US-12628696-B2 - Film package and package module including the same

Abstract

A film package includes a base film including peripheral regions on opposite ends of the base film in a width direction and extending in a lengthwise direction, an inner region between the peripheral regions and extending in the lengthwise direction, and sprocket holes provided on the peripheral regions at a regular interval in the lengthwise direction, and a unit film package provided on the base film and defined by a cut line, the unit film package including a mount region on the inner region and a connection region provided in the lengthwise direction from the mount region, the connection region extending from the inner region toward a location between the sprocket holes in the lengthwise direction.

Inventors

• NARAE SHIN

Assignees

• SAMSUNG ELECTRONICS CO., LTD.

Dates

Publication Date

20260512

Application Date

20230124

Priority Date

20220510

Claims (18)

1. 1 . A film package comprising: a base film comprising: peripheral regions on opposite ends of the base film in a width direction of the base film and extending in a lengthwise direction of the base film; an inner region between the peripheral regions and extending in the lengthwise direction; and sprocket holes provided on the peripheral regions, the sprocket holes provided at a regular interval in the lengthwise direction; and a unit film package provided on the base film and defined by a cut line, the unit film package comprising: a mount region on the inner region; a connection region provided in the lengthwise direction from the mount region, the connection region extending from the inner region into at least one peripheral region of the peripheral regions and toward a location between the sprocket holes in the lengthwise direction, and at least one pad in the connection region, in the at least one peripheral region, and between the sprocket holes.
2. 2 . The film package of claim 1 , wherein a first width of the mount region in the width direction is less than a second width of the connection region in the width direction, and wherein the second width is less than or equal to a third width of the base film in the width direction.
3. 3 . The film package of claim 2 , wherein the unit film package has an H shape.
4. 4 . The film package of claim 2 , wherein the mount region does not overlap the peripheral regions, and wherein the connection region does not overlap the inner region.
5. 5 . The film package of claim 1 , wherein a fourth width of the connection region in the lengthwise direction is less than a first interval between the sprocket holes in the lengthwise direction.
6. 6 . The film package of claim 5 , wherein the fourth width is about 0.15 times to about 0.90 times the first interval.
7. 7 . The film package of claim 5 , wherein the fourth width of the connection region is constant on the peripheral regions.
8. 8 . The film package of claim 5 , wherein, on the peripheral regions, the fourth width of the connection region decreases as a distance of the connection region from the inner region increases.
9. 9 . The film package of claim 1 , wherein a first width of the mount region in the width direction is less than a second interval between the sprocket holes in the width direction, and a second width of the connection region in the width direction of is greater than the second interval between the sprocket holes in the width direction.
10. 10 . The film package of claim 1 , wherein the unit film package does not overlap the sprocket holes.
11. 11 . The film package of claim 1 , wherein the unit film package further comprises: a semiconductor chip provided on the mount region of the unit film package; pads provided on the connection region of the unit film package and arranged in the width direction, the pads comprising the at least one pad; and connection lines through which the semiconductor chip and the pads are connected on the base film.
12. 12 . A film package comprising: a base film extending in a first direction, the base film comprising peripheral regions extending in the first direction and on opposite ends of the base film in a second direction that intersects the first direction; a semiconductor chip provided on the base film; pads provided on the base film, the pads being disposed on one side in the first direction of the semiconductor chip and arranged in the second direction; and connection lines provided on the base film and connecting the semiconductor chip and the pads, wherein the base film comprises sprocket holes that vertically penetrate the base film, the sprocket holes being provided on opposite ends of the base film in the second direction and arranged at a regular interval in the first direction, and wherein at least a portion of the pads is in at least one peripheral region of the peripheral regions and between a pair of sprocket holes from among the sprocket holes, the pair of sprocket holes being adjacent to each other in the first direction.
13. 13 . The film package of claim 12 , wherein the base film further comprises: an inner region between the peripheral regions and extending in the first direction, wherein the semiconductor chip is provided on the inner region, and wherein the sprocket holes are provided in the peripheral regions.
14. 14 . The film package of claim 12 , further comprising a unit film package defined by a cut line on the base film, the unit film package comprising the semiconductor chip, the pads, and the connection lines.
15. 15 . The film package of claim 14 , wherein the unit film package further comprises: a mount region on which the semiconductor chip is mounted; and a connection region on which the pads are provided and having a linear shape extending in the second direction, the connection region being provided in the first direction, and wherein at least a portion of the connection region is positioned between the pair of sprocket holes.
16. 16 . The film package of claim 15 , wherein a first width in the first direction of the connection region is about 0.15 times to about 0.90 times an interval between the pair of sprocket holes.
17. 17 . The film package of claim 15 , wherein a second width of the mount region in the second direction is less than a third width of the connection region in the second direction, and wherein the third width is less than or equal to a fourth width of the base film in the second direction.
18. 18 . The film package of claim 14 , wherein the unit film package does not overlap the sprocket holes.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application is based on and claims priority under 35 U.S.C § 119 to Korean Patent Application No. 10-2022-0056940, filed on May 10, 2022, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety. BACKGROUND 1. Field Example embodiments of the present disclosure relate to a semiconductor package, and more particularly, to a chip-on-film (COF) package and a package module including the same. 2. Description of Related Art A chip-on-film (COF) package technique has been developed to use a flexible film substrate in order to accommodate the recent trend toward smaller, thinner, and lighter electronic products. According to the COF package technique, a semiconductor chip may be directly flip-chip bonded to a film substrate and coupled through a short lead to an external circuit. The COF package may be applied to portable terminal devices such as a cellular phone and a personal digital assistant (PDA), laptop computers, or display panels. SUMMARY Some example embodiments of the present disclosure provide a compact-sized film package and a package module including the same. Further, some example embodiments of the present disclosure provide a highly integrated film package and a package module including the same. Further still, some example embodiments of the present disclosure provide a high-reliable film package and a package module including the same. Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments. According to an aspect of an example embodiment, a film package includes: a base film including: peripheral regions on opposite ends of the base film in a width direction of the base film and extending in a lengthwise direction of the base film; an inner region between the peripheral regions and extending in the lengthwise direction; and sprocket holes provided on the peripheral regions, the sprocket holes provided at a regular interval in the lengthwise direction; and a unit film package provided on the base film and defined by a cut line, the unit film package including a mount region on the inner region; and a connection region provided in the lengthwise direction from the mount region, the connection region extending from the inner region toward a location between the sprocket holes in the lengthwise direction. According to an aspect of an example embodiment, a film package includes: a base film extending in a first direction; a semiconductor chip provided on the base film; pads provided on the base film and arranged in a second direction that intersects the first direction; and connection lines provided on the base film and connecting the semiconductor chip and the pads, wherein the base film includes sprocket holes that vertically penetrate the base film, the sprocket holes being provided on opposite ends of the base film in the second direction and arranged at a regular interval in the first direction, and wherein at least a portion of the pads is between a pair of sprocket holes from among the sprocket holes, the pair of sprocket holes being adjacent to each other in the first direction. According to an aspect of an example embodiment, a package module including: a display device; and a unit film package electrically connected to the display device, wherein the unit film package includes: a film substrate including a mount region and a connection region provided in a first direction of the mount region; a semiconductor chip provided on the mount region of the film substrate; pads provided on the connection region of the film substrate and connected to the display device; and connection lines provided on the film substrate and connecting the semiconductor chip and the pads, wherein a first width of the connection region in a second direction is greater than a second width of the mount region in the second direction, wherein the second direction intersects the first direction, and wherein the first width is greater than about 43 mm and less than about 48 mm. BRIEF DESCRIPTION OF THE DRAWINGS The above and other aspects, features, and advantages of certain example embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which: FIG. 1 is a diagram of a film package according to an example embodiment; FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1, of a film package according to an example embodiment; FIG. 3 is a cross-sectional view taken along line II-II′ of FIG. 1, of a film package according to an example embodiment; FIG. 4 is a diagram of section A of FIG. 1 according to an example embodiment; FIG. 5 is a diagram of a film package according to an example embodiment; FIGS. 6 and 7 are diagrams of section B of FIG. 5 according to an example embodiment; FIG. 8 i