherein the first side of the first package die comprises a first side of the first semiconductor substrate; and a first active circuit layer on the first side of the first semiconductor substrate and comprising: secondary circuit blocks, each comprising primary circuit blocks, wherein each of the primary circuit blocks comprises a memory array circuit; primary separation lanes disposed between the primary circuit blocks within each of the secondary circuit blocks; and secondary separation lanes disposed between the secondary circuit blocks, wherein: the secondary separation lanes are wider than the primary separation lanes; and the metallization layers are disposed on the first active circuit layer.
2 . The 3D IC package of claim 1 , wherein: each of the horizontal interconnects in the distribution layer couples to a corresponding metal trace in a first metallization layer of the metallization layers on the first side of the first package die; and each of the metal traces extends in a third direction, orthogonal to the second direction, and couples to one of the plurality of vertical interconnects.
3 . The 3D IC package of claim 2 , wherein at least one of the plurality of vertical interconnects extends between one of the second die contacts and one of the metal traces in the first metallization layer.
4 . The 3D IC package of claim 2 , wherein at least one of the plurality of vertical interconnects extends between one of the second die contacts and another metallization layer between the first metallization layer and the first active circuit layer.
5 . The 3D IC package of claim 1 , wherein the first die contacts each comprise a portion of a horizontal interconnect in the distribution layer.
6 . The 3D IC package of claim 1 , wherein each of the first die contacts comprises a contact coupled to a horizontal interconnect.
7 . The 3D IC package of claim 1 , further comprising the second package die comprising a second active circuit layer coupled to the second die contacts on the second side of the first package die.
8 . The 3D IC package of claim 7 , wherein: the second package die is smaller in area than the first package die; the first package die comprises: an overlap area in which the second package die overlaps the second side of the first package die; and a non-overlap area outside the overlap area; the second die contacts are disposed in the overlap area; one of the first die contacts is disposed in the non-overlap area of the first package die; and a horizontal interconnect couples a primary vertical interconnect in the overlap area to the one of the first die contacts in the non-overlap area.
9 . The 3D IC package of claim 7 , wherein: the second package die is smaller in area than the first package die; the first package die comprises: an overlap area in which the second package die overlaps the second side of the first package die; and a non-overlap area outside the overlap area; the second die contacts are disposed in the overlap area; the first package die comprises a row of primary vertical interconnects disposed in the overlap area parallel to a perimeter of the overlap area; and the horizontal interconnects couple the row of primary vertical interconnects to the first die contacts in the non-overlap area.
10 . The 3D IC package of claim 1 , wherein the primary circuit blocks comprise static random-access memory (SRAM) circuits and/or dynamic random-access memory (DRAM) circuits.
11 . The 3D IC package of claim 1 , wherein the second active circuit layer is configured to receive power through a power distribution network (PDN) coupled to the second die contacts.
12 . The 3D IC package of claim 1 , wherein the second active circuit layer comprises digital logic circuits configured to access the primary circuit blocks in the first active circuit layer.
13 . The 3D IC package of claim 1 , wherein each vertical interconnect of the plurality of vertical interconnects comprises at least one through-silicon via (TSV).
14 . The 3D IC package of claim 13 , the plurality of vertical interconnects comprising primary vertical interconnects extending through the primary separation lanes in the first package die, wherein the at least one TSV in the primary vertical interconnects comprises less than four (4) TSVs.
15 . The 3D IC package of claim 13 , the plurality of vertical interconnects comprising secondary vertical interconnects extending through the secondary separation lanes in the first package die, wherein the at least one TSV in the secondary vertical interconnects comprises four (4) or more TSVs.
16 . The 3D IC package of claim 14 , wherein: the primary circuit blocks in one of the secondary circuit blocks are disposed in columns separated by one of the primary separation lanes; each of the primary separation lanes comprises end regions and a central region disposed between the end regions; and the primary vertical interconnects extending through the primary separation lanes in one of the secondary circuit blocks extend through the end regions and not through the central region.
17 . The 3D IC package of claim 1 integrated into a device selected from the group consisting of: a set-top box; an entertainment unit; a navigation device; a communications device; a fixed location data unit; a mobile location data unit; a global positioning system (GPS) device; a mobile phone; a cellular phone; a smartphone; a session initiation protocol (SIP) phone; a tablet; a phablet; a server; a computer; a portable computer; a mobile computing device; a wearable computing device; a desktop computer; a personal digital assistant (PDA); a monitor; a computer monitor; a television; a tuner; a radio; a satellite radio; a music player; a digital music player; a portable music player; a digital video player; a video player; a digital video disc (DVD) player; a portable digital video player; an automobile; a vehicle component; an avionics system; a drone; and a multicopter.
18 . A method of fabricating a three-dimensional (3D) integrated circuit (IC) package, comprising forming a first package die, comprising: forming a plurality of vertical interconnects extending through the first package die in a first direction between a first side of the first package die and a second side of the first package die; forming a distribution layer comprising horizontal interconnects extending in a second direction orthogonal to the first direction, the distribution layer disposed on metallization layers on the first side of the first package die and coupled to the plurality of vertical interconnects; forming first die contacts disposed on the first side of the first package die and coupled to the horizontal interconnects; forming second die contacts disposed on the second side of the first package die, coupled to the plurality of vertical interconnects, and configured to couple to a second package die; forming a first semiconductor substrate, wherein the first side of the first package die comprises a first side of the first semiconductor substrate; and forming a first active circuit layer on the first side of the first semiconductor substrate and comprising: secondary circuit blocks, each comprising primary circuit blocks, wherein each of the primary circuit blocks comprises a memory array circuit; primary separation lanes disposed between the primary circuit blocks within each of the secondary circuit blocks; and secondary separation lanes disposed between the secondary circuit blocks, wherein: the secondary separation lanes are wider than the primary separation lanes; and the metallization layers are disposed on the first active circuit layer.
19 . The method of claim 18 , wherein forming the plurality of vertical interconnects further comprises forming vias coupled to one of the first die contacts and one of the second die contacts.
20 . The method of claim 19 , wherein forming the first package die further comprises: forming a first active circuit layer; forming the metallization layers on the first active circuit layer; and forming metal traces in a first metallization layer of the metallization layers, wherein the metal traces couple the horizontal interconnects to the vias.

Description

BACKGROUND I. Field of the Disclosure The technology of the disclosure relates generally to integrated circuit (IC) packages and, more specifically, to interconnecting dies in a three-dimensional (3D) IC package. II. Background Integrated circuits (ICs) provide functionality to many types of electronic devices, which include multiple ICs designed to work together. These ICs may be disposed horizontally adjacent to each other on a two-dimensional (2D) surface of a substrate or circuit board with horizontal metal interconnects extending on or in the substrate or circuit board between the ICs to provide die-to-die (D2D) connections. To save area and reduce the lengths of the metal interconnects, device manufacturers also provide IC packages that include multiple ICs stacked vertically to provide three-dimensional (3D) packages. One of the challenges in fabricating 3D IC packages is that routing resources are needed for power and signal connections to a lower die as well as for vertical connections to an upper die. The vertical connections to the upper die extend from package interconnects on a bottom side of the lower die that connect to a package substrate to contacts on a top side of the lower die that connect to the upper die. Incorporating these vertical connections into the lower die requires a sacrifice of resources, and this problem is exacerbated if the preferred locations of the vertical connections conflict with densely packed logic areas of the lower die. Thus, there is a tradeoff between area efficiency of the lower die and having sufficient area through which to route vertical connections to distribute power and logic signals to the upper die. SUMMARY Aspects disclosed in the detailed description include a package die including vertical interconnects for signal and power distribution in a three-dimensional (3D) integrated circuit (IC) package. Related methods of fabricating package dies, including vertical interconnects, are also disclosed. A 3D IC package includes a first package die having a first side coupled to a package substrate disposed vertically below the first package die and a second side opposite to the first side and coupled to a second package die disposed vertically above and adjacent to the first package die. The first package die includes first die contacts disposed on the first side and coupled to the package substrate and second die contacts disposed on the second side and coupled to the second package die. The first package die, which is disposed vertically between the second package die and the package substrate, includes vertical interconnects to provide interconnections between the second package die and the package substrate. The vertical interconnects each extend vertically between a first die contact on the first side of the first package die and a second die contact on the second side of the first package die. Third die contacts on a third side of the second package die couple to the second die contacts of the first package die to provide power and/or signal interconnects between the package substrate and the second package die. In exemplary aspects, horizontal interconnects distribute the power and signals horizontally between the first die contacts and the vertical interconnects. The horizontal interconnects may be provided in a distribution layer to provide a low resistance path and avoid an increase in congestion that would be caused by routing the power and signals through metallization layers on the first package die. In some examples, locations of the vertical interconnects are selected to avoid interference with circuit blocks on the first package die and to distribute power among the second die contacts, which may couple to a power distribution network in the second package die. In this regard, in one aspect, a 3D IC package is disclosed. The 3D IC package includes a first package die. The first package die includes a plurality of vertical interconnects extending through the first package die in a first direction between a first side of the first package die and a second side of the first package die. The first package die also includes a distribution layer comprising horizontal interconnects extending in a second direction orthogonal to the first direction. The distribution layer is disposed on metallization layers on the first side of the first package die and coupled to the plurality of vertical interconnects. The first package die also includes first die contacts disposed on the first side of the first package die and coupled to the horizontal interconnects. The first package die also includes second die contacts disposed on the second side of the first package die, coupled to the plurality of vertical interconnects, and configured to couple to a second package die. In another aspect, a method of fabricating a 3D IC package is disclosed. The method includes forming a plurality of vertical interconnects extending through the first package die in a first direc