US-12628650-B2 - Mounting structure and module device having the same

US12628650B2US 12628650 B2US12628650 B2US 12628650B2US-12628650-B2

Abstract

A module device on a first substrate includes a power module, a housing, a pair of mounting structures. The housing covers the power module. The mounting structures are installed on a pair of opposite sides of the housing, and the mounting structure includes a main body, a locking ring, a pair of ribs and anchoring portions. The locking ring extends from a side toward an inner side of the main body, and is a double-ring structure, which includes an inner and an outer ring. A first side of the outer ring is connected to the main body, a second side of the outer ring is connected to the inner ring. The ribs extend along a normal direction of the top surface of the main body. The anchoring portions are disposed at the end of the ribs, and an extending direction is perpendicular to an extending direction of the rib.

Inventors

Ji-Yuan Syu
Yuan-Cheng Huang
Yu-Chih Wang

Assignees

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Dates

Publication Date: 20260512
Application Date: 20230110
Priority Date: 20220922

Claims (16)

1 . A module device, adapted to be installed on a first substrate, the module device comprising: a power module; a housing, covering the power module; a pair of mounting structures, installed on a pair of opposite sides of the housing, each of the pair of mounting structures comprises: a main body, having a first portion and two second portions extending from two ends of the first portion perpendicularly; a locking ring, disposed within a space formed by the first portion and the two second portions, wherein the locking ring is a double-ring structure, which comprises an inner ring and an outer ring surrounding outside of the inner ring, a first side of the outer ring is extended from the first portion of the main body, the second portions are spaced from the outer ring, the inner ring is connected to a second side of the outer ring and not connected to the first side of the outer ring whereas the first side and the second side are opposite sides; a pair of ribs, disposed on the two second portions correspondingly, extending from a top surface of the main body along a normal direction of the top surface; a pair of anchoring portions, disposed at ends of the pair of ribs, and extending directions of the pair of anchoring portions are parallel to an extending direction of the first portion; and a pair of locking members, passing through the corresponding pair of locking rings and being locked into the first substrate.
2 . The module device according to claim 1 , wherein outer contours of the inner ring and the outer ring are circular shapes.
3 . The module device according to claim 1 , wherein outer contours of the inner ring and the outer ring are rectangular shapes.
4 . The module device according to claim 1 , wherein an outer contour of the outer ring is a rectangular shape and an outer contour of the inner ring is a circular shape.
5 . The module device according to claim 1 , wherein the locking ring further has a slit opening, and the slit opening penetrates the outer ring and the inner ring from the first side where the locking ring is connected to the main body.
6 . The module device according to claim 1 , wherein the pair of ribs extend from the first side where the locking ring is connected to the main body toward the pair of anchoring portions in a triangular or trapezoidal shape.
7 . The module device according to claim 6 , wherein each of the pair of ribs has a first side and a second side, the first side is adjacent to the anchoring portion, the second side is adjacent to the side where the locking ring is connected to the main body, and a length of the first side is greater than a length of the second side.
8 . The module device according to claim 1 , wherein the pair of anchoring portions are embedded in a sidewall of the housing.
9 . The module device according to claim 1 , wherein the power module has a second substrate, at least one power semiconductor, and a plurality of pins, the at least one power semiconductor and the pins are disposed on the second substrate, and the housing has a plurality of sockets for insertion of the pins.
10 . The module device according to claim 1 , wherein before the pair of locking members are locked into the first substrate, a gap exists between a bottom surface of the mounting structure and a bottom surface of the housing.
11 . The module device according to claim 1 , wherein after the pair of locking members are locked into the first substrate, a bottom surface of the mounting structure is in contact with the first substrate.
12 . The module device according to claim 1 , wherein each of the inner rings has a locking hole, and the pair of locking members are locked into the corresponding locking holes.
13 . The module device according to claim 12 , wherein the locking hole is a capsule or circular shape.
14 . A module device, adapted to be installed on a first substrate, the module device comprising: a power module; a housing, covering the power module; a pair of mounting structures, installed on a pair of opposite sides of the housing, each of the pair of mounting structures comprises: a main body, having a first portion and two second portions extending from two ends of the first portion perpendicularly; a locking ring, disposed within a space formed by the first portion and the two second portions, wherein the locking ring is a double-ring structure, which comprises an inner ring and an outer ring surrounding outside of the inner ring, and the second portions are spaced from the outer ring, wherein the locking ring has a slit opening, and the slit opening penetrates the outer ring and the inner ring from a side where the locking ring is connected to the main body, the inner ring is disconnected at the side where the locking ring is connected to the main body while the outer ring is also disconnected at the side where the locking ring is connected to the main body; a pair of ribs, disposed on the two second portions correspondingly, extending from a top surface of the main body along a normal direction of the top surface; and a pair of anchoring portions, disposed at ends of the pair of ribs, and extending directions of the pair of anchoring portions are parallel to an extending direction of the first portion; and a pair of locking members, passing through the corresponding pair of locking rings and being locked into the first substrate.
15 . The module device according to claim 14 , wherein the other of the pair of mounting structures comprises: a main body; a locking ring, extending from a side of the main body toward an inner side of the main body, wherein the locking ring is a double-ring structure, which comprises an inner ring and an outer ring, a first side of the outer ring is connected to the main body, a second side of the outer ring is connected to the inner ring, and the first side and the second side are opposite sides; a pair of ribs, extending from a top surface of the main body along a normal direction of the top surface; and a pair of anchoring portions, disposed at ends of the pair of ribs, and extending directions of the pair of anchoring portions are perpendicular to extending directions of the pair of ribs.
16 . A mounting structure, adapted to be on one of a pair of opposite sides of a housing of a module device, comprising: a main body, having a first portion and two second portions extending from two ends of the first portion perpendicularly; a locking ring, disposed within a space formed by the first portion and the two second portions, wherein the locking ring is a double-ring structure, which comprises an inner ring and an outer ring surrounding outside of the inner ring, a first side of the outer ring is extended from the first portion of the main body, the second portions are spaced from the outer ring, the inner ring is connected to a second side of the outer ring and not connected to the first side of the outer ring whereas the first side and the second side are opposite sides; a pair of ribs, disposed on the two second portions correspondingly, extending from a top surface of the main body along a normal direction of the top surface; and a pair of anchoring portions, disposed at ends of the pair of ribs, and extending directions of the pair of anchoring portions are parallel to an extending direction of the first portion, wherein a connection between the inner ring and the outer ring is subjected to a larger stress than a connection between the outer ring and the first portion when a pair of locking members passing through the corresponding pair of locking rings and being locked into a first substrate of the module device.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims the priority benefit of Taiwan application serial no. 111135966, filed on Sep. 22, 2022. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification. TECHNICAL FIELD The disclosure relates to a module device, and more particularly, to a module device of a power module. BACKGROUND The rapid development of the process technology of power semiconductors has greatly improved the functions of electronic elements. However, with the improvement of the processing speed and current of electronic elements, the heat generated by the electronic elements also increases. If the heat cannot be effectively removed, the electronic elements may not achieve optimal performance or even fail. The heat generated when the power semiconductor operates will cause thermal deformation of the structure of the power element, which not only affects the heat transfer effect, but also affects the working performance of the power semiconductor and shortens the life of the power semiconductor due to the increase in the working environment temperature of the power semiconductor. In order to effectively dissipate heat to the power semiconductor, some module designs directly lock the power module on the heat dissipation structure, so that the power module can be stably in contact with the heat dissipation structure. However, if the power module is not properly locked and skewed, the power module cannot be reliably in contact with the heat dissipation structure, resulting in a decrease in heat dissipation efficiency. SUMMARY The disclosure provides a module device, which has good heat dissipation effect and can prolong the service life of a power module. A module device of the disclosure is adapted to be installed on a first substrate. The module device includes a power module, a housing, a pair of mounting structures, and a pair of locking members. The housing covers the power module. The mounting structures are installed on a pair of opposite sides of the housing, and each of the mounting structures includes a main body, a locking ring, a pair of ribs, and a pair of anchoring portions. The locking ring extends from a side of the main body toward an inner side of the main body, and the locking ring is a double-ring structure, which includes an inner ring and an outer ring. A first side of the outer ring is connected to the main body, a second side of the outer ring is connected to the inner ring, and the first side and the second side are opposite sides. The rib extends from a top surface of the main body along a normal direction of the top surface. The anchoring portion is disposed at the end of the rib, and an extending direction of the anchoring portion is perpendicular to an extending direction of the rib. A module device of the disclosure is adapted to be installed on a first substrate. The module device includes a power module, a housing, and a pair of mounting structures. The housing covers the power module. The mounting structures are installed on a pair of opposite sides of the housing, and at least one of the mounting structures includes a main body, a locking ring, a pair of ribs, and a pair of anchoring portions. The locking ring extends from a side of the main body toward an inner side of the main body, and the locking ring is a double-ring structure, which includes an inner ring and an outer ring. The locking ring has a slit opening, and the slit opening penetrates the outer ring and the inner ring from the side where the locking ring is connected to the main body. The rib extends from a top surface of the main body along a normal direction of the top surface. The anchoring portion is disposed at the end of the rib, and an extending direction of the anchoring portion is perpendicular to an extending direction of the rib. Based on the above, in the module device of the disclosure, the mounting structure is improved, and the improved mounting structure may effectively increase the contact area between the bottom surface of the power module and the first substrate, thereby improving the overall heat dissipation effect of the module device. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a module device according to an embodiment of the disclosure. FIG. 2 is an exploded schematic diagram of the disassembly of a housing and a power module in the module device of FIG. 1. FIG. 3a is a perspective view of the mounting structure. FIG. 3b is a side view of the mounting structure. FIG. 4 is a schematic diagram of the locking member passing through the mounting structure to be locked into the first substrate. FIG. 5a is a schematic diagram illustrating that the second substrate of the power module is subjected to uniform stress. FIG. 5b is a schematic diagram of the stress experienced by the housing. FIG. 5c is a schematic diagram of the stress experienced by the mounting structure. FIG