US-12628671-B2 - Substrate structure and manufacturing method thereof

US12628671B2US 12628671 B2US12628671 B2US 12628671B2US-12628671-B2

Abstract

A substrate structure includes a first substrate and a second substrate. The first substrate includes a first glass plate and at least one first conductive via penetrating the first glass plate. The second substrate includes a second glass plate and at least one second conductive via penetrating the second glass plate. The second substrate is connected to the first substrate. The second glass plate is bonded to the first glass plate through chemical bonding force and defines a chemical bonding contact surface with the first glass substrate. The at least one second conductive via is bonded to the at least one first conductive via through metal diffusion and defines at least one metal bonding contact surface with the at least one first conductive via.

Inventors

Chin-Sheng Wang
Ra-Min Tain
Po-Wen Hsiao
Cheng-Ta Ko
Shih-Lian Cheng
Guang-Hwa Ma

Assignees

UNIMICRON TECHNOLOGY CORP.

Dates

Publication Date: 20260512
Application Date: 20240530
Priority Date: 20240430

Claims (11)

1 . A substrate structure, comprising: a first substrate comprising a first glass plate and at least one first conductive via penetrating the first glass plate; and a second substrate comprising a second glass plate and at least one second conductive via penetrating the second glass plate, wherein the second substrate is connected to the first substrate, the second glass plate is bonded to the first glass plate through chemical bonding force and defines a chemical bonding contact surface with the first glass plate, and the at least one second conductive via is bonded to the at least one first conductive via through metal diffusion and defines at least one metal bonding contact surface with the at least one first conductive via, wherein a first metal layer disposed on at least one first end of the at least one first conductive via; and a second metal layer disposed on at least one second end of the at least one second conductive via, wherein the at least one first end faces the at least one second end, and the second metal layer is bonded to the first metal layer and defines the at least one metal bonding contact surface with the first metal layer.
2 . The substrate structure according to claim 1 , wherein a material of the at least one first conductive via and a material of the at least one second conductive via comprise copper, respectively, and a material of the at least one first metal layer and a material of the at least one second metal layer comprise gold, respectively.
3 . The substrate structure according to claim 1 , wherein the first substrate further comprises a first silicon oxide layer covering a peripheral surface of the first glass plate and partially located between the at least one first conductive via and the first glass plate; and the second substrate further comprises a second silicon oxide layer covering a peripheral surface of the second glass plate and partially located between the at least one second conductive via and the second glass plate, wherein the second silicon oxide layer is bonded to the first silicon oxide layer and defines the chemical bonding contact surface with the first silicon oxide layer.
4 . The substrate structure according to claim 1 , wherein a first thickness of the first glass plate and a second thickness of the second glass plate are respectively greater than 50 microns and less than or equal to 400 microns.
5 . The substrate structure according to claim 1 , wherein a first diameter of the at least one first conductive via and a second diameter of the at least one second conductive via are respectively greater than 10 microns and less than or equal to 100 microns.
6 . A substrate structure, comprising: a first substrate comprising a first glass plate, at least one first conductive via penetrating the first glass plate, and a first organic resin layer, wherein the first organic resin layer is bonded to a first surface and a second surface of the first glass plate that are opposite to each other through chemical bonding force; and a second substrate comprising a second glass plate, at least one second conductive via penetrating the second glass plate, and a second organic resin layer, wherein the second organic resin layer is bonded to a third surface and a fourth surface of the second glass plate that are opposite to each other through the chemical bonding force, and the second substrate is connected to the first substrate, wherein the second organic resin layer is bonded to the first organic resin layer through high-temperature plasticization and defines a resin bonding contact surface with the first organic resin layer, and the at least one second conductive via is bonded to the at least one first conductive via through metal diffusion and defines at least one metal bonding contact surface with the at least one first conductive via, wherein first metal layer disposed on at least one first end of the at least one first conductive via; and a second metal layer disposed on at least one second end of the at least one second conductive via, wherein the at least one first end faces the at least one second end, and the second metal layer is bonded to the first metal layer and defines the at least one metal bonding contact surface with the first metal layer.
7 . The substrate structure according to claim 6 , wherein a material of the first organic resin layer and a material of the second organic resin layer comprise liquid crystal polymer, respectively.
8 . The substrate structure according to claim 6 , wherein a first thickness of the first glass plate and a second thickness of the second glass plate are respectively greater than 50 and less than or equal to 400 microns.
9 . The substrate structure according to claim 6 , wherein a first diameter of the at least one first conductive via and a second diameter of the at least one second conductive via are respectively greater than 10 and less than or equal to 100 microns.
10 . A manufacturing method of a substrate structure, comprising: providing a first substrate and a second substrate, wherein the first substrate comprises a first glass plate and at least one first conductive via penetrating the first glass plate, and the second substrate comprises a second glass plate and at least one second conductive via penetrating the second glass plate; and bonding the second substrate to the first substrate, wherein the second glass plate is bonded to the first glass plate through chemical bonding force and forms a chemical bonding contact surface with the first glass plate, and the at least one second conductive via is bonded to the at least one first conductive via through metal diffusion and forms at least one metal bonding contact surface with the at least one first conductive via, wherein before bonding the second substrate to the first substrate, forming a first metal layer on at least one first end of the at least one first conductive via; and forming a second metal layer on at least one second end of the at least one second conductive via, wherein the at least one first end faces the at least one second end; when the second substrate is bonded to the first substrate, the second metal layer is bonded to the first metal layer and defines the at least one metal bonding contact surface with the first metal layer.
11 . The manufacturing method of the substrate structure according to claim 10 , further comprising: before bonding the second substrate to the first substrate, forming a first silicon oxide layer to cover a peripheral surface of the first glass plate, wherein a portion of the first silicon oxide layer is located between the at least one first conductive via and the first glass plate; and forming a second silicon oxide layer to cover a peripheral surface of the second glass plate, wherein a portion of the second silicon oxide layer is located between the at least one second conductive via and the second glass plate; when the second substrate is bonded to the first substrate, the second silicon oxide layer is bonded to the first silicon oxide layer and defines the chemical bonding contact surface with the first silicon oxide layer.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims the priority benefit of U.S. provisional application Ser. No. 63/623,823, filed on Jan. 23, 2024, and Taiwan application serial no. 113116076, filed on Apr. 30, 2024. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification. BACKGROUND Technical Field The disclosure relates to a substrate structure and a manufacturing method thereof, and more particularly, to a substrate structure having a conductive via and a manufacturing method thereof. Description of Related Art Currently, to manufacture a through glass via (TGV) with a high aspect ratio (AR) in a glass substrate, the glass substrates are usually connected through a resin material, and the through glass vias in the two glass substrates are electrically connected through conductive paste in the resin material. That is to say, after the two glass substrates are connected, there is conductive paste between the through glass vias. In addition, a thickness of the used glass substrate is greater than 200 microns, such as 500 microns, and the through glass via with the high aspect ratio is formed through processes such as laser, etching, and hole filling. As a result, it is difficult to manufacture the through glass via with the high aspect ratio in the glass substrate. SUMMARY The disclosure provides a substrate structure and a manufacturing method thereof, which forms a through glass via with a high aspect ratio by using chemical bonding force and metal diffusion bonding force, having advantages of simple manufacturing processes, reduced costs, and increased production capacity. A substrate structure in the disclosure includes a first substrate and a second substrate. The first substrate includes a first glass plate and at least one first conductive via penetrating the first glass plate. The second substrate includes a second glass plate and at least one second conductive via penetrating the second glass plate. The second substrate is connected to the first substrate. The second glass plate is bonded to the first glass plate through chemical bonding force and defines a chemical bonding contact surface with the first glass plate. The at least one second conductive via is bonded to the at least one first conductive via through metal diffusion and defines at least one metal bonding contact surface with the at least one first conductive via. In an embodiment of the disclosure, the substrate structure further includes a first metal layer and a second metal layer. The first metal layer is disposed on at least one first end of the at least one first conductive via. The second metal layer is disposed on at least one second end of the at least one second conductive via. The at least one first end faces the at least one second end. The second metal layer is bonded to the first metal layer and defines the at least one metal bonding contact surface with the first metal layer. In an embodiment of the disclosure, a material of the at least one first conductive via and a material of the at least one second conductive via include copper, respectively. A material of the at least one first metal layer and a material of the at least one second metal layer include gold, respectively. In an embodiment of the disclosure, the first substrate further includes a first silicon oxide layer covering a peripheral surface of the first glass plate and partially located between the at least one first conductive via and the first glass plate. The second substrate further includes a second silicon oxide layer covering a peripheral surface of the second glass plate and partially located between the at least one second conductive via and the second glass plate. The second silicon oxide layer is bonded to the first silicon oxide layer and defines the chemical bonding contact surface with the first silicon oxide layer. In an embodiment of the disclosure, a first thickness of the first glass plate and a second thickness of the second glass plate are respectively greater than 50 microns and less than or equal to 400 microns. In an embodiment of the disclosure, a first diameter of the at least one first conductive via and a second diameter of the at least one second conductive via are respectively greater than 10 microns and less than or equal to 100 microns. A substrate structure in the disclosure includes a first substrate and a second substrate. The first substrate includes a first glass plate, at least one first conductive via penetrating the first glass plate, and a first organic resin layer. The first organic resin layer is bonded to a first surface and a second surface of the first glass plate that are opposite to each other through chemical bonding force. The second substrate includes a second glass plate, at least one second conductive via penetrating the second glass plate, and a second organic resin layer. The second organic resin layer is