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US-12628424-B2 - Electronic device and repair method thereof

US12628424B2US 12628424 B2US12628424 B2US 12628424B2US-12628424-B2

Abstract

An electronic device and a repair method thereof are provided. The repair method of the electronic device includes: providing a panel, wherein the panel includes a substrate, a first conductive layer disposed on the substrate, a transistor disposed on the substrate, and a dielectric layer disposed between the first conductive layer and the transistor, wherein the transistor comprises a first electrode and a second electrode; and cutting at least one of the first electrode and the second electrode with a laser beam, wherein a cutting point formed by the laser beam does not overlap with the first conductive layer.

Inventors

  • Jia-Sin Lin
  • Yi-Hung Lin
  • Yan-Zheng WU
  • Chen-Lin Yeh

Assignees

  • Innolux Corporation

Dates

Publication Date
20260512
Application Date
20230321
Priority Date
20221228

Claims (6)

  1. 1 . An electronic device, comprising: a panel, wherein the panel comprises: a substrate; a first conductive layer, disposed on the substrate and having an opening; a transistor, disposed on the substrate, wherein the transistor comprises a first electrode and a second electrode, and the transistor at least partially overlaps with the opening; a dielectric layer, disposed between the first conductive layer and the transistor; and a modulation element, disposed on the substrate, wherein the modulation element is used to adjust an electromagnetic wave having a wavelength, the modulation element is electrically connected to the transistor, and a length of the opening is less than one-fifth of the wavelength.
  2. 2 . The electronic device according to claim 1 , wherein the opening overlaps with at least one of the first electrode and the second electrode.
  3. 3 . The electronic device according to claim 1 , wherein the transistor further comprises a gate, and the gate overlaps with the first conductive layer.
  4. 4 . The electronic device according to claim 3 , wherein the gate is between the first electrode and the first conductive layer.
  5. 5 . The electronic device according to claim 3 , wherein the first electrode is between the gate and the first conductive layer.
  6. 6 . The electronic device according to claim 3 , wherein a length of the opening is less than or equal to a length of the gate.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims the priority benefit of U.S. provisional application Ser. No. 63/331,883, filed on Apr. 18, 2022, and China application serial no. 202211697488.9, filed on Dec. 28, 2022. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification. BACKGROUND Technical Field The disclosure relates to an electronic device and a repair method thereof. Description of Related Art Defects in the element array are usually repaired by adopting a laser. However, when there are other conductive layers (for example, metal layers) between the element array and the substrate, the upper and lower conductive layers, which are originally electrically insulated, are prone to short circuit due to high temperature melting during the laser repair process. SUMMARY The disclosure provides an electronic device and a repair method thereof, which help to reduce short circuit caused by laser repair. According to some embodiments of the disclosure, a repair method of an electronic device includes the following steps. A panel is provided. The panel includes a substrate, a first conductive layer disposed on the substrate, a transistor disposed on the substrate, and a dielectric layer disposed between the first conductive layer and the transistor. The transistor includes a first electrode and a second electrode. At least one of the first electrode and the second electrode is cut with a laser beam. A cutting point formed by the laser beam does not overlap with the first conductive layer. According to some other embodiments of the disclosure, the electronic device includes a panel. The panel includes a substrate, a first conductive layer, a transistor, and a dielectric layer. The first conductive layer is disposed on the substrate and has an opening. The transistor is disposed on the substrate. The transistor includes a first electrode and a second electrode, and the transistor at least partially overlaps with the opening. The dielectric layer is disposed between the first conductive layer and the transistor. According to some other embodiments of the disclosure, a repair method of an electronic device includes the following steps. A panel is provided. The panel includes a substrate, a first conductive layer disposed on the substrate, a dielectric layer disposed on the first conductive layer, a transistor disposed on the dielectric layer, and a reflection layer disposed between the first conductive layer and the transistor. The transistor includes a first electrode and a second electrode. At least one of the first electrode and the second electrode is cut with a laser beam. The reflection layer is used to reflect the laser beam. In order for the features and advantages of the disclosure to be more comprehensible, the following specific embodiments are described in detail in conjunction with the drawings. BRIEF DESCRIPTION OF THE DRAWINGS The drawings are included to provide a further understanding of the disclosure, and the drawings are incorporated into the specification and constitute a part of the specification. The drawings illustrate embodiments of the disclosure and serve to explain principles of the disclosure together with the description. FIG. 1, FIG. 3, FIG. 6, and FIG. 8 are respectively partial top schematic views of an electronic device according to some embodiments of the disclosure. FIG. 2, FIG. 4, FIG. 5, FIG. 7, and FIG. 9 are respectively partial cross-sectional schematic views of an electronic device according to some embodiments of the disclosure. FIG. 10A and FIG. 10B are schematic flowcharts of a repair method of an electronic device according to some embodiments of the disclosure. FIG. 11A and FIG. 11B are schematic flowcharts of a repair method of an electronic device according to other embodiments of the disclosure. DETAILED DESCRIPTION OF DISCLOSED EMBODIMENTS Reference will now be made in detail to the exemplary embodiments of the disclosure, and examples of the exemplary embodiments are illustrated in the drawings. Wherever possible, the same reference numerals are used in the drawings and the description to refer to the same or similar parts. Throughout the disclosure and the appended claims, certain terms may be used to refer to specific elements. It should be understood by persons skilled in the art that electronic device manufacturers may refer to the same element by different names. The disclosure does not intend to distinguish between elements with the same function but different names. In the following specification and claims, words such as “containing” and “comprising” are open-ended words, so the words should be interpreted as “including but not limited to . . . ”. Directional terms such as “upper”, “lower”, “front”, “rear”, “left”, and “right” mentioned in the disclosure are only directions with reference to the drawings. Therefore, the used directional terms are used to