US-12628657-B2 - Package device and manufacturing method thereof

US12628657B2US 12628657 B2US12628657 B2US 12628657B2US-12628657-B2

Abstract

A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer including a first dielectric layer, a conductive layer, and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the conductive patterns are arranged in a ring shape.

Inventors

Yeong-E Chen
Cheng-En CHENG
Yu-Ting Liu

Assignees

Innolux Corporation

Dates

Publication Date: 20260512
Application Date: 20211125
Priority Date: 20201126

Claims (4)

1 . A package device, comprising: a carrier, wherein the carrier comprises an electronic component; and a redistribution layer disposed on the carrier, and the redistribution layer comprising a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer being disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark comprises a conductive pattern formed of the conductive layer, the conductive pattern comprises a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion, wherein the plurality of extension portions extend outwardly in a radial shape with the center portion as a center, each of the plurality of extension portions has a length along a corresponding extension direction and a width in a direction perpendicular to the corresponding extension direction, wherein in each of the plurality of extension portions, the length is greater than the width, and the widths of at least two of the plurality of extension portions are different.
2 . A manufacturing method of a package device, comprising: providing a carrier, wherein the carrier comprises an electronic component; and forming a redistribution layer on the carrier, wherein the redistribution layer comprises a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, and wherein the redistribution layer has a test mark, the test mark comprises a conductive pattern formed of the conductive layer, the conductive pattern comprises a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion, wherein the plurality of extension portions extend outwardly in a radial shape with the center portion as a center, each of the plurality of extension portions has a length along a corresponding extension direction and a width in a direction perpendicular to the corresponding extension direction, wherein in each of the plurality of extension portions, the length is greater than the width, and the widths of at least two of the plurality of extension portions are different.
3 . The manufacturing method of the package device according to claim 2 , wherein the carrier has a plurality of device regions and a peripheral region surrounding the plurality of device regions, and the test mark is disposed on the carrier in at least one of the device regions and the peripheral region.
4 . The manufacturing method of the package device according to claim 2 , wherein forming the redistribution layer comprises: forming the first dielectric layer on the carrier; forming the conductive layer on the first dielectric layer; and forming the second dielectric layer on the conductive layer.

Description

BACKGROUND OF THE DISCLOSURE 1. Field of the Disclosure The present disclosure relates to a package device and a manufacturing method thereof, and more particularly to a package device having a test mark and a manufacturing method thereof. 2. Description of the Prior Art In packaging technology, plural package devices may be produced by performing a redistribution layer process on a carrier. However, during the manufacturing processes, different or mismatched coefficients of thermal expansion (CTE) may exist between carrier and layers of a redistribution layer or between different layers of the redistribution layer formed on the carrier while process temperature changes, which results in serious warpage of the formed layers. Warpage degrees of different parts of the redistribution layer may be different, such that qualities of the package devices are not equal, or machines may not accomplish remaining processes due to the warpage of the redistribution layer. Also, currently, there is no way to inline inspecting processes of the redistribution layer, so that the warpage degrees or warpage tendency of the formed layers cannot be determined in real time, thereby affecting process yields. SUMMARY OF THE DISCLOSURE According to an embodiment of the present disclosure, a package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the plurality of conductive patterns are arranged in a ring shape. According to another embodiment of the present disclosure, a package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion. According to some embodiments of the present disclosure, a manufacturing method of a package device includes providing a carrier, and forming a redistribution layer on the carrier. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns, the plurality of conductive patterns are formed of the conductive layer, and the plurality of conductive patterns are arranged in a ring shape. These and other objectives of the present disclosure will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the embodiment that is illustrated in the various figures and drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 schematically illustrates a top view of a test mark according to a first embodiment of the present disclosure. FIG. 2 schematically illustrates a cross-sectional view of a package device according to the first embodiment of the present disclosure. FIG. 3 schematically illustrates the manufacturing method of the package device according to the first embodiment of the present disclosure. FIG. 4 schematically illustrates a test mark according to a variant embodiment of the first embodiment of the present disclosure. FIG. 5 schematically illustrates a top view of a test mark according to another variant embodiment of the first embodiment of the present disclosure. FIG. 6 schematically illustrates a top view of a test mark according to another variant embodiment of the first embodiment of the present disclosure. FIG. 7 schematically illustrates a top view of the test mark of a second embodiment of the present disclosure. FIG. 8 schematically illustrates a top view of a test mark according to a variant embodiment of the second embodiment of the present disclosure. FIG. 9 schematically illustrates a cross-sectional view of a package device according to a third embodiment of the present disclosure. FIG. 10 schematically illustrates positions of the test marks according to an embodiment of the present disclosure. FIG. 11 schematically illustrates positions of test marks in the package device according to another embodiment of the present disclosure. DETAILED DESCRIPTION Hereinafter, package devices of embodiments of the present disclosure are detailed in the following description. It should be understood that many different embodime