US-12628455-B2 - Package structure with lens structure and manufacturing method thereof

US12628455B2US 12628455 B2US12628455 B2US 12628455B2US-12628455-B2

Abstract

A package structure includes an optical die, an optical die, a supporting structure, and a lens structure. The optical die includes a photonic region. The optical die is disposed on and electrically coupled to the optical die. The supporting structure is disposed on the optical die, where the electric die is disposed between the supporting structure and the optical die. The lens structure is disposed on the supporting structure and optically coupled to the photonic region of the optical die, where the supporting structure is disposed between the lens structure and the electric die.

Inventors

Yi-Jung Chen
Tsung-Fu Tsai
Szu-Wei Lu
Wei-An Tsao
Che-Yuan YANG
Chien-Ting Chen
Chih-Chieh Hung

Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Dates

Publication Date: 20260512
Application Date: 20220513

Claims (20)

1 . A package structure, comprising: an optical die, comprising a photonic region; an electric die, disposed on and electrically coupled to the optical die; a supporting structure, disposed on the optical die, the electric die being disposed between the supporting structure and the optical die along a stacking direction of the optical die and the electric die; and a lens structure, disposed on the supporting structure and optically coupled to the photonic region of the optical die, the supporting structure being disposed between the lens structure and the electric die along the stacking direction.
2 . The package structure of claim 1 , wherein the lens structure is embedded inside the supporting structure.
3 . The package structure of claim 2 , wherein an outermost surface of the lens structure is lower than an outermost surface of the supporting structure.
4 . The package structure of claim 2 , wherein an outermost surface of the lens structure is substantially the same as an outermost surface of the supporting structure.
5 . The package structure of claim 2 , wherein an outermost surface of the lens structure is above an outermost surface of the supporting structure.
6 . The package structure of claim 1 , wherein the lens structure is disposed atop of an outermost surface of the supporting structure.
7 . The package structure of claim 1 , further comprising: an insulating encapsulation, laterally encapsulating the electric die and covering a portion of the optical die exposed by the electric die, wherein a sidewall of the package structure comprises a sidewall of the insulating encapsulation, a sidewall of the optical die, and a sidewall of the supporting structure.
8 . The package structure of claim 7 , further comprising: a first optical film, disposed between the insulating encapsulation and the supporting structure, the first optical film is in contact with the electric die; and a second optical film, disposed on the supporting structure, the supporting structure being between the first optical film and the second optical film, wherein an outermost surface of the lens structure and an outermost surface of the supporting structure are covered by the second optical film, wherein the sidewall of the package structure further comprises a sidewall of the first optical film and a sidewall of the second optical film.
9 . The package structure of claim 8 , further comprising: conductive terminals, disposed on and electrically coupled to the optical die, the optical die being between the conductive terminals and the electric die; and a protection layer, disposed on the second optical film, the second optical film being between the supporting structure and the protection layer, wherein the sidewall of the package structure further comprises a sidewall of the protection layer.
10 . The package structure of claim 9 , further comprising: a redistribution circuit structure, disposed on and electrically coupled to the optical die, the redistribution circuit structure being between and electrically coupling the optical die and the conductive terminals, wherein the sidewall of the package structure further comprises a sidewall of the redistribution circuit structure.
11 . A method of manufacturing a package structure, comprising: providing an optical die comprising a photonic region; disposing at least one electric die over the optical die, the electric die being electrically coupled to the optical die; laterally encapsulating the at least one electric die in an insulating encapsulation; disposing a supporting structure over the at least one electric die, the electric die being disposed between the supporting structure and the optical die along a stacking direction of the optical die and the electric die; and forming a lens structure over the supporting structure and being optically coupled to the photonic region of the optical die, the supporting structure being disposed between the lens structure and the electric die along the stacking direction.
12 . The method of claim 11 , wherein forming the lens structure over the supporting structure comprises: forming a photoresist layer over the supporting structure, a positioning location of the photoresist layer being within a positioning location of the photonic region in a vertical projection on the optical die along the stacking direction; reshaping, by a reflowing process, the photoresist layer into a hemispherical shape; and patterning, using the reshaped photoresist layer as a mask, the supporting structure to form the lens structure over the supporting structure, wherein in the patterning, the reshaped photoresist layer and a portion of the supporting structure are removed.
13 . The method of claim 12 , forming the lens structure over the supporting structure further comprises: forming a hard mask layer having a first opening over the supporting structure prior to forming the photoresist layer, a positioning location of the first opening being within the positioning location of the photonic region in the vertical projection on the optical die along the stacking direction, wherein: forming the photoresist layer over the supporting structure comprises disposing the photoresist layer in the first opening of the hard mask layer, and in the patterning, the hard mask layer, the reshaped photoresist layer and a portion of the supporting structure are removed.
14 . The method of claim 11 , further comprising: deposing a first optical film over the at least one electric die and the insulating encapsulation prior to disposing the supporting structure over the at least one electric die; deposing a second optical film over the lens structure and the supporting structure; forming a protection layer over the second optical film, the second optical film being disposed between the protection layer and the lens structure; and forming conductive terminals over the photonic die after forming the protection layer, the conductive terminals being electrically coupled to the photonic die.
15 . The method of claim 14 , further comprising: disposing a redistribution circuit structure on the photonic die after forming the protection layer and prior to forming the conductive terminals, the conductive terminals being electrically coupled to the photonic die through the redistribution circuit structure.
16 . A package structure, comprising: an optical die, comprising a photonic region; an electric die, disposed over and electrically coupled to the optical die, wherein the electric die has a first surface distributed with conductors and a second surface opposite to the first surface, the first surface is closer to the optical die than the second surface along a stacking direction of the optical die and the electric die; a supporting structure, disposed over the optical die, the electric die being disposed between the supporting structure and the optical die; and a lens structure, disposed over the supporting structure and optically coupled to the photonic region of the optical die, the supporting structure being disposed between the lens structure and the electric die.
17 . The package structure of claim 16 , wherein the lens structure is embedded inside the supporting structure or the lens structure is disposed atop of an outermost surface of the supporting structure.
18 . The package structure of claim 16 , further comprising: an insulating encapsulation, encapsulating the electric die and covering a portion of the optical die exposed by the electric die, wherein a sidewall of the package structure comprises a sidewall of the insulating encapsulation, a sidewall of the optical die, and a sidewall of the supporting structure.
19 . The package structure of claim 16 , further comprising: a first optical film, disposed between the electric die and the supporting structure, the first optical film is in contact with the electric die and the supporting structure; and a second optical film, disposed over the supporting structure, the supporting structure being between the first optical film and the second optical film, wherein an outermost surface of the lens structure and an outermost surface of the supporting structure are in contact with the second optical film, wherein a sidewall of the package structure comprises a sidewall of the optical die, a sidewall of the supporting structure, a sidewall of the first optical film, and a sidewall of the second optical film.
20 . The package structure of claim 16 , further comprising: a redistribution circuit structure, disposed over and electrically coupled to the optical die, the optical die being between and electrically coupling the redistribution circuit structure and the electric die, conductive terminals, disposed over and electrically coupled to the redistribution circuit structure, the redistribution circuit structure being between and electrically coupling the optical die and the conductive terminals; and a protection layer, disposed over the supporting structure, the supporting structure being between the electric die and the protection layer, wherein a sidewall of the package structure comprises a sidewall of the optical die, a sidewall of the supporting structure, a sidewall of the redistribution circuit structure, and a sidewall of the protection layer.

Description

BACKGROUND Electrical signaling and processing have been the mainstream techniques for signal transmission and processing. Optical signaling and processing have been used in increasingly more applications in recent years, particularly due to the use of optical fiber-related applications for signal transmission. The optical signaling and processing are almost always combined with electrical signaling and processing to provide full-fledged applications. For example, the optical fibers may be used for long-range signal transmission, while electrical signals may be used for short-range signal transmission as well as processing and controlling. Accordingly, the devices integrating optical components and electrical components are formed for the conversion between optical signals and electrical signals, as well as the processing of optical signals and electrical signals. Packages thus may include both optical (photonic) dies including optical devices and electronic dies including electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. FIG. 1 through FIG. 22 are schematic cross-sectional views or top views of various stages in a manufacturing method of a package structure in accordance with some embodiments of the disclosure. FIG. 23 is a schematic cross-sectional view of a package structure in accordance with some embodiments of the disclosure. FIG. 24 through FIG. 30 are schematic cross-sectional views or top views of various stages in a manufacturing method of a package structure in accordance with some embodiments of the disclosure. FIG. 31 is a schematic cross-sectional view of a package structure in accordance with some embodiments of the disclosure. FIG. 32 is a schematic cross-sectional view of a package structure in accordance with some embodiments of the disclosure. DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components, values, operations, materials, arrangements, or the like, are described below to simplify the disclosure. These are, of course, merely examples and are not intended to be limiting. Other components, values, operations, materials, arrangements, or the like, are contemplated. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. In addition, terms, such as “first”, “second”, and the like, may be used herein for ease of description to describe similar or different element(s) or feature(s) as illustrated in the figures, and may be used interchangeably depending on the order of the presence or the contexts of the description. Other features and processes may also be included. For example, testing structures may be included to aid in the verification testing of the 3D packaging or 3DIC devices. The testing structures may include, for example, test pads formed in a redistribution layer or on a substrate that allows the testing of the 3D packaging or 3DIC, the use of probes and/or probe cards, and the like. The verification testing may be performed on intermediate structures as well as the final structure. Additionally, the structures and methods disclosed herein may be used in conjunction with testing methodologies that incorporate intermediate verification of known good dies to increase the yield and decrease costs. FIG. 1, FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6, FIG. 7, FIG. 8, FIG. 9, FIG. 10, FIG. 11, FIG. 13, FIG. 16