US-12628514-B2 - Display substrate, manufacturing method therefor, and display apparatus

Abstract

A display substrate, a manufacturing method therefor, and a display apparatus are disclosed. A display substrate includes a drive circuit layer disposed on a base substrate, the base substrate includes, at least, a first flexible layer, a second flexible layer and a base substrate conductive layer disposed between the first flexible layer and the second flexible layer. The base substrate conductive layer includes, at least, a first connection line, the drive circuit layer includes, at least, a shielding conductive layer and a functional conductive layer, wherein the shielding conductive layer includes, at least, a second connection line, and the functional conductive layer includes, at least, a function signal line. The second connection line is connected with the first connection line through the first lap via, and the function signal line is connected with the second connection line through the second lap via.

Inventors

• Yunpeng Zhang
• Yucheng CHAN
• Chengchung YANG
• Yangzhong Jing

Assignees

• CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
• BOE TECHNOLOGY GROUP CO., LTD.

Dates

Publication Date

20260512

Application Date

20220420

Claims (19)

1. 1 . A display substrate, comprising a drive circuit layer disposed on a base substrate that comprises, at least, a first flexible layer, a second flexible layer and a base substrate conductive layer disposed between the first flexible layer and the second flexible layer, wherein the base substrate conductive layer comprises, at least, a first connection line; the drive circuit layer at least comprises a shielding conductive layer disposed on the base substrate and a functional conductive layer disposed on a side of the shielding conductive layer away from the base substrate, wherein the shielding conductive layer at least comprises a second connection line, and the functional conductive layer comprises, at least, a function signal line; the second connection line is connected with the first connection line through a first lap via, and the function signal line is connected with the second connection line through a second lap via, wherein the display substrate comprises a display region and a bonding region disposed on a side of the display region; the display region comprises, at least, a plurality of circuit units, the bonding region comprises, at least, a lead region and a bending region disposed sequentially in a direction away from the display region, the first lap via is disposed in the lead region, and the second lap via is disposed in the display region.
2. 2 . The display substrate of claim 1 , wherein in a direction parallel to the display substrate, the drive circuit layer comprises a plurality of circuit units, and at least one of the circuit units comprises a pixel drive circuit that is connected with the function signal line.
3. 3 . The display substrate of claim 2 , wherein the function signal line comprises a data signal line that provides a data signal to the pixel drive circuit.
4. 4 . The display substrate of claim 2 , wherein the function signal line comprises a first power supply line that provides a power supply signal to the pixel drive circuit.
5. 5 . The display substrate of claim 1 , wherein the drive circuit layer comprises, at least, the shielding conductive layer, a first insulation layer, a semiconductor layer, a second insulation layer, a first conductive layer, a third insulation layer, a second conductive layer, a fourth insulation layer and a third conductive layer, wherein the functional conductive layer comprises the third conductive layer.
6. 6 . The display substrate of claim 5 , wherein in a region where the first lap via is located, a plurality of inorganic layers are disposed on a side of the second connection line away from the base substrate, and the plurality of inorganic layers comprise any one or more of the first insulation layer, the second insulation layer, the third insulation layer and the fourth insulation layer.
7. 7 . The display substrate of claim 1 , wherein the base substrate further comprises a first barrier layer disposed between the first flexible layer and the base substrate conductive layer, and a second barrier layer disposed on a side of the second flexible layer away from the first flexible layer.
8. 8 . The display substrate of claim 7 , wherein the first lap via is provided on the second flexible layer and the second barrier layer, an inner wall of the first lap via comprises the second flexible layer and the second barrier layer, and the second connection line covers the inner wall of the first lap via.
9. 9 . The display substrate of claim 7 , wherein, the first lap via comprises a first lap sub-hole and a second lap sub-hole, wherein the first lap sub-hole is disposed on the second flexible layer, an inner wall of the first lap sub-hole comprises the second flexible layer, the second barrier layer covers the inner wall of the first lap sub-hole, the second lap sub-hole is disposed on the second barrier layer, an inner wall of the second lap sub-hole comprises the second barrier layer, and the second connection line covers the inner wall of the second lap sub-hole.
10. 10 . The display substrate of claim 9 , wherein the first lap sub-hole exposes a surface of the first connection line and a partial surface of the first barrier layer, and the second barrier layer covers the inner wall of the first lap sub-hole and a surface of the first barrier layer exposed by the first lap sub-hole.
11. 11 . The display substrate of claim 1 , wherein the lead region comprises an encapsulated region and a non-encapsulated region that are sequentially disposed in a direction away from the display region, and the first lap via is disposed in the non-encapsulated region.
12. 12 . The display substrate of claim 1 , wherein a base substrate of the bending region comprises a first flexible layer, a first barrier layer, a base substrate conductive layer, and a second flexible layer.
13. 13 . A display substrate, comprising a drive circuit layer disposed on a base substrate that comprises, at least, a first flexible layer, a second flexible layer and a base substrate conductive layer disposed between the first flexible layer and the second flexible layer, wherein the base substrate conductive layer comprises, at least, a first connection line; the drive circuit layer at least comprises a shielding conductive layer disposed on the base substrate and a functional conductive layer disposed on a side of the shielding conductive layer away from the base substrate, wherein the shielding conductive layer at least comprises a second connection line, and the functional conductive layer comprises, at least, a function signal line; the second connection line is connected with the first connection line through a first lap via, and the function signal line is connected with the second connection line through a second lap via, wherein the display substrate comprises a display region and a bonding region disposed on a side of the display region; the display region comprises, at least, a plurality of circuit units, at least one of the plurality of circuit units comprises, at least, a pixel drive circuit that is connected with a data signal line configured to provide a data signal to the pixel drive circuit; the bonding region comprises, at least, a lead region and a bending region disposed sequentially in a direction away from the display region, the first lap via and the second lap via are disposed in the display region.
14. 14 . The display substrate of claim 13 , wherein the second connection line comprises, at least, a connection block, a first sub-line and a second sub-line, wherein the connection block is connected with the first connection line through the first lap via, a first end of the first sub-line is connected with the connection block, a second end of the first sub-line is connected with a first end of the second sub-line after extending in an opposite direction of the first direction, and a second end of the second sub-line is connected with the function signal line through the second lap via after extending in an opposite direction of the second direction.
15. 15 . The display substrate of claim 14 , wherein a first distance between an edge of the first lap via on a side close to the second sub-line and an edge of the second sub-line on a side close to the first lap via, the first distance is 0.1 M1 to 0.5 M1, and M1 is a length of the circuit unit in the first direction.
16. 16 . The display substrate of claim 15 , wherein the first distance is 6 μm to 30 μm.
17. 17 . The display substrate of claim 14 , wherein a second distance between an edge of the second lap via on a side close to the first sub-line and an edge of the first sub-line on a side close to the second lap via is 0.2 M2 to 1.2 M2, wherein M2 is a length of the circuit unit in the second direction.
18. 18 . The display substrate of claim 17 , wherein the second distance is 6 μm to 70 μm.
19. 19 . A manufacturing method for a display substrate, comprising: forming a base substrate, wherein the base substrate comprises, at least, a first flexible layer, a second flexible layer, and a base substrate conductive layer disposed between the first flexible layer and the second flexible layer, the base substrate conductive layer comprises, at least, a data connection line; and forming a drive circuit layer on the base substrate, wherein the drive circuit layer comprises, at least, a shielding conductive layer disposed on the base substrate and a functional conductive layer disposed on a side of the shielding conductive layer away from the base substrate, the shielding conductive layer comprises, at least, a second connection line, the functional conductive layer comprises, at least, a function signal line, the second connection line is connected with the first connection line through a first lap via, and the function signal line is connected with the second connection line through a second lap via, wherein the display substrate comprises a display region and a bonding region disposed on a side of the display region; the display region comprises, at least, a plurality of circuit units, the bonding region comprises, at least, a lead region and a bending region disposed sequentially in a direction away from the display region, the first lap via is disposed in the lead region, and the second lap via is disposed in the display region, or wherein the display substrate comprises a display region and a bonding region disposed on a side of the display region; the display region comprises, at least, a plurality of circuit units, at least one of the plurality of circuit units comprises, at least, a pixel drive circuit that is connected with a data signal line that provides a data signal to the pixel drive circuit; the bonding region comprises, at least, a lead region and a bending region disposed sequentially in a direction away from the display region, the first lap via and the second lap via are disposed in the display region.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a U.S. National Phase Entry of International Application PCT/CN2022/088012 having an international filing date of Apr. 20, 2022, and the contents disclosed in the above-mentioned application are hereby incorporated as a part of this application. TECHNICAL FIELD The present disclosure relates to, but is not limited to, the field of display technologies, and particularly to a display substrate, a manufacturing method therefor, and a display apparatus. BACKGROUND An Organic Light Emitting Diode (OLED for short) and a Quantum dot Light Emitting Diode (QLED for short) are active light emitting display devices and have advantages such as self-luminescence, a wide viewing angle, a high contrast ratio, low power consumption, extremely high response speed, lightness and thinness, flexibility, and low cost. With constant development of display technologies, a flexible display that uses an OLED or a QLED as a light emitting device and performs signal control by a Thin Film Transistor (TFT for short) has become a mainstream product in the field of display at present. SUMMARY The following is a summary of subject matters described herein in detail. The summary is not intended to limit the protection scope of claims. In one aspect, a display substrate is provided in the present disclosure, which includes a drive circuit layer disposed on the base substrate that includes, at least, a first flexible layer, a second flexible layer and a base substrate conductive layer disposed between the first flexible layer and the second flexible layer, wherein the base substrate conductive layer includes, at least, a first connection line; the drive circuit layer includes, at least, a shielding conductive layer disposed on the base substrate and a functional conductive layer disposed on a side of the shielding conductive layer away from the base substrate, wherein the shielding conductive layer includes, at least, a second connection line, and the functional conductive layer includes, at least, a function signal line; the second connection line is connected with the first connection line through a first lap via, and the function signal line is connected with the second connection line through a second lap via. In an exemplary implementation, in a direction parallel to the display substrate, the drive circuit layer includes a plurality of circuit units, and at least one of the sub-pixels includes a pixel drive circuit that is connected with the function signal line. In an exemplary embodiment, the function signal line includes a data signal line that provides a data signal to the pixel drive circuit. In an exemplary implementation, the function signal line includes a first power supply line that provides a power supply signal to the pixel drive circuit. In an exemplary implementation, the drive circuit layer includes, at least, a shielding conductive layer, a first insulation layer, a semiconductor layer, a second insulation layer, a first conductive layer, a third insulation layer, a second conductive layer, a fourth insulation layer and a third conductive layer, wherein the functional conductive layer includes the third conductive layer. In an exemplary implementation, in a region where the first lap via is located, a plurality of inorganic layers are disposed on a side of the second connection line away from the base substrate, and the plurality of inorganic layers include any one or more of the first insulation layer, the second insulation layer, the third insulation layer and the fourth insulation layer. In an exemplary implementation, the base substrate further includes a first barrier layer disposed between the first flexible layer and the base substrate conductive layer, and a second barrier layer disposed on a side of the second flexible layer away from the first flexible layer. In an exemplary implementation, the first lap via is disposed on the second flexible layer and the second barrier layer, the inner wall of the first lap via includes the second flexible layer and the second barrier layer, and the second connection line covers the inner wall of the first lap via. In an exemplary implementation, the first lap via includes a first lap sub-hole and a second lap sub-hole, wherein the first lap sub-hole is disposed on the second flexible layer, the inner wall of the first lap sub-hole includes the second flexible layer, the second barrier layer covers the inner wall of the first lap sub-hole, the second lap sub-hole is disposed on the second barrier layer, the inner wall of the second lap sub-hole includes the second barrier layer, and the second connection line covers the inner wall of the second lap sub-hole. In an exemplary implementation, the first lap sub-hole exposes a surface of the first connection line and a partial surface of the first barrier layer, and the second barrier layer covers the inner wall of the first lap sub-hole and the surface of the fi