US-12628648-B2 - Semiconductor chip having a high thermal liquid coolant

Abstract

A semiconductor package includes a flip chip die communicatively coupled to a substrate. A lid is also coupled to the substrate and covers the flip chip die. A non-curing thermal conductive liquid coolant fills a volume defined by the lid and is used to dissipate heat that is generated by the flip chip die. The non-curing thermal conductive liquid coolant may include nanometer-sized particles that enhance the heat dissipation properties of the non-curing thermal conductive liquid coolant. The semiconductor package also may include a micro-rotator that causes the non-curing thermal conductive liquid coolant to circulate within the volume when a temperature of the flip chip die exceeds a temperature threshold.

Inventors

• Yangming Liu
• Bo Yang
• Ning Ye

Assignees

• SanDisk Technologies, Inc.

Dates

Publication Date

20260512

Application Date

20230724

Claims (20)

1. 1 . A semiconductor chip, comprising: a substrate; an integrated circuit electrically coupled to a surface of the substrate; a lid enclosing the integrated circuit and defining a volume between the substrate and the lid; a thermal interface material that is at least partially bonded to a top surface of the integrated circuit and a bottom surface of the lid; a non-curing thermal conductive liquid coolant at least partially filling the volume; at least one aperture defined by the lid, the aperture enabling the non-curing thermal conductive liquid coolant to be dispensed within the volume; and a stopper sealing the aperture.
2. 2 . The semiconductor chip of claim 1 , further comprising a micro-rotator coupled to the substrate and operative to cause the non-curing thermal conductive liquid coolant to cyclically flow within the volume.
3. 3 . The semiconductor chip of claim 2 , wherein the micro-rotator is activated in response to a temperature reading associated with the semiconductor chip exceeding a temperature threshold.
4. 4 . The semiconductor chip of claim 3 , wherein the micro-rotator is deactivated in response to the temperature reading associated with the semiconductor chip falling below the temperature threshold.
5. 5 . The semiconductor chip of claim 1 , wherein the non-curing thermal conductive liquid coolant comprises a plurality of particles suspended within the non-curing thermal conductive liquid coolant.
6. 6 . The semiconductor chip of claim 5 , wherein the particles comprise a thermal conductive material.
7. 7 . The semiconductor chip of claim 1 , wherein the non-curing thermal conductive liquid coolant is comprised of one or more of: deionized water; water with an additive; mineral oil; fluorocarbon oil; transformer oil; silicone oil; Freon; and Fluorinert.
8. 8 . A semiconductor chip, comprising: a substrate; integrated circuit means electrically coupled to a surface of the substrate; an enclosure means coupled to the substrate and substantially enclosing the integrated circuit means, the enclosure means defining a space between the substrate and a bottom surface of the enclosure means; a thermal conductive means associated with the enclosure means and coupled to a surface of the integrated circuit means; and a non-curing liquid coolant means at least partially filling the space defined by the enclosure means, the non-curing liquid coolant means comprising a plurality of nanoparticles.
9. 9 . The semiconductor chip of claim 8 , wherein the enclosure means defines an opening and wherein the opening enables the non-curing liquid coolant means to be dispensed within the space.
10. 10 . The semiconductor chip of claim 9 , further comprising a sealing means for sealing the opening defined by the enclosure means.
11. 11 . The semiconductor chip of claim 8 , further comprising a rotator means coupled to the substrate and operative to cause the non-curing liquid coolant means to flow within the space.
12. 12 . The semiconductor chip of claim 11 , wherein the rotator means is activated in response to a temperature reading associated with the semiconductor chip exceeding a temperature threshold.
13. 13 . The semiconductor chip of claim 12 , wherein the rotator means is deactivated in response to the temperature reading associated with the semiconductor chip falling below the temperature threshold.
14. 14 . The semiconductor chip of claim 8 , wherein the nanoparticles comprise a thermal conductive material.
15. 15 . The semiconductor chip of claim 8 , wherein the non-curing liquid coolant means is comprised of one or more of: deionized water; water with an additive; mineral oil; fluorocarbon oil; transformer oil; silicone oil; Freon; and Fluorinert.
16. 16 . A semiconductor chip, comprising: a high-density interconnection substrate; an integrated circuit electrically coupled to a surface of the high-density interconnection substrate; a micro-rotator electrically coupled to the high-density interconnection substrate; a lid coupled to the high-density interconnection substrate, the lid enclosing the integrated circuit and the micro-rotator and defining a volume; a non-curing thermal conductive liquid coolant at least partially filling the volume and adapted to flow within the volume upon activation of the micro-rotator; an aperture defined by the lid, the aperture enabling the non-curing thermal conductive liquid coolant to be dispensed within the volume; and a stopper sealing the aperture.
17. 17 . The semiconductor chip of claim 16 , wherein the micro-rotator is activated in response to a temperature reading associated with the semiconductor chip exceeding a temperature threshold.
18. 18 . The semiconductor chip of claim 16 , wherein the non-curing thermal conductive liquid coolant comprises a plurality of particles suspended within the non-curing thermal conductive liquid coolant, wherein the particles comprise a thermal conductive material.
19. 19 . The semiconductor chip of claim 16 , wherein the non-curing thermal conductive liquid coolant is comprised of one or more of: deionized water; water with an additive; mineral oil; fluorocarbon oil; transformer oil; silicone oil; Freon; and Fluorinert.
20. 20 . The semiconductor chip of claim 16 , wherein an inner surface of the lid is secured to a top surface of the integrated circuit with a thermal interface material.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS The present application claims priority to U.S. Provisional Application 63/488,555 entitled “SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT”, filed Mar. 6, 2023, the entire disclosure of which is hereby incorporated by reference in its entirety. BACKGROUND An increasing number of electronic devices use various semiconductor chips to process and store data. As demand for semiconductor chips increases, so do the demands for higher density, smaller size and higher performance. In order to meet these demands, semiconductor chips, and their associated packages, have become smaller and thinner. Additionally, semiconductor chips use higher power and/or higher performance components. These components typically consume more power and, as a result, generate more heat. If the heat is not efficiently dissipated from the semiconductor chips, the performance and/or the reliability of the semiconductor chips may be negatively impacted. Accordingly, it would be beneficial for semiconductor chips to have thermal dissipation features that effectively and efficiently dissipate heat without increasing size of the semiconductor chips or sacrificing the performance of the semiconductor chips. SUMMARY The present application describes a semiconductor package or semiconductor chip that has various thermal dissipation features. In an example, the semiconductor package is a high-performance flip chip ball grid array (FC-BGA) structure that includes, among other features, a flip chip die electrically coupled to a substrate. A lid may be coupled to the substrate and encloses the flip chip die. In order to displace any air that may be trapped between the lid and the substrate, and in order to effectively and efficiently dissipate heat, the semiconductor package includes a non-curing thermal conductive liquid coolant. The non-curing thermal conductive liquid coolant fills a volume defined by the lid. The non-curing thermal conductive liquid coolant may include nanometer-sized particles that enhance the heat dissipation properties of the non-curing thermal conductive liquid coolant. The semiconductor package may also include a micro-rotator that causes the non-curing thermal conductive liquid coolant to circulate or move within the volume and/or around the flip chip die when a temperature of the flip chip die (or the semiconductor package) exceeds a temperature threshold. Accordingly, the present application describes a semiconductor chip that includes a substrate and an integrated circuit. The integrated circuit is electrically coupled to a surface of the substrate. A lid encloses the integrated circuit and is also coupled to the substrate. The lid defines a volume between the substrate and the lid. A non-curing thermal conductive liquid coolant substantially fills the volume. The lid also defines at least one aperture that enables the non-curing thermal conductive liquid coolant to be dispensed within the volume. A stopper is used to seal the aperture. The present application also describes a semiconductor chip that includes a substrate and an integrated circuit means. The integrated circuit means is electrically coupled to a surface of the substrate. An enclosure means is coupled to the substrate and substantially encloses the integrated circuit means. The enclosure means also defines a space between the substrate and a bottom surface of the enclosure means. A non-curing liquid coolant means at least substantially fills the space defined by the enclosure means. The non-curing liquid coolant means may also include a plurality of nanoparticles. Also described is a semiconductor chip that includes a high-density interconnection substrate and an integrated circuit. The integrated circuit is electrically coupled to a surface of the high-density interconnection substrate. A micro-rotator is also electrically coupled to the high-density interconnection substrate. The semiconductor chip also includes a lid that is coupled to the substrate and encloses the integrated circuit and the micro-rotator. The lid also defines a volume. A non-curing thermal conductive liquid coolant at least substantially fills the volume and is adapted to flow within the volume upon activation of the micro-rotator. At least one aperture is defined by the lid. The aperture enables the non-curing thermal conductive liquid coolant to be dispensed within the volume. A stopper is used to seal the aperture. This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS Non-limiting and non-exhaustive examples are described with reference to the following Figures. FIG. 1 illustrates a semiconductor chip according to an example. F