US-12628675-B2 - Component mounting substrate

US12628675B2US 12628675 B2US12628675 B2US 12628675B2US-12628675-B2

Abstract

Provided is a component mount board having a structure capable of more reliably sensing a state of the component mount board being soaked in liquid. A component mount board 100 includes a board 10 having a base 11, a first conductive pattern 30 formed on the base 11, and a mount component 50 electrically connected to the first conductive pattern 30 and a second conductive pattern 40 forming a circuit 60 together with the first conductive pattern 30 in a complementary manner. A portion of the base 11 corresponding to the second conductive pattern 40 is a missing portion 12 where the base 11 is missing. The second conductive pattern 40 is soluble in liquid, or is weakened when becoming wet with liquid.

Inventors

Azumi Tominaga

Assignees

MEKTEC CORPORATION

Dates

Publication Date: 20260512
Application Date: 20221005
Priority Date: 20220224

Claims (16)

1 . A component mount board comprising: a board including a base, a first conductive pattern formed on the base, and a mount component electrically connected to the first conductive pattern; and a second conductive pattern forming a circuit together with the first conductive pattern in a complementary manner, wherein a portion of the base corresponding to the second conductive pattern is a missing portion where the base is missing, and the second conductive pattern is soluble in liquid, or is weakened when becoming wet with liquid.
2 . The component mount board according to claim 1 , wherein a portion of the second conductive pattern facing the missing portion is a wiring portion forming the circuit.
3 . The component mount board according to claim 1 , wherein the missing portion is an opening or a cutout-shaped portion formed in the base.
4 . The component mount board according to claim 1 , wherein the second conductive pattern is arranged over the missing portion, and is bridged between a first portion of the first conductive pattern and a second portion which is a portion of the first conductive pattern apart from the first portion with the missing portion interposed therebetween to electrically connect the first portion and the second portion to each other.
5 . The component mount board according to claim 1 wherein the liquid contains water, the second conductive pattern is made of water-soluble conductive paste, the first conductive pattern is made of metal foil, and the second conductive pattern is electrically connected to the first conductive pattern through water-insoluble conductive paste interposed between the second conductive pattern and the first conductive pattern.
6 . The component mount board according to claim 1 , wherein the second conductive pattern contains resin having a hot melt property, and is electrically and mechanically connected to the first conductive pattern by being hot-melt joined to the first conductive pattern.
7 . The component mount board according to claim 1 , wherein the base is not soluble in the liquid.
8 . The component mount board according to claim 1 , wherein the first conductive pattern is not soluble in the liquid.
9 . The component mount board according to claim 1 , further comprising: a second base arranged so as to face the base, wherein the second conductive pattern is formed on the second base.
10 . The component mount board according to claim 9 , wherein: a soluble layer, which is an adhesive layer soluble in the liquid, is formed on a surface of the second base facing the base, and the second conductive pattern is formed on the second base through the soluble layer.
11 . The component mount board according to claim 9 , wherein the second conductive pattern is directly formed on the second base, the base and the second base are bonded to each other through an adhesive sheet or a bonding sheet, and a region of the second base including a region where the second conductive pattern is formed faces the missing portion through a second missing portion formed in the adhesive sheet or the bonding sheet.
12 . The component mount board according to claim 9 , further comprising: at least one of a first non-woven fabric layer arranged along a surface of the base opposite to a second base side or a second non-woven fabric layer arranged along a surface of the second base opposite to a base side.
13 . The component mount board according to claim 12 , wherein an adhesive sheet is provided on at least one of a surface of the first non-woven fabric layer opposite to the base side or a surface of the second non-woven fabric layer opposite to the second base side.
14 . The component mount board according to claim 1 , wherein: a soluble layer soluble in the liquid is formed on a surface of the base opposite to a surface on which the first conductive pattern is formed.
15 . The component mount board according to claim 1 , wherein a location of an end of the first conductive pattern and a location of an end of the missing portion are coincident with each other.
16 . The component mount board according to claim 1 , wherein an end of the first conductive pattern close to the missing portion is apart from an end of the missing portion.

Description

TECHNICAL FIELD The present invention relates to a component mount board. BACKGROUND ART Patent Literature 1 describes a component mount board (sensor of this document) including a board and a tuned radio frequency circuit supported on the board. The tuned radio frequency circuit has a first conductive pattern, a first capacitor, and a jumper all arranged on the same side of the board. The first capacitor includes a first capacitor plate, a second capacitor plate, and a first dielectric material arranged between the first capacitor plate and the second capacitor plate. The first dielectric material is soluble in liquid. CITATION LIST Patent Literature Patent Literature 1: JP-T-2014-529732 SUMMARY OF INVENTION Problems to be Solved by Invention According to study conducted by the inventors of the present application, there is still room for improvement in the component mount board of Patent Literature 1 in terms of reliability in sensing a state of the component mount board being soaked in liquid. The present invention has been made in view of the above-described problems. The present invention provides a component mount board having a structure capable of more reliably sensing a state of the component mount board being soaked in liquid. Solution to Problems Provided according to the present invention is a component mount board including: a board including a base, a first conductive pattern formed on the base, and a mount component electrically connected to the first conductive pattern; anda second conductive pattern forming a circuit together with the first conductive pattern in a complementary manner,in which a portion of the base corresponding to the second conductive pattern is a missing portion where the base is missing, andthe second conductive pattern is soluble in liquid, or is weakened when becoming wet with liquid. Effects of Invention According to the present invention, the state of the component mount board being soaked in liquid can be more reliably sensed. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an end view of a component mount board according to a first embodiment; FIG. 2 is an exploded end view of the component mount board according to the first embodiment; FIG. 3 is a plan view of the component mount board according to the first embodiment; FIG. 4 is a plan view of the component mount board according to the first embodiment, and selectively shows a board; FIG. 5 is a plan view of a second board of the component mount board according to the first embodiment; FIGS. 6(a), 6(b), and 6(c) are views describing a method for manufacturing the component mount board according to the first embodiment, and specifically show an example of steps performed for the board before assembly with the second board; FIG. 7(a) is an enlarged plan view showing a missing portion and a peripheral edge portion thereof in the board of the component mount board according to the first embodiment, and FIG. 7(b) is an enlarged plan view showing a missing portion and a peripheral edge portion thereof in a board of a component mount board according to a first modification; FIG. 8(a) is an end view of a component mount board according to a second embodiment, and FIG. 8(b) is an exploded end view of the component mount board according to the second embodiment; FIG. 9 is a plan view of the component mount board according to the second embodiment; FIG. 10(a) is an end view of a component mount board according to a third embodiment, and FIG. 10(b) is an exploded end view of the component mount board according to the third embodiment; FIG. 11 is a schematic development view of a paper diaper including the component mount board according to the third embodiment; FIG. 12 is a plan view showing a first modification of a board; FIG. 13 is a plan view showing a second modification of the board; FIG. 14 is an end view of a component mount board according to a fourth embodiment; FIG. 15 is an exploded end view of the component mount board according to the fourth embodiment; FIG. 16 is an end view of a component mount board according to a modification of the fourth embodiment; FIG. 17 is an end view of a component mount board according to a fifth embodiment; FIG. 18 is an exploded end view of the component mount board according to the fifth embodiment; and FIG. 19 is an end view of the component mount board according to the fifth embodiment, and shows a state in which a water-absorption expansion material is expanded. DESCRIPTION OF EMBODIMENTS First Embodiment Hereinafter, a first embodiment of the present invention will be described using FIGS. 1 to 7(a). Note that in all the drawings, the same reference signs are used to represent similar components and description thereof will be omitted as necessary. FIG. 1 shows a cut end surface along a B-B line in a region A (region surrounded by a chain double-dashed line) shown in FIG. 3, and FIG. 2 is an exploded end view of a portion corresponding to that shown in FIG. 1. As shown in FIGS. 1 to