US-12628449-B2 - Integrated photosensitive module, photosensitive assembly, camera module and preparation method therefor

US12628449B2US 12628449 B2US12628449 B2US 12628449B2US-12628449-B2

Abstract

Disclosed is a photosensitive module ( 21 ), adapted to a camera module, comprising a photosensitive element ( 211 ), a light transmitting element ( 212 ) and an isolation adhesive layer ( 213 ), wherein the photosensitive element has a photosensitive region and a non-photosensitive region, the light transmitting element is arranged in a photosensitive path of the photosensitive element, and wherein the isolation adhesive layer is arranged in the non-photosensitive region and supports the light transmitting element, and the isolation adhesive layer is formed by means of photolithography.

Inventors

Mingzhu Wang
Takehiko Tanaka
Lifeng YAO
Zhen Huang
Nan Guo
Xiaodi LIU
Zhenyu Chen

Assignees

NINGBO SUNNY OPOTECH CO., LTD.

Dates

Publication Date: 20260512
Application Date: 20230307
Priority Date: 20180213

Claims (6)

1 . A method for manufacturing a photosensitive assembly, including the steps of: (i) forming a plurality of isolation adhesive layers at a preset position of a chip wafer by a photolithography process, wherein the chip wafer has a plurality of photosensitive elements arranged in an array, and each photosensitive element is provided with the isolation adhesive layer in its non-photosensitive region; (ii) covering at least one light transmitting element on at least one of the isolation adhesive layers; (iii) cutting the chip wafer to form a plurality of the photosensitive modules; (iv) conductively mounting at least one conductive member on the non-photosensitive region of the photosensitive element; (v) arranging the photosensitive modules on a substrate in an array; (vi) forming a molding body on the substrate through a molding process to encapsulate the photosensitive module and the conductive member; (vii) mounting a circuit layer on the surface of the molding body on a light incident side, wherein the circuit layer is conductively connected to the conductive member, wherein the circuit layer has a plurality of light passing holes corresponding to the photosensitive paths of the photosensitive element, to form a photosensitive assembly jointed panel; and (viii) cutting the photosensitive assembly jointed panel to form a plurality of photosensitive assemblies.
2 . The manufacturing method according to claim 1 , wherein the step (vii) further includes the steps of: (vii.1) forming an extended wiring layer by a rewiring process on the surface of the molding body on the light incident side, wherein the extended wiring layer is conductively connected to the conductive member, wherein the extended wiring layer has a plurality of light passing holes corresponding to the photosensitive paths of the photosensitive element, to form the photosensitive assembly jointed panel.
3 . The manufacturing method according to claim 1 , wherein the step (vi) further includes the step of: (vi.1) exposing the conductive member and the light transmitting element with respect to the molding body.
4 . The manufacturing method according to claim 1 , wherein the step (v) further includes the step of: providing at least one electronic component on the substrate, wherein an electrical connection surface of the electronic component is away from the substrate; in the step (vi), the molding body encapsulates the electronic component, the photosensitive module, and the conductive member; and in the step (vii), the circuit layer is electrically connected with the electrical connection surface of the electronic component.
5 . The manufacturing method according to claim 1 , wherein the step (vi) further includes the step of: (vi.2) forming a first molding body integrally encapsulating the photosensitive module and the conductive member through a molding process to form a molding single body; (vi.3) exposing the light transmitting element and the conductive member with respect to the first molding body; (vi.4) turning over the molding single body and arranging in an array on the substrate so that the photosensitive surface of the photosensitive element faces the substrate; (vi.5) providing at least one electronic component on the substrate, wherein the electrical connection surface of the electronic component contacts the substrate; and (vi.6) integrally encapsulating the molding single body and the electronic component through a molding process to form a second molding body.
6 . The manufacturing method according to claim 1 , wherein the step (vii) further includes the steps of: (vii.2) turning over the second molding single body so that the non-photosensitive surface of the photosensitive element faces the substrate, and the electrical connection surface of the electronic component is away from the substrate; (vii.3) electrically connecting and mounting the circuit layer and the conductive member, the electrical connection surfaces of the electronic component, and the circuit layer has a plurality of light passing holes corresponding to the photosensitive paths of the photosensitive element to form the photosensitive assembly jointed panel.

Description

FIELD OF THE INVENTION The invention relates to field of a camera module, in particular to a photosensitive module in which a light transmitting element is directly provided on a photosensitive element, a photosensitive assembly including the same, a camera module, and a preparation method thereof. BACKGROUND OF THE INVENTION In recent years, with the popularization and development of smart devices, they have become increasingly thin and light. Correspondingly, camera modules is required to be adapted to be developed, and become more and more multi-functional integration, light and thin, and miniaturization, so that the volume required for the camera module to be assembled in smart electronic device can be reduced accordingly, and meet the imaging requirements of the camera module. Therefore, camera module manufacturers continue to devote themselves to designing and manufacturing camera modules that meet these requirements. In the prior art, as an essential element, the filter is usually mounted on the lens holder first, and then assembled with the photosensitive element on the circuit board to maintain a certain distance between the light transmitting element and the photosensitive element to prevent it from squeezing the microlens structure on the surface of the chip of the photosensitive element, also prevent dirt on the light transmitting element from being imaged on the photosensitive element due to the filter being too close to the photosensitive element, which affects the imaging quality of the camera module. However, at present, the lens holder is usually formed by an injection molding process. Due to the limitation of the injection molding process, its height is often at least 200 um or more, which limits the height and size of the camera module to be further reduced, which is contrary to market demand. Molding and packaging process is a packaging technology newly developed on the basis of traditional COB (Chip on Board) packaging process. A circuit board assembly prepared by a molding and packaging process has a structure in which a molding portion is packaged on a circuit board by a molding and packaging manner to covering at least a part of the circuit board integrally and electronic components assembled on the circuit board, such as photosensitive elements, passive electronic components, etc., and a filter is attached to and mounted on the top side of the molding portion. For the camera module, it includes many relatively fragile but highly sensitive electronic components, especially photosensitive elements. During the molding process, on one hand, it is necessary to provide a sealed environment for the photosensitive region of the photosensitive element to prevent the molding material with fluidity from penetrating into the photosensitive element to make it invalid; on the other hand, it should be as much as possible to avoid direct contact between the photosensitive element and the molding surface of the molding die, so as to prevent the photosensitive element from being damaged due to withstanding excessive pressure. Therefore, in the existing molding process, it is usually selected to provide a isolation adhesive layer in the corresponding region of the photosensitive element to solve the above concerns. Specifically, the isolation adhesive layer is circumferentially provided outside the photosensitive region of the photosensitive element, so as to form a sealed environment for the photosensitive element through the cooperation between the isolation adhesive layer and the molding surface. At the same time, the protruding isolation adhesive layer can effectively prevent direct mechanical contact between the photosensitive element and the molding surface of the molding die to protect the photosensitive element. However, it is well known that the imaging performance of the camera module depends on the effective photosensitive area of the photosensitive element, that is, the area of the photosensitive region. Therefore, in order to increase the pixel requirements of the camera module, the area of the photosensitive region of the photosensitive element must be enlarged. At the same time, the camera module also requires a trend toward miniaturization, that is, the overall size of the photosensitive element needs to be reduced. In order to meet the two technical requirements at the same time, the range of the non-photosensitive region of the photosensitive element will inevitably be continuously reduced, thereby causing a lot of troubles for forming the isolation adhesive layer. As the area of the non-photosensitive region shrinks, the possibility of the glue erroneously staining the photosensitive element during the formation of the isolation adhesive layer is greatly increased. At the same time, due to the reduction of the area where the isolation adhesive layer is laid, the shape and size requirements of the isolation adhesive layer are becoming more and more stringent, especially the thickness