US-12628704-B2 - Optoelectronic package structure and method of manufacturing the same

US12628704B2US 12628704 B2US12628704 B2US 12628704B2US-12628704-B2

Abstract

An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.

Inventors

JR-Wei LIN
Mei-Ju Lu

Assignees

ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Dates

Publication Date: 20260512
Application Date: 20240312

Claims (4)

1 . An optoelectronic package structure, comprising: a carrier; a photonic component laterally adjacent to the carrier; an electronic component connected to the photonic component and the carrier; a circuit layer disposed between and electrically connected to the photonic component and the electronic component; and a processing unit disposed over the circuit layer and electrically connected to the electronic component through the circuit layer.
2 . The optoelectronic package structure of claim 1 , wherein the photonic component has a side facing the electronic component, and the side is configured to be connected to an optical component.
3 . The optoelectronic package structure of claim 1 , wherein the photonic component overhangs the electronic component.
4 . The optoelectronic package structure of claim 1 , wherein the electronic component overhangs the carrier.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser. No. 17/506,462, filed Oct. 20, 2021, now U.S. Pat. No. 11,929,357, the content of which is incorporated herein by reference in its entirety. BACKGROUND 1. Technical Field The present disclosure relates generally to optoelectronic package structures and methods of manufacturing the optoelectronic package structures. 2. Description of the Related Art Currently, an optoelectronic package may include an application specific integrated circuit (ASIC) and an optoelectronic device arranged in a vertical direction. The optoelectronic device may include an electronic integrated circuit (EIC) and a photonic integrated circuit (PIC). A carrier, such as a substrate or an interposer, may be disposed between the ASIC and the optoelectronic component. However, given that the optoelectronic component and the ASIC are arranged in a vertical direction and a relatively thick carrier is used, electrical connection issues may exist due to the relatively long electrical path between the ASIC and the optoelectronic device. SUMMARY In some arrangements, an optoelectronic package structure includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path electrically connects the electronic component. In some arrangements, an optoelectronic package structure includes a carrier, an electronic component and a photonic component. The carrier includes a first region and a second region. The electronic component is at least partially embedded in the second region of the carrier. The photonic component is disposed over the electronic component. In some arrangements, an optoelectronic package structure includes a processing unit, an electronic component and a carrier. The carrier includes a first path configured to supply power to the processing unit and a second path configured to electrically communicate the processing unit and the electronic component. The second path is shorter than the first path. BRIEF DESCRIPTION OF THE DRAWINGS Aspects of some arrangements of the present disclosure are readily understood from the following detailed description when read with the accompanying figures. It should be noted that various structures may not be drawn to scale, and dimensions of the various structures may be arbitrarily increased or reduced for clarity of discussion. FIG. 1 illustrates a schematic cross-sectional view of optoelectronic package structure in accordance with some arrangements of the present disclosure; FIG. 2A illustrates a schematic top view of a portion of an optoelectronic package structure in accordance with some arrangements of the present disclosure; FIG. 2B illustrates a schematic bottom view of a portion of an optoelectronic package structure in accordance with some arrangements of the present disclosure; FIG. 2C illustrates a schematic bottom view of a portion of an optoelectronic package structure in accordance with some arrangements of the present disclosure; and FIG. 3A. FIG. 3B, FIG. 3C, FIG. 3D and FIG. 3E each illustrates a schematic cross-sectional view of a structure at a fabrication stage involved in a method for manufacturing an optoelectronic package structure in accordance with some arrangements of the present disclosure. DETAILED DESCRIPTION Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar components. Arrangements of the present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings. The following disclosure provides many different arrangements, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to explain certain aspects of the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include arrangements in which the first and second features are formed or disposed in direct contact, and may also include arrangements in which additional features may be formed or disposed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various arrangements and/or configurations discussed. As used herein, the “active side” or “active surface” of a photonic component may refer to a side or a surface along which a waveguide is disposed. The waveguide may be disposed adja