US-12628690-B2 - Layouts of data pads on a semiconductor die

US12628690B2US 12628690 B2US12628690 B2US 12628690B2US-12628690-B2

Abstract

Layouts for data pads on a semiconductor die are disclosed. An apparatus may include circuits, a first edge, a second edge perpendicular to the first edge, a third edge opposite the first edge, and a fourth edge opposite the second edge. The apparatus may also include data pads variously electrically coupled to the circuits. The data pads may include a data pad positioned a first distance from the first edge and a second distance from the second edge. The apparatus may also include dummy data pads electrically isolated from the circuits. The dummy data pads may include a dummy data pad positioned substantially the first distance from the first edge and substantially the second distance from the fourth edge. Associated systems and methods are also disclosed.

Inventors

Andreas Kuesel
Takamasa Suzuki
Jens Polney
Seiji Narui
Shiro Uchiyama

Assignees

MICRON TECHNOLOGY, INC.

Dates

Publication Date: 20260512
Application Date: 20220831

Claims (15)

1 . An apparatus comprising: circuits; a first edge; a second edge perpendicular to the first edge; a third edge opposite the first edge; a fourth edge opposite the second edge; data pads variously electrically coupled to the circuits, the data pads comprising: a data pad positioned a first distance from the first edge and a second distance from the second edge; and dummy data pads electrically isolated from the circuits, the dummy data pads comprising: a first dummy data pad positioned substantially the first distance from the first edge and substantially the second distance from the fourth edge; a second dummy data pad positioned substantially the first distance from the third edge and substantially the second distance from the fourth edge; and a third dummy data pad positioned substantially the first distance from the third edge and substantially the second distance from the second edge.
2 . The apparatus of claim 1 , wherein the data pads further comprise a second data pad positioned a third distance from the first edge and a fourth distance from the second edge; and wherein the dummy data pads further comprise: a fourth dummy data pad positioned substantially the third distance from the first edge and substantially the fourth distance from the fourth edge; a fifth dummy data pad positioned substantially the third distance from the third edge and substantially the fourth distance from the fourth edge; and a sixth dummy data pad positioned substantially the third distance from the third edge and substantially the fourth distance from the second edge.
3 . The apparatus of claim 1 , wherein the apparatus comprises a center line between the first edge and the third edge; wherein the data pads further comprise a second data pad positioned a third distance from the center line, on a first-edge side of the center line, and a fourth distance from the second edge; and wherein the dummy data pads further comprise: a fourth dummy data pad positioned substantially the third distance from the center line, on the first-edge side of the center line, and substantially the fourth distance from the fourth edge; a fifth dummy data pad positioned substantially the third distance from the center line, on a third-edge side of the center line, and substantially the fourth distance from the fourth edge; and a sixth dummy data pad positioned substantially the third distance from the center line, on the third-edge side of the center line, and substantially the fourth distance from the second edge.
4 . The apparatus of claim 1 , wherein the apparatus comprises a first center line between the first edge and the third edge, and a second center line between the second edge and the fourth edge; wherein the data pads further comprise a second data pad positioned a third distance from the first center line, on a first-edge side of the first center line, and a fourth distance from the second center line, on a second-edge side of the second center line; and wherein the dummy data pads further comprise: a fourth dummy data pad positioned substantially the third distance from the first center line, on the first-edge side of the first center line, and substantially the fourth distance from the second center line, on a fourth-edge side of the second center line; a fifth dummy data pad positioned substantially the third distance from the first center line, on a third-edge side of the first center line, and substantially the fourth distance from the second center line, on the fourth-edge side of the second center line; and a sixth dummy data pad positioned substantially the third distance from the first center line, on the third-edge side of the first center line, and substantially the fourth distance from the second center line, on the second-edge side of the second center line.
5 . The apparatus of claim 1 , wherein the data pads comprise a first category of data pads and a second category of data pads, the data pads comprising: a first first-category data pad that is a third distance from the first edge and a fourth distance from the second edge; a second first-category data pad that is substantially the third distance from the first edge and substantially the fourth distance from the fourth edge; a third first-category data pad that is substantially the third distance from the third edge and substantially the fourth distance from the fourth edge; a fourth first-category data pad that is substantially the third distance from the third edge and substantially the fourth distance from the second edge; a first second-category data pad that is a fifth distance from the first edge and a sixth distance from the second edge; a second second-category data pad that is substantially the fifth distance from the first edge and substantially the sixth distance from the fourth edge; a third second-category data pad that is substantially the fifth distance from the third edge and substantially the sixth distance from the fourth edge; and a fourth second-category data pad that is substantially the fifth distance from the third edge and substantially the sixth distance from the second edge.
6 . The apparatus of claim 5 , wherein the first category of data pads are to communicate a first category of signals and the second category of data pads are to communicate a second category of signals.
7 . The apparatus of claim 1 , wherein the first edge and the third edge have a first length, wherein the second edge and the fourth edge have a second length, and wherein the first length is longer than the second length.
8 . The apparatus of claim 1 , wherein all of the first edge, the second edge, the third edge, and the fourth edge have the same length.
9 . An apparatus comprising: dies stacked into a stack, one above another, each of the dies substantially identical to each of the other dies, or each of a first subset of the dies exhibits mirror symmetry with respect to each of a second subset of the dies, each of the dies comprising: circuits; data pads variously electrically coupled to the circuits; and dummy data pads electrically isolated from the circuits; wherein the dies are oriented in the stack such that a data pad of the data pads of a first die of the dies is vertically aligned with a dummy data pad of the dummy data pads of a second die of the dies, and wherein the data pad and the dummy data pad are connected by an inter-die connection therebetween.
10 . The apparatus of claim 9 , wherein each of the dies is substantially identical to each of the other dies; wherein a first substantially quarter of the dies are oriented in the stack in a first orientation; wherein a second substantially quarter of the dies are oriented in the stack in a second orientation, the second orientation flipped substantially 180°, relative to the first orientation, about an axis in a respective plane of each of the respective dies; wherein a third substantially quarter of the dies are oriented in the stack in a third orientation, the third orientation rotated substantially 180°, relative to the first orientation, about an axis normal to a plane of each of the respective dies; and wherein a fourth substantially quarter of the dies are oriented in the stack in a fourth orientation, the fourth orientation flipped substantially 180°, relative to the first orientation, about an axis in a respective plane of each of the respective dies and rotated substantially 180°, relative to the first orientation, about an axis normal to the plane of each of the respective dies.
11 . The apparatus of claim 10 , wherein one of a top quarter, a top-middle quarter, a bottom-middle quarter, or a bottom quarter of the stack comprises dies oriented in the first orientation; wherein another one of the top quarter, the top-middle quarter, the bottom-middle quarter, or the bottom quarter of the stack comprises dies oriented in the second orientation; wherein yet another one of the top quarter, the top-middle quarter, the bottom-middle quarter, or the bottom quarter of the stack comprises dies oriented in the third orientation; and wherein still another one of the top quarter, the top-middle quarter, the bottom-middle quarter, or the bottom quarter of the stack comprises dies oriented in the fourth orientation.
12 . The apparatus of claim 9 , wherein each of a first subset of the dies exhibits mirror symmetry with respect to each of a second subset of the dies; wherein a first substantially half of the first subset of the dies are oriented in the stack in a first orientation; wherein a second substantially half of the first subset of the dies are oriented in the stack in a second orientation, the second orientation rotated substantially 180°, relative to the first orientation, about an axis normal to a plane of each of the respective dies; wherein a first substantially half of the second subset of the dies are oriented in the stack in the first orientation; and wherein a second substantially half of the second subset of the dies are oriented in the stack in the second orientation.
13 . The apparatus of claim 12 , wherein one of a top quarter, a top-middle quarter, a bottom-middle quarter, or a bottom quarter of the stack comprises dies of the first subset oriented in the first orientation; wherein another one of the top quarter, the top-middle quarter, the bottom-middle quarter, or the bottom quarter of the stack comprises dies of the first subset oriented in the second orientation; wherein yet another one of the top quarter, the top-middle quarter, the bottom-middle quarter, or the bottom quarter of the stack comprises dies of the second subset oriented in the first orientation; and wherein still another one of the top quarter, the top-middle quarter, the bottom-middle quarter, or the bottom quarter of the stack comprises dies of the second subset oriented in the second orientation.
14 . The apparatus of claim 9 , wherein each of the dies are substantially identical to each of the other dies; wherein a first substantially quarter of the dies are oriented in the stack in a first orientation; wherein a second substantially quarter of the dies are oriented in the stack in a second orientation, the second orientation being rotated substantially 90°, relative to the first orientation, about an axis normal to a plane of each of the respective dies; wherein a third substantially quarter of the dies are oriented in the stack in a third orientation, the third orientation being rotated substantially 180°, relative to the first orientation, about an axis normal to a plane of each of the respective dies; and wherein a fourth substantially quarter of the dies are oriented in the stack in a fourth orientation, the fourth orientation being rotated substantially 270°, relative to the first orientation, about an axis normal to a plane of each of the respective dies.
15 . The apparatus of claim 14 , wherein one of a top quarter, a top-middle quarter, a bottom-middle quarter, or a bottom quarter of the stack comprises dies oriented in the first orientation; wherein another one of the top quarter, the top-middle quarter, the bottom-middle quarter, or the bottom quarter of the stack comprises dies oriented in the second orientation; wherein yet another one of the top quarter, the top-middle quarter, the bottom-middle quarter, or the bottom quarter of the stack comprises dies oriented in the third orientation; and wherein still another one of the top quarter, the top-middle quarter, the bottom-middle quarter, or the bottom quarter of the stack comprises dies oriented in the fourth orientation.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation-in-part of U.S. patent application Ser. No. 17/646,565, filed Dec. 30, 2021. U.S. Patent Application Ser. No. 17/823,638 is being filed on even date herewith, the disclosure of each of which is hereby incorporated herein in its entirety by this reference. TECHNICAL FIELD Embodiments of the disclosure relate to semiconductor-die layouts, and more specifically to layouts of data pads on a semiconductor die. Yet more specifically, various embodiments relate to layouts of data pads, dummy data pads, and common data pads on a die to allow for stacking of a number of dies. Other embodiments related to stacks of dies and methods of stacking dies. Additionally, embodiments include related methods, devices, and systems. BACKGROUND Memory devices are typically provided as semiconductor, integrated circuits in computers or other electronic systems. There are many different types of memory including, for example, random-access memory (RAM), read-only memory (ROM), dynamic random-access memory (DRAM), synchronous dynamic random-access memory (SDRAM), resistive random-access memory (RRAM), double-data-rate memory (DDR), low-power double-data-rate memory (LPDDR), phase-change memory (PCM), high-bandwidth memory (HBM) and Flash memory. Some memory devices include two or more dies (also commonly referred to as “dice”) stacked one above another. In the present disclosure, the terms “die” and “dies” may refer to a semiconducting material on and/or in which one or more circuits (including, e.g., memory arrays) are or may be fabricated. BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS While this disclosure concludes with claims particularly pointing out and distinctly claiming specific embodiments, various features and advantages of embodiments within the scope of this disclosure may be more readily ascertained from the following description when read in conjunction with the accompanying drawings, in which: FIG. 1 is a functional block diagram illustrating an example memory device, in accordance with at least one embodiment of the disclosure. FIG. 2A is a plan-view diagram illustrating an example layout of a die in accordance with at least one embodiment of the disclosure. FIG. 2B is a plan-view diagram illustrating an example layout of pads of an example DW area of the die of FIG. 2A in accordance with at least one embodiment of the disclosure. FIG. 3 is a plan-view diagram illustrating an example layout of data pads, dummy data pads, and common data pads on an example die in accordance with at least one embodiment of the disclosure. FIG. 4 is a perspective-view diagram illustrating an example stack of dies in accordance with at least one embodiment of the disclosure. FIG. 5 is a perspective-view diagram illustrating another example stack of dies in accordance with at least one embodiment of the disclosure. FIG. 6 is a perspective-view diagram illustrating yet another example stack of dies in accordance with at least one embodiment of the disclosure. FIG. 7 is a perspective-view diagram illustrating yet another example stack of dies in accordance with at least one embodiment of the disclosure. FIG. 8A is a plan-view diagram illustrating another example layout 802a of positions for data pads, dummy data pads and/or common data pads on an example die 800a in accordance with at least one embodiment of the disclosure. FIG. 8B is a plan-view diagram illustrating yet another example layout of data pads, dummy data pads and common data pads on an example die in accordance with at least one embodiment of the disclosure. FIG. 8C is a plan-view diagram illustrating yet another example layout of data pads, dummy data pads and common data pads on an example die in accordance with at least one embodiment of the disclosure. FIG. 8D is a plan-view diagram illustrating yet another example layout of data pads, dummy data pads and common data pads on an example die in accordance with at least one embodiment of the disclosure. FIG. 9A is a perspective-view diagram illustrating yet another example stack of dies in accordance with at least one embodiment of the disclosure. FIG. 9B is a perspective-view diagram illustrating yet another example stack of dies in accordance with at least one embodiment of the disclosure. FIG. 9C is a perspective-view diagram illustrating yet another example stack of dies in accordance with at least one embodiment of the disclosure. FIG. 10 is a perspective-view diagram illustrating yet another example stack of dies in accordance with at least one embodiment of the disclosure. FIG. 11 is a flowchart illustrating an example method in accordance with at least one embodiment of the disclosure. FIG. 12 is a flowchart illustrating another example method in accordance with at least one embodiment of the disclosure. FIG. 13 is a flowchart illustrating yet another example method in accordance with at least one embodiment of the disclosure. FIG. 14