US-12628656-B2 - Electronic packaging structure and manufacturing method thereof

Abstract

An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The first circuit structure includes a bottom conductive plate having at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.

Inventors

• Chin-Sheng Wang
• Ra-Min Tain
• Chih-Kai Chan

Assignees

• UNIMICRON TECHNOLOGY CORP.

Dates

Publication Date

20260512

Application Date

20230620

Priority Date

20220725

Claims (14)

1. 1. An electronic packaging structure, comprising: a first circuit structure, comprising a bottom conductive plate having at least one cavity; a second circuit structure, the first circuit structure being disposed thereon, wherein the first circuit structure and the second circuit structure are electrically connected to each other; and at least one electronic device, disposed on the second circuit structure, wherein the electronic device is disposed corresponding to the cavity of the bottom conductive plate of the first circuit structure.
2. 2. The electronic packaging structure according to claim 1 , wherein the bottom conductive plate having the cavity is electrically grounded.
3. 3. The electronic packaging structure according to claim 1 , wherein the first circuit structure further comprises at least one coaxial conductive through via, wherein the coaxial conductive through via comprises: an inner conductive layer; an outer conductive layer; and a first dielectric layer, disposed between the inner conductive layer and the outer conductive layer.
4. 4. The electronic packaging structure according to claim 3 , wherein a material of the outer conductive layer of the coaxial conductive through via includes copper.
5. 5. The electronic packaging structure according to claim 3 , a material of the first dielectric layer of the coaxial conductive through via includes resin.
6. 6. The electronic packaging structure according to claim 3 , wherein the first circuit structure further comprises: an upper conductive layer, wherein two opposite ends of the outer conductive layer of the coaxial conductive via are respectively connected to a portion of the upper conductive layer and a portion of the bottom conductive plate.
7. 7. The electronic packaging structure according to claim 3 , wherein two opposite ends of the inner conductive layer of the coaxial conductive through via are electrically connected to outermost circuits on opposite sides of the first circuit structure.
8. 8. The electronic packaging structure according to claim 3 , wherein the coaxial conductive through via further comprises: a second dielectric layer, wherein the inner conductive layer is disposed between the first dielectric layer and the second dielectric layer.
9. 9. The electronic packaging structure according to claim 3 , wherein the first circuit structure further comprises: an antenna, being at least a portion of an outermost circuit layer of the first circuit structure, wherein the electronic device is electrically connected to the antenna through the inner conductive layer of the coaxial conductive through via, wherein the bottom conductive plate having the cavity and the outer conductive layer of the coaxial conductive through via are electrically grounded.
10. 10. The electronic packaging structure according to claim 1 , wherein at least one of the first circuit structure or the second circuit structure comprises a solder resist layer disposed on an outermost thereof.
11. 11. The electronic packaging structure according to claim 1 , further comprising: a filling material, disposed between the first circuit structure and the second circuit structure.
12. 12. The electronic packaging structure according to claim 1 , further comprising: a conductive connector, disposed between the first circuit structure and the second circuit structure to electrically connect the first circuit structure and the second circuit structure.
13. 13. The electronic packaging structure according to claim 1 , further comprising: a conductive connector, disposed between the electronic device and the second circuit structure to electrically connect the electronic device and the second circuit structure.
14. 14. A manufacturing method of an electronic packaging structure, comprising: providing a first circuit structure, comprising a bottom conductive plate having at least one cavity; providing a second circuit structure; disposing at least one electronic device on the second circuit structure; and disposing the first circuit structure on the second circuit structure with the electronic device disposed thereon, wherein the first circuit structure and the second circuit structure are electrically connected to each other, and the electronic device is disposed corresponding to the cavity of the first circuit structure.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation-in-part application of and claims the priority benefit of U.S. application Ser. No. 17/902,902, filed on Sep. 5, 2022, now pending. The prior U.S. application Ser. No. 17/902,902 claims the priority benefits of U.S. provisional application Ser. No. 63/312,102, filed on Feb. 21, 2022, and Taiwan application serial no. 111127679, filed on Jul. 25, 2022. This application also claims the priority benefit of U.S. provisional application Ser. No. 63/432,389, filed on Dec. 14, 2022, and Taiwan application serial no. 112114199, filed on Apr. 17, 2023. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification. BACKGROUND Technical Field The disclosure relates to a package structure and a manufacturing method thereof, and in particular relates to an electronic packaging structure with an electronic device disposed between a plurality of circuit structures and manufacturing method thereof. Description of Related Art With the advancement of technology, the functions of electronic products are becoming more and more abundant, and we are also increasingly dependent on electronic mobile devices. In response to the demands of miniaturization and weight reduction of electronic products, the integration of the antenna structure and the chip package structure contributes to the miniaturization and weight reduction of electronic products. Generally speaking, for the current chip package structure with antenna structure, the chip is usually disposed on the circuit board, and the chip is covered by a film sealing material to form the chip package structure. The antenna structure is disposed on the chip package structure, and the antenna structure is electrically connected to the circuit board through a conductive pillar or a conductive ball penetrating the film sealing material in the chip package structure. However, in the above-mentioned packaging structure, an electronic device (e.g., the chip) may be difficult to be protected well; and/or, the above-mentioned packaging structure may be difficult to reduce the signal divergence effectively during radio frequency transmission, and may have a larger size. SUMMARY The disclosure provides an electronic package structure and a manufacturing method thereof. An electronic packaging structure of the disclosure includes a first circuit structure, a second circuit structure, and at least one electronic device. The first circuit structure includes a bottom conductive plate having at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of bottom conductive plate of the first circuit structure. In an embodiment of the disclosure, the bottom conductive plate having the cavity is electrically grounded. In an embodiment of the disclosure, the first circuit structure further includes at least one coaxial conductive through via. The coaxial conductive through via includes an inner conductive layer, an outer conductive layer, and a first dielectric layer. The first dielectric layer is disposed between the inner conductive layer and the outer conductive layer. In an embodiment of the disclosure, a material of the outer conductive layer of the coaxial conductive through via includes copper. In an embodiment of the disclosure, a material of the first dielectric layer of the coaxial conductive through via includes resin. In an embodiment of the disclosure, the first circuit structure further includes an upper conductive layer. Two opposite ends of the outer conductive layer of the coaxial conductive via are respectively connected to a portion of the upper conductive layer and a portion of the bottom conductive plate. In an embodiment of the disclosure, two opposite ends of the inner conductive layer of the coaxial conductive through via are electrically connected to outermost circuits on opposite sides of the first circuit structure. In an embodiment of the disclosure, the coaxial conductive through via further includes a second dielectric layer. The inner conductive layer is disposed between the first dielectric layer and the second dielectric layer. In an embodiment of the disclosure, the first circuit structure further includes an antenna. The antenna is at least a portion of an outermost circuit layer of the first circuit structure. The electronic device is electrically connected to the antenna through the inner conductive layer of the coaxial conductive through via. The bottom conductive plate having the cavity and the outer conductive layer of the coaxial conductive through via are electrically grounded. In an embodiment of the disclosure, at least one of the first circ