US-12628685-B2 - Double-sided multichip packages with direct die-to-die coupling

Abstract

A multi-chip package includes two electronic components bonded to each other via electrical contacts on corresponding faces of the components that are directly opposite each other. The components are encapsulated in a volume of molding material that includes a upper and lower sets of redistribution layers disposed on upper and lower surfaces of the volume of molding material that include electrical interconnects. The package includes one or more through-package interconnects that pass through the molding material. A first through-package interconnect couples an electrically conductive interconnect in a first redistribution layer to an electrically conductive interconnect in a second redistribution layer on an opposite side of the volume of molding material from the first redistribution layer, or it couples the interconnect to one of the components within the volume of molding material.

Inventors

• Michael B. Vincent
• Scott M Hayes
• Zhiwei Gong

Assignees

• NXP USA, INC.

Dates

Publication Date

20260512

Application Date

20230830

Claims (20)

1. 1 . An electronic device package, comprising: a first electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface; a second electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface, wherein the first surface of the second electronic component is bonded to the first surface of the first electronic component; a volume of molding material that encapsulates the first electronic component and the second electronic component; an upper set of redistribution layers formed from layers of electrically-insulating material that surround a first set of electrically conductive interconnects, wherein the upper set of redistribution layers extends from a first surface of the volume of molding material to an upper redistribution layer (“RDL”) surface; a lower set of redistribution layers formed from layers of electrically-insulating material that surround a second set of electrically conductive interconnects, wherein the lower set of redistribution layers extends from a second surface of the volume of molding material that is opposite the first surface of the volume of molding material to a lower RDL surface; and a first through-package interconnect that passes through the volume of molding material; wherein the first through-package interconnect electrically couples: an electrically conductive interconnect in a first redistribution layer to an electrically conductive interconnect in a second redistribution layer on an opposite side of the volume of molding material from the first redistribution layer; or an electrically conductive interconnect in the first redistribution layer to an electrical contact pad belonging to the first electronic component or an electrical contact pad belonging the second electronic component; wherein the first surface of the first electronic component has an extended portion that extends beyond a footprint of the second electronic component; wherein the electronic device package further comprises a second through-package interconnect that electrically couples an electrically conductive interconnect in the upper set of redistribution layers to an electrical contact pad on the extended portion of the first surface of the first electronic component.
2. 2 . The electronic device package of claim 1 , wherein the first electronic component and the second electronic component are electrically coupled to each other via corresponding electrical contact pads on the first surface of the first electronic component and on the first surface of the second electronic component that are bonded to each other.
3. 3 . The electronic device package of claim 1 , wherein the first through-package interconnect electrically couples an electrically conductive interconnect in the upper set of redistribution layers to an electrically conductive interconnect in the lower set of redistribution layers; wherein the first electronic component is disposed between the second electronic component and the lower set of redistribution layers; and wherein the first surface of the second electronic component has an extended region that extends beyond a footprint of first electronic component; and wherein the electronic device package further comprises a second through-package interconnect that electrically couples an electrically conductive interconnect in the lower set of redistribution layers to an electrical contact pad on the extended portion of the first surface of the second electronic component.
4. 4 . The electronic device package of claim 1 , wherein the first through-package interconnect is electrically coupled, at a first end of the first through-package interconnect, to an electrical interconnect in the upper set of redistribution layers or an electrical interconnect in the lower set of redistribution layers; and wherein the first through-package interconnect includes a conductive via that passes through the first electronic component or the second electronic component that is disposed between the first end of the first through-package interconnect and a second end of the first through-package interconnect.
5. 5 . The electronic device package of claim 1 , wherein a selected component is the first electronic component or the second electronic component; wherein the second surface of the selected component is disposed at a surface of the volume of molding material that is adjacent to the upper RDL surface or adjacent the lower RDL surface; and wherein the second surface of the selected component includes an electrical contact that is bonded to an electrical interconnect in the upper set of redistribution layers or an electrical interconnect in the lower set of redistribution layers.
6. 6 . The electronic device package of claim 1 , wherein a portion of the first through-package interconnect is formed by an electrically conductive via that passes through the first electronic component or the second electronic component.
7. 7 . The electronic device package of claim 1 , wherein the first through-package interconnect electrically couples an electrically conductive interconnect in the upper set of redistribution layers to an electrically conductive interconnect in the lower set of redistribution layers; and wherein the electronic device package further comprises a second through-package interconnect that passes through the volume of molding material and includes a portion formed by an electrically conductive via that passes through the first electronic component or the second electronic component.
8. 8 . An electronic device package, comprising: a first electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface; a second electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface, wherein the first surface of the second electronic component is bonded to the first surface of the first electronic component; a volume of molding material that encapsulates the first electronic component and the second electronic component; an upper set of redistribution layers formed from layers of electrically-insulating material that surround a first set of electrically conductive interconnects, wherein the upper set of redistribution layers extends from a first surface of the volume of molding material to an upper redistribution layer (“RDL”) surface; a lower set of redistribution layers formed from layers of electrically-insulating material that surround a second set of electrically conductive interconnects, wherein the lower set of redistribution layers extends from a second surface of the volume of molding material that is opposite the first surface of the volume of molding material to a lower RDL surface; and a through-package interconnect that passes through the volume of molding material; wherein the through-package interconnect electrically couples: an electrically conductive interconnect in a first redistribution layer to an electrically conductive interconnect in a second redistribution layer on an opposite side of the volume of molding material from the first redistribution layer; or an electrically conductive interconnect in the first redistribution layer to an electrical contact pad belonging to the first electronic component or an electrical contact pad belonging the second electronic component; wherein the through-package interconnect is a first through-package interconnect that electrically couples an electrically conductive interconnect in the upper set of redistribution layers to an electrically conductive interconnect in the lower set of redistribution layers; wherein the second electronic component is disposed between the first electronic component and the upper set of redistribution layers; wherein the first surface of the first electronic component has an extended portion that extends beyond a footprint of the second electronic component; and wherein the electronic device package further comprises a second through-package interconnect that electrically couples an electrically conductive interconnect in the upper set of redistribution layers to an electrical contact pad on the extended portion of the first surface of the first electronic component.
9. 9 . An electronic device package, comprising: a first electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface; a second electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface, wherein the first surface of the second electronic component is bonded to the first surface of the first electronic component; a volume of molding material that encapsulates the first electronic component and the second electronic component; an upper set of redistribution layers formed from layers of electrically-insulating material that surround a first set of electrically conductive interconnects, wherein the upper set of redistribution layers extends from a first surface of the volume of molding material to an upper redistribution layer (“RDL”) surface; a lower set of redistribution layers formed from layers of electrically-insulating material that surround a second set of electrically conductive interconnects, wherein the lower set of redistribution layers extends from a second surface of the volume of molding material that is opposite the first surface of the volume of molding material to a lower RDL surface; and a through-package interconnect that passes through the volume of molding material; wherein the through-package interconnect electrically couples: an electrically conductive interconnect in a first redistribution layer to an electrically conductive interconnect in a second redistribution layer on an opposite side of the volume of molding material from the first redistribution layer; or an electrically conductive interconnect in the first redistribution layer to an electrical contact pad belonging to the first electronic component or an electrical contact pad belonging the second electronic component; wherein the first electronic component is a rectangular device having an orientation defined by a first axis that is perpendicular to an edge of the first electronic component and parallel to a surface of the first electronic component; wherein the second electronic component is a rectangular device having an orientation defined by a second axis that is perpendicular to an edge of the second electronic component and parallel to a surface of the second electronic component; and wherein the first axis is neither parallel nor perpendicular to the second axis.
10. 10 . A method, comprising: providing a first electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface; and receiving a second electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface; wherein the first surface of the second electronic component is bonded to the first surface of the first electronic component; wherein a volume of molding material encapsulates the first electronic component and the second electronic component; wherein the first surface of the first electronic component has an extended portion that extends beyond a footprint of the second electronic component; wherein the method further comprises: forming an upper set of redistribution layers from layers of electrically-insulating material that surround a first set of electrically conductive interconnects, wherein the upper set of redistribution layers extends from a first surface of the volume of molding material to an upper redistribution layer (“RDL”) surface; forming a lower set of redistribution layers from layers of electrically-insulating material that surround a second set of electrically conductive interconnects, wherein the lower set of redistribution layers extends from a second surface of the volume of molding material that is opposite the first surface of the volume of molding material to a lower RDL surface; forming a first through-package interconnect that passes through the volume of molding material; and forming a second through-package interconnect that electrically couples an electrically conductive interconnect in the upper set of redistribution layers to an electrical contact pad on the extended portion of the first surface of the first electronic component; and wherein the first through-package interconnect electrically couples: an electrically conductive interconnect in a first redistribution layer to an electrically conductive interconnect in a second redistribution layer on an opposite side of the volume of molding material from the first redistribution layer; or an electrically conductive interconnect in the first redistribution layer to an electrical contact pad belonging to the first electronic component or an electrical contact pad belonging the second electronic component.
11. 11 . The method of claim 10 , wherein the first electronic component and the second electronic component are electrically coupled to each other via corresponding electrical contact pads on the first surface of the first electronic component and on the first surface of the second electronic component that are bonded to each other.
12. 12 . The method of claim 10 , wherein the first through-package interconnect electrically couples an electrically conductive interconnect in the upper set of redistribution layers to an electrically conductive interconnect in the lower set of redistribution layers; wherein the first electronic component is disposed between the second electronic component and the lower set of redistribution layers; and wherein the first surface of the second electronic component has an extended region that extends beyond a footprint of first electronic component; and wherein the method further comprises forming a second through-package interconnect that electrically couples an electrically conductive interconnect in the lower set of redistribution layers to an electrical contact pad on the extended portion of the first surface of the second electronic component.
13. 13 . The method of claim 10 , wherein the first through-package interconnect is electrically coupled, at a first end of the first through-package interconnect, to an electrical interconnect in the upper set of redistribution layers or an electrical interconnect in the lower set of redistribution layers; and wherein the first through-package interconnect includes a conductive via that passes through the first electronic component or the second electronic component that is disposed between the first end of the first through-package interconnect and a second end of the first through-package interconnect.
14. 14 . The method of claim 10 , wherein a selected component is the first electronic component or the second electronic component; wherein the second surface of the selected component is disposed at a surface of the volume of molding material that is adjacent to the upper RDL surface or adjacent the lower RDL surface; and wherein the second surface of the selected component includes an electrical contact that is bonded to an electrical interconnect in the upper set of redistribution layers or an electrical interconnect in the lower set of redistribution layers.
15. 15 . The method of claim 10 , wherein a portion of the first through-package interconnect is formed by an electrically conductive via that passes through the first electronic component or the second electronic component.
16. 16 . The method of claim 10 , wherein the first through-package interconnect electrically couples an electrically conductive interconnect in the upper set of redistribution layers to an electrically conductive interconnect in the lower set of redistribution layers; and wherein the method further comprises a second through-package interconnect that passes through the volume of molding material and includes a portion formed by an electrically conductive via that passes through the first electronic component or the second electronic component.
17. 17 . The method of claim 10 , further comprising bonding the first surface of the second electronic component to the first surface of the first electronic component.
18. 18 . A method, comprising: providing a first electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface; and receiving a second electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface; wherein the first surface of the second electronic component is bonded to the first surface of the first electronic component; wherein a volume of molding material encapsulates the first electronic component and the second electronic component; wherein the method further comprises: forming an upper set of redistribution layers from layers of electrically-insulating material that surround a first set of electrically conductive interconnects, wherein the upper set of redistribution layers extends from a first surface of the volume of molding material to an upper redistribution layer (“RDL”) surface; forming a lower set of redistribution layers from layers of electrically-insulating material that surround a second set of electrically conductive interconnects, wherein the lower set of redistribution layers extends from a second surface of the volume of molding material that is opposite the first surface of the volume of molding material to a lower RDL surface; and forming a through-package interconnect that passes through the volume of molding material; and wherein the through-package interconnect electrically couples: an electrically conductive interconnect in a first redistribution layer to an electrically conductive interconnect in a second redistribution layer on an opposite side of the volume of molding material from the first redistribution layer; or an electrically conductive interconnect in the first redistribution layer to an electrical contact pad belonging to the first electronic component or an electrical contact pad belonging the second electronic component; wherein the through-package interconnect is a first through-package interconnect that electrically couples an electrically conductive interconnect in the upper set of redistribution layers to an electrically conductive interconnect in the lower set of redistribution layers; wherein the second electronic component is disposed between the first electronic component and the upper set of redistribution layers; wherein the first surface of the first electronic component has an extended portion that extends beyond a footprint of the second electronic component; and wherein the method further comprises forming a second through-package interconnect that electrically couples an electrically conductive interconnect in the upper set of redistribution layers to an electrical contact pad on the extended portion of the first surface of the first electronic component.
19. 19 . A method, comprising: providing a first electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface; and receiving a second electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface; wherein the first surface of the second electronic component is bonded to the first surface of the first electronic component; wherein a volume of molding material encapsulates the first electronic component and the second electronic component; wherein the method further comprises: forming an upper set of redistribution layers from layers of electrically-insulating material that surround a first set of electrically conductive interconnects, wherein the upper set of redistribution layers extends from a first surface of the volume of molding material to an upper redistribution layer (“RDL”) surface; forming a lower set of redistribution layers from layers of electrically-insulating material that surround a second set of electrically conductive interconnects, wherein the lower set of redistribution layers extends from a second surface of the volume of molding material that is opposite the first surface of the volume of molding material to a lower RDL surface; and forming a through-package interconnect that passes through the volume of molding material; and wherein the through-package interconnect electrically couples: an electrically conductive interconnect in a first redistribution layer to an electrically conductive interconnect in a second redistribution layer on an opposite side of the volume of molding material from the first redistribution layer; or an electrically conductive interconnect in the first redistribution layer to an electrical contact pad belonging to the first electronic component or an electrical contact pad belonging the second electronic component; wherein the first electronic component is a rectangular device having an orientation defined by a first axis that is perpendicular to an edge of the first electronic component and parallel to a surface of the first electronic component; wherein the second electronic component is a rectangular device having an orientation defined by a second axis that is perpendicular to an edge of the second electronic component and parallel to a surface of the second electronic component; and wherein the first axis is neither parallel nor perpendicular to the second axis.
20. 20 . An electronic device package, comprising: a first electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface; a second electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface, wherein the first surface of the second electronic component is bonded to the first surface of the first electronic component; a volume of molding material that encapsulates the first electronic component and the second electronic component; an upper set of redistribution layers formed from layers of electrically-insulating material that surround a first set of electrically conductive interconnects, wherein the upper set of redistribution layers extends from a first surface of the volume of molding material to an upper redistribution layer (“RDL”) surface; a lower set of redistribution layers formed from layers of electrically-insulating material that surround a second set of electrically conductive interconnects, wherein the lower set of redistribution layers extends from a second surface of the volume of molding material that is opposite the first surface of the volume of molding material to a lower RDL surface; and a first through-package interconnect that passes through the volume of molding material; wherein the first through-package interconnect electrically couples an electrically conductive interconnect in a first redistribution layer to an electrically conductive interconnect in a second redistribution layer on an opposite side of the volume of molding material from the first redistribution layer; wherein the first surface of the first electronic component has an extended portion that extends beyond a footprint of the second electronic component; wherein the electronic device package further comprises a second through-package interconnect that electrically couples an electrically conductive interconnect in the upper set of redistribution layers to an electrical contact pad on the extended portion of the first surface of the first electronic component.

Description

TECHNICAL FIELD Embodiments of the subject matter described herein relate to polymeric packages for semiconductor devices and other electronic components and methods of fabricating such packages. BACKGROUND Semiconductor devices and other electronic devices are frequently assembled into packages to protect the devices from damage and to provide macroscopic electrical contacts. Packages can be made of various materials including polymers and ceramics. It can be desirable to assemble multiple devices within one package in order to reduce the volume required for various components in larger assemblies. It can also be desirable to interconnect multiple devices within a multi-chip package to save space and/or to improve device performance characteristics such as maximum clock speeds, power dissipation, and the like. SUMMARY In an example embodiment, an electronic device package includes a first electronic component that has a first surface provided with electrical contact pads and a second surface opposite the first surface; and a second electronic component that has a first surface provided with electrical contact pads and a second surface opposite the first surface. The first surface of the second electronic component is bonded to the first surface of the first electronic component and a volume of molding material encapsulates the first electronic component and the second electronic component. The electronic device package also includes an upper set of redistribution layers, a lower set of redistribution layers, and a through-package interconnect that passes through the volume of molding material. The upper set of redistribution layers is formed from layers of electrically-insulating material that surround a first set of electrically conductive interconnects, where the upper set of redistribution layers extends from a first surface of the volume of molding material to an upper redistribution layer (“RDL”) surface. The lower set of redistribution layers is formed from layers of electrically-insulating material that surround a second set of electrically conductive interconnects. The lower set of redistribution layers extends from a second surface of the volume of molding material that is opposite the first surface of the volume of molding material to a lower RDL surface. The through-package interconnect electrically couples an electrically conductive interconnect in a first redistribution layer to an electrically conductive interconnect in a second redistribution layer on an opposite side of the volume of molding material from the first redistribution layer; or the through-package interconnect electrically couples an electrically conductive interconnect in the first redistribution layer to an electrical contact pad belonging to the first electronic component or an electrical contact pad belonging the second electronic component. In another example embodiment, a method includes providing a first electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface; and a second electronic component having a first surface provided with electrical contact pads and a second surface opposite the first surface. The first surface of the second electronic component is bonded to the first surface of the first electronic component and a volume of molding material encapsulates the first electronic component and the second electronic component. The method further includes forming an upper set of redistribution layers, forming a lower set of redistribution layers, and forming a through-package interconnect that passes through the volume of molding material. The upper set of redistribution layers is formed from layers of electrically-insulating material that surround a first set of electrically conductive interconnects, wherein the upper set of redistribution layers extends from a first surface of the volume of molding material to an upper redistribution layer (“RDL”) surface. The lower set of redistribution layers is formed from layers of electrically-insulating material that surround a second set of electrically conductive interconnects, wherein the lower set of redistribution layers extends from a second surface of the volume of molding material that is opposite the first surface of the volume of molding material to a lower RDL surface. The through-package interconnect electrically couples an electrically conductive interconnect in a first redistribution layer to an electrically conductive interconnect in a second redistribution layer on an opposite side of the volume of molding material from the first redistribution layer; or the through-package interconnect electrically couples an electrically conductive interconnect in the first redistribution layer to an electrical contact pad belonging to the first electronic component or an electrical contact pad belonging the second electronic component. BRIEF DESCRIPTION OF THE DRAWINGS The present disclosure is illustrate