US-12628462-B2 - Image sensor package

US12628462B2US 12628462 B2US12628462 B2US 12628462B2US-12628462-B2

Abstract

An image sensor package is provided. The image sensor package includes an image sensor, a substrate on which the image sensor is disposed on a first surface of the substrate and a receiving groove is disposed in a second surface of the surface, and a heat dissipation element including a heat absorption portion configured to absorb heat from a contact surface and a heat emission portion configured to emit heat absorbed by the heat absorption portion, and coupled to the second surface of the substrate, wherein, in the heat dissipation element, at least a portion of the heat absorption portion is accommodated in the receiving groove and coupled to the substrate.

Inventors

Eun Bae PARK

Assignees

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Dates

Publication Date: 20260512
Application Date: 20220921
Priority Date: 20211228

Claims (16)

1 . An image sensor package, comprising: an image sensor; a substrate comprising the image sensor disposed on a first surface of the substrate, and a receiving groove disposed in a second surface of the substrate; and a heat dissipation element comprising a heat absorption portion configured to absorb heat dissipating from a contact surface, and a heat emission portion configured to emit heat absorbed by the heat absorption portion, wherein, the first surface of the substrate and the second surface of the substrate face each other in an optical axis direction, wherein, in the heat dissipation element, the heat absorption portion is spaced apart from the image sensor and is disposed in the second surface of the substrate, wherein, in the heat dissipation element, at least a portion of the heat absorption portion is accommodated in the receiving groove and coupled to the substrate, wherein the heat absorption portion is disposed on a first surface of the heat dissipation element, and the heat emission portion is disposed on a second surface of the heat dissipation element, and wherein the heat emission portion is entirely disposed externally of the receiving groove.
2 . The image sensor package of claim 1 , wherein the heat dissipation element is coupled to the second surface of the substrate.
3 . The image sensor package of claim 1 , further comprising: a bonding member interposed between the substrate and the heat absorption portion and configured to bond the substrate to the heat absorption portion.
4 . The image sensor package of claim 3 , wherein the bonding member is formed of a conductive material.
5 . The image sensor package of claim 3 , wherein the bonding member is disposed on an entire surface of the heat absorption portion.
6 . The image sensor package of claim 1 , further comprising: a bonding member disposed along a side surface of the heat dissipation element externally of the receiving groove, and configured to bond the heat dissipation element to the substrate.
7 . The image sensor package of claim 6 , wherein the bonding member is disposed to cover an entire surface of the heat absorption portion exposed externally of the receiving groove.
8 . The image sensor package of claim 6 , wherein the bonding member is formed of an adhesive including an epoxy resin.
9 . The image sensor package of claim 6 , wherein the bonding member is configured to seal an internal space of the receiving groove.
10 . The image sensor package of claim 9 , further comprising: a thermally conductive material that is filled in an internal space of the receiving groove.
11 . The image sensor package of claim 1 , wherein at least a portion of the receiving groove is formed in a region opposing the image sensor.
12 . The image sensor package of claim 1 , wherein a shortest distance between the image sensor and the heat dissipation element is disposed to be shorter than a thickness of the substrate.
13 . The image sensor package of claim 1 , wherein an entire side surface of the heat absorption portion is bonded to an internal surface of the receiving groove.
14 . An image sensor package, comprising: a substrate comprising an image sensor disposed on a first surface of the substrate and a receiving groove disposed in a second surface of the substrate; a heat dissipation element inserted into the receiving groove; and a bonding member configured to bond the heat dissipation element to the substrate, wherein the heat dissipation element comprises a heat absorption portion configured to absorb heat from a contact surface, and a heat emission portion configured to emit heat absorbed by the heat absorption portion, and wherein contact between the heat absorption portion and air is blocked by the bonding member.
15 . The image sensor package of claim 14 , wherein the bonding member is filed in an internal space of the receiving groove.
16 . The image sensor package of claim 14 , wherein the bonding member is configured to seal an internal space of the receiving groove.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit under 35 USC § 119(a) of Korean Patent Application No. 10-2021-0189983, filed on Dec. 28, 2021, in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes. BACKGROUND 1. Field The following description relates to an image sensor package. 2. Description of Related Art Camera modules may include an optical imaging system and an image sensor including one or more lenses. An optical imaging system may include one or more lenses having refractive power, and may allow light reflected from a subject to be focused on an image sensor. An image sensor may convert an optical signal refracted by an optical imaging system into an electrical signal. Such camera modules may generate heat in an image sensor due to repeated imaging. Thus, it may be beneficial to implement camera modules which may effectively dissipate the heat of an image sensor. SUMMARY This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter. In a general aspect, an image sensor package includes an image sensor; a substrate comprising the image sensor disposed on a first surface of the substrate, and a receiving groove disposed in a second surface of the substrate; and a heat dissipation element comprising a heat absorption portion configured to absorb heat dissipating from a contact surface, and a heat emission portion configured to emit heat absorbed by the heat absorption portion, wherein, in the heat dissipation element, at least a portion of the heat absorption portion is accommodated in the receiving groove and coupled to the substrate. The heat dissipation element may be coupled to the second surface of the substrate. The heat absorption portion may be disposed on a first surface of the heat dissipation element, and the heat emission portion is disposed on a second surface of the heat dissipation element, and the heat emission portion is entirely disposed externally of the receiving groove. A bonding member may be interposed between the substrate and the heat absorption portion and configured to bond the substrate to the heat absorption portion. The bonding member may be formed of a conductive material. The bonding member may be disposed on an entire surface of the heat absorption portion. A bonding member may be disposed along a side surface of the heat dissipation element externally of the receiving groove, and configured to bond the heat dissipation element to the substrate. The bonding member may be disposed to cover an entire surface of the heat absorption portion exposed externally of the receiving groove. The bonding member may be formed of an adhesive including an epoxy resin. The bonding member may be configured to seal an internal space of the receiving groove. The image sensor package may include a thermally conductive material that is filled in an internal space of the receiving groove. At least a portion of the receiving groove may be formed in a region opposing the image sensor. A shortest distance between the image sensor and the heat dissipation element may be disposed to be shorter than a thickness of the substrate. An entire side surface of the heat absorption portion may be bonded to an internal surface of the receiving groove. In a general aspect, an image sensor package includes a substrate including an image sensor disposed on a first surface of the substrate and a receiving groove disposed in a second surface of the substrate; a heat dissipation element inserted into the receiving groove; and a bonding member configured to bond the heat dissipation element to the substrate, wherein the heat dissipation element includes a heat absorption portion configured to absorb heat from a contact surface, and a heat emission portion configured to emit heat absorbed by the heat absorption portion, and wherein contact between the heat absorption portion and air is blocked by the bonding member. The bonding member may be filled in an internal space of the receiving groove. The bonding member may be configured to seal an internal space of the receiving groove. Other features and aspects will be apparent from the following detailed description, the drawings, and the claims. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 illustrates a cross-sectional diagram of an example camera module, in accordance with one or more embodiments. FIG. 2 illustrates an enlarged cross-sectional diagram of a portion A in FIG. 1. FIG. 3 illustrates an exploded diagram of the example image sensor package illustrated in FIG. 1. FIG. 4 illustrates a cross-sectional diagram of an example camera module, in accordance with one or more embodiments. FIG.