US-12628530-B2 - Display substrate, preparation method therefor, and display apparatus

Abstract

The present disclosure provides a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a pixel region and a stretching hole region located outside the pixel region, the stretch hole region includes a hole region and a partition region surrounding the hole region, the partition region includes a base substrate, a partition structure layer disposed on the base substrate and surrounding the hole region, an encapsulation structure layer disposed on the partition structure layer, and a sensing structure layer disposed on the encapsulation structure layer, the partition region further includes a first organic dielectric layer located between the encapsulation structure layer and the sensing structure layer, a side of the first organic dielectric layer close to the hole region covers side surfaces of sides of the partition structure layer and the encapsulation structure layer that are close to the hole region.

Inventors

• Pinfan WANG
• Zunqing SONG
• Bingwei WANG

Assignees

• BOE TECHNOLOGY GROUP CO., LTD.

Dates

Publication Date

20260512

Application Date

20221031

Claims (20)

1. 1 . A display substrate, comprising a pixel region and a stretching hole region located outside the pixel region, wherein the stretching hole region comprises a hole region and a partition region surrounding the hole region, the partition region comprises a base substrate, a partition structure layer disposed on the base substrate and surrounding the hole region, an encapsulation structure layer disposed on the partition structure layer, and a sensing structure layer disposed on the encapsulation structure layer, the partition region further comprises a first organic dielectric layer located between the encapsulation structure layer and the sensing structure layer, a side of the first organic dielectric layer close to the hole region covers a side surface of a side of the partition structure layer close to the hole region and a side surface of a side of the encapsulation structure layer close to the hole region.
2. 2 . The display substrate of claim 1 , wherein a side surface of the side of the first organic dielectric layer close to the hole region is at least partially flush with an inner wall of the hole region; or the partition structure layer comprises a first partition layer surrounding the hole region and a second partition layer disposed on the first partition layer, a first partition hole surrounding the hole region is disposed on the first partition layer, a second partition hole surrounding the hole region is disposed on the second partition layer, and the second partition hole and the first partition hole are communicated to form a partition groove surrounding the hole region.
3. 3 . The display substrate of claim 1 , wherein the partition region further comprises a first composite insulation layer surrounding the hole region, the first composite insulation layer is located between the partition structure layer and the base substrate, and a side of the first composite insulation layer close to the hole region exposes a base substrate located around the hole region.
4. 4 . The display substrate of claim 3 , wherein the side of the first organic dielectric layer close to the hole region covers a side surface of the side of the first composite insulation layer close to the hole region, and the side of the first organic dielectric layer close to the hole region covers the base substrate exposed by the first composite insulation layer.
5. 5 . The display substrate of claim 3 , wherein the partition region further comprises a second composite insulation layer surrounding the hole region, the second composite insulation layer is located between the first composite insulation layer and the partition structure layer, and a side of the second composite insulation layer close to the hole region and the side of the partition structure layer close to the hole region expose a portion of the side of the first composite insulation layer close to the hole region.
6. 6 . The display substrate of claim 5 , wherein the side of the first organic dielectric layer close to the hole region covers a side surface of the side of the second composite insulation layer close to the hole region and the side surface of the side of the partition structure layer close to the hole region; or a partial film layer of the side of the encapsulation structure layer close to the hole region covers a side surface of the side of the second composite insulation layer close to the hole region and the side surface of the side of the partition structure layer close to the hole region, and extends to a partial surface of the side of the first composite insulation layer close to the hole region, and the partial film layer of the side of the encapsulation structure layer close to the hole region exposes a portion of the side of the first composite insulation layer close to the hole region.
7. 7 . The display substrate of claim 1 , wherein the sensing structure layer comprises a first conductive layer, a second conductive layer, and a second organic dielectric layer located between the first conductive layer and the second conductive layer; the second conductive layer is located at a side of the first conductive layer away from the base substrate.
8. 8 . The display substrate of claim 7 , wherein a side of the second organic dielectric layer close to the hole region exposes a portion of the side of the first organic dielectric layer close to the hole region.
9. 9 . The display substrate of claim 7 , wherein the first conductive layer comprises a first sensing electrode and a shielding layer; the shielding layer is located at a side of the first sensing electrode close to the hole region, and a side surface of a side of the shielding layer close to the hole region is flush with a side surface of a side of the second organic dielectric layer close to the hole region.
10. 10 . The display substrate of claim 9 , wherein the second conductive layer comprises a second sensing electrode, and the first sensing electrode is electrically connected with the second sensing electrode.
11. 11 . The display substrate of claim 7 , wherein the partition region further comprises an optical structure layer disposed at a side of the sensing structure layer away from the base substrate.
12. 12 . The display substrate of claim 11 , wherein the partition region further comprises a third organic dielectric layer, and the third organic dielectric layer is disposed between the sensing structure layer and the optical structure layer.
13. 13 . The display substrate of claim 12 , wherein the pixel region comprises a light emitting structure layer, the light emitting structure layer comprises a light emitting layer, the optical structure layer and the third organic dielectric layer cover the light emitting layer, a groove is disposed in the third organic dielectric layer, and there is an overlapping region between orthographic projections of the groove and the light emitting layer on the base substrate.
14. 14 . The display substrate of claim 12 , wherein a side surface of a side of the optical structure layer close to the hole region is flush with a side surface of a side of the third organic dielectric layer close to the hole region.
15. 15 . The display substrate of claim 14 , wherein the side of the optical structure layer close to the hole region and the side of the third organic dielectric layer close to the hole region expose a portion of a side of the second organic dielectric layer close to the hole region.
16. 16 . The display substrate of claim 12 , wherein the partition region further comprises a protective structure layer disposed at a side of the optical structure layer away from the base substrate; a side of the protective structure layer close to the hole region covers a side surface of a side of the optical structure layer close to the hole region and a side surface of a side of the third organic dielectric layer close to the hole region.
17. 17 . The display substrate of claim 16 , wherein the sensing structure layer comprises a first conductive layer, a second conductive layer, and a second organic dielectric layer located between the first conductive layer and the second conductive layer, the second conductive layer is located at a side of the first conductive layer away from the base substrate, and the side of the protective structure layer close to the hole region exposes a portion of a side of the second organic dielectric layer close to the hole region.
18. 18 . A display apparatus, comprising the display substrate according to claim 1 .
19. 19 . A method for preparing a display substrate, wherein the display substrate comprises a pixel region and a stretching hole region located outside the pixel region, the stretching hole region comprises a hole region and a partition region surrounding the hole region, and the method for preparing the display substrate comprises: forming a partition structure layer surrounding the hole region in the partition region; forming an encapsulation structure layer disposed on the partition structure layer in the partition region; forming a first organic dielectric layer disposed on the encapsulation structure layer in the partition region; forming a sensing structure layer disposed on the first organic dielectric layer in the partition region; wherein a side of the first organic dielectric layer close to the hole region covers a side surface of a side of the partition structure layer close to the hole region and a side surface of a side of the encapsulation structure layer close to the hole region.
20. 20 . The method for preparing the display substrate of claim 19 , wherein the sensing structure layer comprises a shielding layer, and the forming the first organic dielectric layer disposed on the encapsulation structure layer in the partition region comprises: forming a first mask layer disposed on the sensing structure layer in the partition region, and using the shielding layer as a second mask layer; removing first organic dielectric layer, that is shielded by the first mask layer and the second mask layer, with a dry etching process; and removing the first mask layer and a portion of the shielding layer with a wet etching process.

Description

CROSS-REFERENCE TO RELATED APPLICATION The present application is a U.S. National Phase Entry of International Application No. PCT/CN2022/128568 having an international filing date of Oct. 31, 2022, the content of which is incorporated into this application by reference. TECHNICAL FIELD The present disclosure relates to, but is not limited to, the field of display technologies, and in particular to a display substrate, a method for preparing the display substrate, and a display apparatus. BACKGROUND An Organic Light Emitting Diode (OLED for short) is an active light emitting display device, which has advantages of auto-luminescence, a wide viewing angle, a high contrast ratio, low power consumption, an extremely high response speed, lightness and thinness, bendability, and a low cost, etc. With continuous development of display technologies, a flexible display that uses an OLED as a light emitting device and a Thin Film Transistor (TFT) to perform signal control has become a mainstream product in the field of display at present. SUMMARY The following is a summary of subject matter described herein in detail. The summary is not intended to limit the protection scope of claims. In one aspect, the present disclosure provides a display substrate, including a pixel region and a stretching hole region located outside the pixel region, wherein the stretching hole region includes a hole region and a partition region surrounding the hole region, the partition region includes a base substrate, a partition structure layer disposed on the base substrate and surrounding the hole region, an encapsulation structure layer disposed on the partition structure layer, and a sensing structure layer disposed on the encapsulation structure layer, the partition region further includes a first organic dielectric layer located between the encapsulation structure layer and the sensing structure layer, a side of the first organic dielectric layer close to the hole region covers a side surface of a side of the partition structure layer close to the hole region and a side surface of a side of the encapsulation structure layer close to the hole region. In an exemplary embodiment, a side surface of the side of the first organic dielectric layer close to the hole region is at least partially flush with an inner wall of the hole region. In an exemplary embodiment, the partition region further includes a first composite insulation layer surrounding the hole region, the first composite insulation layer is located between the partition structure layer and the base substrate, and a side of the first composite insulation layer close to the hole region exposes a base substrate located around the hole region. In an exemplary embodiment, the side of the first organic dielectric layer close to the hole region covers a side surface of the side of the first composite insulation layer close to the hole region, and the side of the first organic dielectric layer close to the hole region covers the base substrate exposed by the first composite insulation layer. In an exemplary embodiment, the partition region further includes a second composite insulation layer surrounding the hole region, the second composite insulation layer is located between the first composite insulation layer and the partition structure layer, and a side of the second composite insulation layer close to the hole region and the side of the partition structure layer close to the hole region expose a portion of the side of the first composite insulation layer close to the hole region. In an exemplary embodiment, the side of the first organic dielectric layer close to the hole region covers a side surface of the side of the second composite insulation layer close to the hole region and the side surface of the side of the partition structure layer close to the hole region. In an exemplary embodiment, the partition structure layer includes a first partition layer surrounding the hole region and a second partition layer disposed on the first partition layer, a first partition hole surrounding the hole region is disposed on the first partition layer, a second partition hole surrounding the hole region is disposed on the second partition layer, and the second partition hole and the first partition hole are communicated to form a partition groove surrounding the hole region. In an exemplary embodiment, a partial film layer of the side of the encapsulation structure layer close to the hole region covers a side surface of the side of the second composite insulation layer close to the hole region and the side surface of the side of the partition structure layer close to the hole region and extends to a partial surface of the side the first composite insulation layer close to the hole region, and the partial film layer of the side of the encapsulation structure layer close to the hole region exposes a portion of the side of the first composite insulation layer close to the hole region. In an exem