US-12628614-B2 - Bonding apparatus, bonding system, and bonding method

US12628614B2US 12628614 B2US12628614 B2US 12628614B2US-12628614-B2

Abstract

A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; a first moving mechanism configured to move the two imaging units along a first direction in a planar region between the first holder and the second holder; a second moving mechanism configured to move the first imaging unit along a second direction orthogonal to the first direction; and a third moving mechanism configured to move the second imaging unit along the second direction.

Inventors

Yutaka Yamasaki
Takashi Terada

Assignees

TOKYO ELECTRON LIMITED

Dates

Publication Date: 20260512
Application Date: 20200427
Priority Date: 20190508

Claims (11)

1 . A bonding apparatus configured to bond a first substrate and a second substrate, comprising: a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; a first moving mechanism configured to move the two imaging units along a first direction in a planar region between the first holder and the second holder; a second moving mechanism configured to move the first imaging unit of the two imaging units along a second direction orthogonal to the first direction; and a third moving mechanism configured to move the second imaging unit of the two imaging units along the second direction, wherein each of the imaging units comprises a lens unit, the lens unit comprises an upper lens, a lower lens, and a reflection mirror, and the reflection mirror is configured to change a first optical path of the first imaging device toward a first substrate side through the upper lens, and to change a second optical path of the second imaging device toward a second substrate side through the lower lens, the second optical path being coaxial with the first optical path.
2 . The bonding apparatus of claim 1 , further comprising: a controller configured to control the first moving mechanism, the second moving mechanism and the third moving mechanism such that the first imaging unit images a first region and the second imaging unit images a second region.
3 . The bonding apparatus of claim 1 , wherein the first imaging device images a first holding mark formed on the first holder, and the second imaging device images a second holding mark formed on the second holder.
4 . The bonding apparatus of claim 3 , further comprising: a processing vessel accommodating therein the first holder and the second holder; and a fixed imaging device configured to image the first holding mark and the second holding mark from outside of the processing vessel.
5 . The bonding apparatus of claim 1 , further comprising: a first reference mark provided at a position spaced apart from the first holder and the second holder in the first direction when viewed from a top to be imaged by the first imaging device; and a second reference mark provided to face the first reference mark to be imaged by the second imaging device.
6 . A bonding system configured to bond a first substrate and a second substrate, comprising: a processing station comprising a bonding apparatus configured to bond the first substrate and the second substrate; and a carry-in/out station configured to carry the first substrate, the second substrate, and a combined substrate in which the first substrate and the second substrate are bonded to each other with respect to the processing station, wherein the bonding apparatus comprises: a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; a first moving mechanism configured to move the two imaging units along a first direction in a planar region between the first holder and the second holder, a second moving mechanism configured to move the first imaging unit of the two imaging units along a second direction orthogonal to the first direction; and a third moving mechanism configured to move the second imaging unit of the two imaging units along the second direction, wherein each of the imaging units comprises a lens unit, the lens unit comprises an upper lens, a lower lens, and a reflection mirror, and the reflection mirror is configured to change a first optical path of the first imaging device toward a first substrate side through the upper lens, and to change a second optical path of the second imaging device toward a second substrate side through the lower lens, the second optical path being coaxial with the first optical path.
7 . A bonding method of bonding a first substrate and a second substrate by using a bonding apparatus, wherein the bonding apparatus comprises: a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; a first moving mechanism configured to move the two imaging units along a first direction in a planar region between the first holder and the second holder; a second moving mechanism configured to move the first imaging unit of the two imaging units along a second direction orthogonal to the first direction; and a third moving mechanism configured to move the second imaging unit of the two imaging units along the second direction, wherein each of the imaging units comprises a lens unit, the lens unit comprises an upper lens, a lower lens, and a reflection mirror, and the reflection mirror is configured to change a first optical path of the first imaging device toward a first substrate side through the upper lens, and to change a second optical path of the second imaging device toward a second substrate side through the lower lens, the second optical path being coaxial with the first optical path, and wherein the bonding method comprises: holding the first substrate by the first holder; holding the second substrate by the second holder; moving the first imaging unit and the second imaging unit in the first direction by the first moving mechanism; moving the first imaging unit in the second direction by the second moving mechanism; moving the second imaging unit in the second direction by the third moving mechanism; imaging the first alignment mark and the second alignment mark by the first imaging unit and the second imaging unit, respectively; and adjusting a horizontal position between the first substrate held by the first holder and the second substrate held by the second holder based on images obtained in the imaging of the first alignment mark and the second alignment mark.
8 . The bonding method of claim 7 , wherein in the moving of the first imaging unit, the first imaging unit is moved in a first region, in the moving of the second imaging unit, the second imaging unit is moved in a second region, and in the imaging of the first alignment mark and the second alignment mark, the first region is imaged by the first imaging unit and the second region is imaged by the second imaging unit.
9 . The bonding method of claim 7 , wherein in the imaging of the first alignment mark and the second alignment mark, the first alignment mark and the second alignment mark are imaged by the imaging units at the same time.
10 . The bonding method of claim 7 , wherein, after the adjusting of the horizontal position, the first imaging unit is moved in the second direction by the second moving mechanism, the second imaging unit is moved in the second direction by the third imaging unit, and wherein, in each of the first imaging unit and the second imaging unit, a first holding mark formed on the first holder is imaged by the first imaging device, and a second holding mark formed on the second holder is imaged by the second holder.
11 . The bonding method of claim 7 , wherein the bonding apparatus further comprises: a first reference mark provided at a position spaced apart from the first holder and the second holder in the first direction when viewed from a top to be imaged by the first imaging device; and a second reference mark provided to face the first reference mark to be imaged by the second imaging device, and wherein in the moving of the first imaging unit, the first reference mark is imaged by the first imaging device, and the second reference mark is imaged by the second imaging device.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This Application is a U.S. national phase application under 35 U.S.C. § 371 of PCT Application No. PCT/JP2020/018011 filed on Apr. 27, 2020, which claims the benefit of Japanese Patent Application No. 2019-088100 filed on May 8, 2019, the entire disclosures of which are incorporated herein by reference. TECHNICAL FIELD The various aspects and embodiments described herein pertain generally to a bonding apparatus, a bonding system, and a bonding method. BACKGROUND Patent Document 1 discloses a bonding apparatus for bonding substrates. The bonding apparatus is equipped with a first holder configured to hold a first substrate, a second holder configured to hold a second substrate, a chamber accommodating the first holder and the second holder, and an imaging device provided outside the chamber. The imaging device images alignment marks formed on the first substrate and the second substrate via through holes respectively formed through the chamber, the first holder and the second holder. Patent Document 1: Japanese Patent Laid-open Publication No. 2016-134446 SUMMARY In an exemplary embodiment, a bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; a first moving mechanism configured to move the two imaging units along a first direction in a planar region between the first holder and the second holder; a second moving mechanism configured to move the first imaging unit of the two imaging units along a second direction orthogonal to the first direction; and a third moving mechanism configured to move the second imaging unit of the two imaging units along the second direction. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view illustrating a schematic configuration of a bonding system according to an exemplary embodiment. FIG. 2 is a side view illustrating the schematic configuration of the bonding system according to the exemplary embodiment. FIG. 3 is a side view illustrating a schematic structure of a combined substrate. FIG. 4 is a plan view illustrating a schematic structure of a first substrate. FIG. 5 is a side view illustrating a schematic configuration of a bonding apparatus. FIG. 6 is a side view illustrating the schematic configuration of the bonding apparatus. FIG. 7 is a plan view illustrating the schematic configuration of the bonding apparatus. FIG. 8 is a cross sectional view illustrating a configuration of a first holder and the vicinity thereof. FIG. 9 is a plan view illustrating the first holder and the vicinity thereof seen from below. FIG. 10 is a plan view illustrating the first holder and the vicinity thereof seen from above. FIG. 11 is a cross sectional view illustrating a configuration of a second holder and the vicinity thereof. FIG. 12 is a cross sectional view illustrating the configuration of the second holder and the vicinity thereof. FIG. 13 is a plan view illustrating the second holder and the vicinity thereof seen from above. FIG. 14 is a plan view illustrating a schematic configuration of a first imaging unit. FIG. 15 is a side view illustrating the schematic configuration of the first imaging unit. FIG. 16A to FIG. 16C are explanatory diagrams schematically illustrating an internal configuration of the first imaging unit. FIG. 17 is an explanatory diagram schematically illustrating an internal configuration of a conventional imaging unit. FIG. 18 is a side view illustrating a schematic configuration of a reference mark unit. FIG. 19 is a flowchart illustrating main processes of a bonding processing. FIG. 20A and FIG. 20B are explanatory diagrams illustrating processes A3 and A6 of the bonding processing. FIG. 21A and FIG. 21B are explanatory diagrams illustrating processes A7 and A8 of the bonding processing. FIG. 22A and FIG. 22B are explanatory diagrams illustrating a process A9 of the bonding processing. FIG. 23A and FIG. 23B are explanatory diagrams illustrating the process A9 and a process A10 of the bonding processing. FIG. 24A and FIG. 24B are explanatory diagrams illustrating the process A10 of the bonding processing. FIG. 25A and FIG. 25B are explanatory diagrams illustrating a process A11 of the bonding processing. FIG. 26A and FIG. 26B are explanatory diagrams illustrating a process A12 of the bonding processing. FIG. 27A and FIG. 27B are explanatory diagrams illustrating a process A13 of the bonding processing. FIG. 28A and FIG. 28B are explanatory diagrams illustrating a process A14 of the bonding processing. FIG. 29 is an explanatory diagram illustrating a load state at