US-12628426-B2 - Display devices
Abstract
A display device is provided. The display device includes a first metal layer and a second metal layer. A projection of a first driver chip on a plane where a first gold finger is located partially overlaps a projection of a second driver chip on the plane where the first gold finger is located. Metal traces for connecting the first gold finger, the second gold finger, and a driver chip including the first driver chip and the second driver chip include a first metal trace, a second metal trace, a third metal trace, a fourth metal trace, and a fifth metal trace. At least one of the first metal trace, the second metal trace, the third metal trace, the fourth metal trace, and the fifth metal trace includes partial wires arranged in a different metal layer than other wires.
Inventors
- Qianrui XU
Assignees
- Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
Dates
- Publication Date
- 20260512
- Application Date
- 20230427
- Priority Date
- 20230317
Claims (13)
- 1 . A display device, comprising a display panel, at least one chip on film (COF), and a printed circuit board, and the COF comprising: a first gold finger connected to the printed circuit board; a second gold finger arranged opposite to the first gold finger and connected to the display panel; a driver chip disposed between the first gold finger and the second gold finger and comprising a first driver chip and a second driver chip; and metal traces comprising a first metal trace, a second metal trace, a third metal trace, a fourth metal trace, and a fifth metal trace insulated from each other; and wherein the first metal trace comprises an end connected to the first gold finger and another end connected to the first driver chip, the second metal trace comprises an end connected to the first driver chip and another end connected to the second gold finger, the third metal trace comprises an end connected to the first gold finger and another end connected to the second driver chip, the fourth metal trace comprises an end connected to the second driver chip and another end connected to the second gold finger, and the fifth metal trace comprises an end connected to the first gold finger and another end connected to the second gold finger; wherein along a direction from the first gold finger towards the second gold finger and on a plane where the first gold finger is located, a projection of the first driver chip partially overlaps a projection of the second driver chip; wherein the COF comprises a first metal layer and a second metal layer; each of the first metal trace, the second metal trace, the third metal trace, the fourth metal trace, and the fifth metal trace comprises a plurality of wires; at least one of the first metal trace, the second metal trace, the third metal trace, the fourth metal trace, and the fifth metal trace comprises at least some wires, of the plurality of wires, each arranged in the first metal layer; and at least one of the first metal trace, the second metal trace, the third metal trace, the fourth metal trace, and the fifth metal trace comprises at least some wires, of the plurality of wires, each arranged in the second metal layer; wherein the COF further comprises a base disposed on a side of the second metal layer away from the first metal layer; wherein the first metal trace comprises first sub-lines arranged in the first metal layer; wherein a projection of an end, which is connected to the first driver chip, of each first sub-line of the first sub-lines on the plane where the first gold finger is located is spaced apart from another end of the first sub-line connected with the first gold finger; wherein the fourth metal trace comprises third sub-lines arranged in the second metal layer; and wherein at least some sub-lines of the third sub-lines each have a projection on the base overlapped with a projection of one of the first sub-lines on the base.
- 2 . The display device of claim 1 , wherein the COF further comprises: an insulation layer sandwiched between the first metal layer and the second metal layer; and wherein the driver chip is disposed on a side of the first metal layer away from the second metal layer, the first gold finger is disposed on a side of the base adjacent to the driver chip, and the second gold finger is disposed on the side of the base adjacent to the driver chip; and wherein the first gold finger is connected with wires arranged in the second metal layer by passing through via holes of the insulation layer, and the second gold finger is connected with another wires arranged in the second metal layer by passing through another via holes of the insulation layer.
- 3 . The display device of claim 1 , wherein the first metal trace further comprises one or more second sub-lines arranged in the second metal layer; wherein a projection of each of the first sub-lines on the base is disposed on a side, adjacent to a projection of the second driver chip on the base, of a projection of each of the second sub-lines on the base, or the projection of each of the second sub-lines on the base is disposed between adjacent projections of the first sub-lines on the base; and wherein a length of each of the first sub-lines is greater than or equal to a length of each of the second sub-lines.
- 4 . The display device of claim 1 , wherein the fourth metal trace further comprises one or more fourth sub-lines arranged in the first metal layer; and wherein a projection of each of the fourth sub-lines on the base is disposed on a side, away from a projection of the first driver chip on the base, of a projection of each of the third sub-lines on the base.
- 5 . The display device of claim 1 , wherein the second metal trace comprises fifth sub-lines arranged in the first metal layer; and wherein at least some sub-lines of the fifth sub-lines each have a projection on the base overlapped with a projection of one of the third sub-lines on the base.
- 6 . The display device of claim 5 , wherein the second metal trace further comprises one or more sixth sub-lines arranged in the second metal layer; and wherein a projection of each of the sixth sub-lines on the base is disposed on a side, away from a projection of the second driver chip on the base, of a projection of each of the fifth sub-lines on the base, or the projection of each of the sixth sub-lines on the base is disposed between adjacent projections of the fifth sub-lines on the base.
- 7 . The display device of claim 1 , wherein the third metal trace comprises seventh sub-lines arranged in the first metal layer; and wherein at least some sub-lines of the seventh sub-lines each have a projection on the base overlapped with a projection of one of the third sub-lines on the base.
- 8 . The display device of claim 7 , wherein the third metal trace further comprises one or more eighth sub-lines arranged in the second metal layer; and wherein a projection of each of the eighth sub-lines on the base is disposed on a side, away from a projection of the first driver chip on the base, of a projection of each of the seventh sub-lines on the base.
- 9 . The display device of claim 1 , wherein a coincidence portion of the projection of the first driver chip on the plane where the first gold finger is located and the projection of the second driver chip on the plane where the first gold finger is located has a width ranging from one-tenth to half of a width of the first driver chip.
- 10 . A display device, comprising a display panel, at least one chip on film (COF), and a printed circuit board, and the COF comprising: a first gold finger connected to the printed circuit board; a second gold finger arranged opposite to the first gold finger and connected to the display panel; a driver chip disposed between the first gold finger and the second gold finger and comprising a first driver chip and a second driver chip; and metal traces comprising a first metal trace, a second metal trace, a third metal trace, a fourth metal trace, and a fifth metal trace insulated from each other; and wherein the first metal trace comprises an end connected to the first gold finger and another end connected to the first driver chip, the second metal trace comprises an end connected to the first driver chip and another end connected to the second gold finger, the third metal trace comprises an end connected to the first gold finger and another end connected to the second driver chip, the fourth metal trace comprises an end connected to the second driver chip and another end connected to the second gold finger, and the fifth metal trace comprises an end connected to the first gold finger and another end connected to the second gold finger; wherein along a direction from the first gold finger towards the second gold finger and on a plane where the first gold finger is located, a projection of the first driver chip partially overlaps a projection of the second driver chip; wherein the COF comprises a first metal layer and a second metal layer; each of the first metal trace, the second metal trace, the third metal trace, the fourth metal trace, and the fifth metal trace comprises a plurality of wires; at least one of the first metal trace, the second metal trace, the third metal trace, the fourth metal trace, and the fifth metal trace comprises at least some wires, of the plurality of wires, each arranged in the first metal layer; and at least one of the first metal trace, the second metal trace, the third metal trace, the fourth metal trace, and the fifth metal trace comprises at least some wires, of the plurality of wires, each arranged in the second metal layer; wherein the COF further comprises a base disposed on a side of the second metal layer away from the first metal layer; and wherein at least some wires of the fifth metal trace each have a projection on the base overlapped with a projection of one wire of the second metal trace on the base; or at least some wires of the fifth metal trace each have a projection on the base overlapped with a projection of one wire of the second metal trace on the base, and at least another some wires of the fifth metal trace each have a projection on the base overlapped with a projection of one wire of the fourth metal trace on the base; or at least some wires of the fifth metal trace each have a projection on the base overlapped with a projection of one wire of the fourth metal trace on the base.
- 11 . The display device of claim 10 , wherein the fifth metal trace is arranged in the first metal layer; wherein wires of the second metal trace each having a projection on the base overlapped with a projection of one wire of the fifth metal trace on the base are arranged in the second metal layer; and wherein wires of the fourth metal trace each having a projection on the base overlapped with a projection of one wire of the fifth metal trace on the base are arranged in the second metal layer.
- 12 . The display device of claim 10 , wherein the fifth metal trace is arranged in the second metal layer; wherein wires of the second metal trace each having a projection on the base overlapped with a projection of one wire of the fifth metal trace on the base are arranged in the first metal layer; and wherein wires of the fourth metal trace each having a projection on the base overlapped with a projection of one wire of the fifth metal trace on the base are arranged in the first metal layer.
- 13 . The display device of claim 10 , wherein the fifth metal trace comprises ninth sub-lines arranged in the first metal layer and one or more tenth sub-lines arranged in the second metal layer; and wherein a projection of each of the ninth sub-lines on the base overlaps a projection of one wire of the second metal trace on the base, and a projection of each of the tenth sub-lines on the base overlaps a projection of one wire of the fourth metal trace on the base; or the projection of each of the ninth sub-lines on the base overlaps a projection of one wire of the fourth metal trace on the base, and the projection of each of the tenth sub-lines on the base overlaps a projection of one wire of the second metal trace on the base.
Description
CROSS-REFERENCE TO RELATED APPLICATION This application claims priority to Chinese Patent Application No. 202310269813.X, filed on Mar. 17, 2023, the disclosure of which is incorporated herein by reference in its entirety. TECHNICAL FIELD The present disclosure relates to the technical field of display technologies, and in particular, to display devices. BACKGROUND Chip on film (COF for short) is a grain-soft film packaging technology in which at least one display driver chip is fixed on a flexible circuit board. With the development of display devices towards high resolution, in order to relieve a channel number limitation of a single display driver chip, the display device in related art adopts a two-in-one COF design, that is, two display driver chips are bonded on a single flexible circuit board, so as to arrange more display driver chips in a limited panel bonding area and improve the resolution of the display device. Specifically, the two display driver chips of the two-in-one COF in the related art are laterally arranged, and then the display driver chips and gold fingers are connected through wires. However, because pins of the display driver chip are disposed on an upper side and a lower side thereof, partial wires which are connected to an output end need to be each looped from the lower side of the display driver chip to the gold finger on the output end, resulting in a certain space between adjacent display driver chips. In addition, due to a large width of the display driver chip, a width of the COF is large, so that the number of COFs that the display device can bond is less, and it is not possible to further increase the resolution of the display device. Therefore, the display device in the related art has a technical problem that the COF has a large width due to a large lateral space occupied by the display driver chips and the wires. SUMMARY In view of above, a display device according to embodiments of the present disclosure is provided. The display device includes a display panel, at least one COF, and a printed circuit board. The COF includes a first gold finger connected to the printed circuit board, a second gold finger arranged opposite to the first gold finger and connected to the display panel, a driver chip disposed between the first gold finger and the second gold finger and including a first driver chip and a second driver chip, and metal traces including a first metal trace, a second metal trace, a third metal trace, a fourth metal trace, and a fifth metal trace insulated from each other. The first metal trace includes an end connected to the first gold finger and another end connected to the first driver chip, the second metal trace includes an end connected to the first driver chip and another end connected to the second gold finger, the third metal trace includes an end connected to the first gold finger and another end connected to the second driver chip, the fourth metal trace includes an end connected to the second driver chip and another end connected to the second gold finger, and the fifth metal trace includes an end connected to the first gold finger and another end connected to the second gold finger. Herein, the COF includes a first metal layer and a second metal layer. Along a direction from the first gold finger towards the second gold finger and on a plane where the first gold finger is located, a projection of the first driver chip partially overlaps a projection of the second driver chip. At least one of the first metal trace, the second metal trace, the third metal trace, the fourth metal trace, and the fifth metal trace includes at least partial wires each arranged in the first metal layer; and at least one of the first metal trace, the second metal trace, the third metal trace, the fourth metal trace, and the fifth metal trace includes at least partial wires each arranged in the second metal layer. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a chip on film (COF for short) in the related art. FIG. 2 is a schematic structure view of a display device according to an embodiment of the present disclosure. FIG. 3 is a schematic view of a first structure of a COF according to an embodiment of the present disclosure. FIG. 4 is a schematic view of a second structure of a COF according to an embodiment of the present disclosure. FIG. 5 is a schematic view of a third structure of a COF according to an embodiment of the present disclosure. FIG. 6 is a schematic view of a fourth structure of a COF according to an embodiment of the present disclosure. FIG. 7 is a schematic view of a fifth structure of a COF according to an embodiment of the present disclosure. DETAILED DESCRIPTION Some embodiments of the present disclosure will be described below in detail with reference to the accompanying drawings, but not intended to limit the present disclosure. In the illustration of the present disclosure, it should be understood that orientation and positional re