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US-12628717-B2 - Semiconductor module and power semiconductor module

US12628717B2US 12628717 B2US12628717 B2US 12628717B2US-12628717-B2

Abstract

A method for manufacturing a power semiconductor module and a power semiconductor module having, in each case, a housing, a switchgear arranged in this housing and having a plurality of connection elements, has the following method steps: A) forming a housing with pre-fixed connection elements; B) arranging the switchgear in the housing and connecting the connection elements to connection surfaces of a substrate of the switchgear; C) arranging a positioning device for fixing the position of the connection elements with respect to one another; D) fixing the connection elements relative to one another and to the housing.

Inventors

  • Stefan Oehling
  • Jürgen Steger

Assignees

  • SEMIKRON ELEKTRONIK GMBH & CO. KG

Dates

Publication Date
20260512
Application Date
20221210
Priority Date
20211221

Claims (6)

  1. 1 . A method, for manufacturing a power semiconductor module, said power semiconductor module having a housing ( 2 ), a switchgear ( 3 ) arranged in the housing ( 2 ), and a plurality of connection elements ( 4 ), comprising the steps of: A) forming said housing ( 2 ) with a plurality of pre-fixed said connection elements ( 4 ); B) arranging said switchgear ( 3 ) in the housing ( 2 ) and connecting the connection elements ( 4 ) to respective connection surfaces of a substrate of the switchgear ( 3 ); wherein the connection elements ( 4 ) each have a foot portion ( 4 ) and a contact portion ( 42 ); wherein the Step (B) includes the steps of: moving one of said contact portions ( 42 ) perpendicularly to their longitudinal direction; and mechanically connecting the respective foot portion ( 40 ) to an associated connection surface ( 30 ) in an electrically conductive manner; C) arranging a positioning device ( 5 ) with a first circumferential positioning surface for fixing the position of the connection elements; and D) fixing the connection elements ( 4 ) relative to one another and to the housing ( 2 ); wherein the housing ( 2 ) has openings ( 20 ) receiving the connection elements ( 4 ); and the connection elements ( 4 ) are fixed in position by an adhesive compound ( 6 ) filled into openings ( 20 ) in the housing ( 2 ) receiving the connection elements ( 4 ); and wherein the positioning device ( 5 ) and the connection elements ( 4 ) are fixed in position to one another and to the housing ( 2 ) in a force-fitting manner by a step of deforming the positioning device ( 5 ) at a second circumferential second positioning surface ( 58 ) arranged at respective positioning openings ( 52 ) of the positioning device ( 5 ).
  2. 2 . The method, according to claim 1 , wherein: the housing ( 2 ) is formed as a plastic housing and the connection elements ( 4 ) are pre-fixed therein formed as an integrated injection molding.
  3. 3 . The method, according to claim 1 , wherein: the respective connection element ( 4 ) is fixed in one spatial direction by at least one first positioning surface ( 56 ) of the positioning element ( 5 ) lying flush against the connection element ( 4 ) during method step C).
  4. 4 . A power semiconductor module, manufactured by the method, according to claim 1 , wherein the respective connection elements ( 4 ) each have a first connecting portion ( 44 ) arranged in the housing ( 2 ) in a form-fitting connection manner.
  5. 5 . The power semiconductor module, according to claim 4 , wherein: the form-fitting connection is formed as an injection-molded connection.
  6. 6 . The power semiconductor module, according to claim 4 wherein: the force-fitting connection is formed as a thermal deformation of a deformation portion ( 22 ) of the housing ( 2 ).

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application relates to and claims priority to DE 10 2021 134 003.9 filed Dec. 21, 2021, the entire contents of which are incorporated herein fully by reference. FIGURE SELECTED FOR PUBLICATION FIG. 3. BACKGROUND OF THE INVENTION Field of the Invention The invention describes a method for manufacturing a power semiconductor module having a housing, a switchgear arranged in this housing and having a plurality of connection elements. The invention furthermore describes such a power semiconductor module. Description of the Related Art The manufacture of plastic housings for power semiconductor modules is generally known from the prior art, wherein a plurality of connection elements are already arranged in the plastic during the manufacturing process. Such methods are disadvantageous in that the positioning of the individual connection elements with respect to one another or their absolute positioning with respect to the housing may be prone to errors or, in particular, cost-intensive. ASPECTS AND OBJECTS OF THE INVENTION With knowledge of the prior art, the invention is based on the object of presenting an alternative manufacturing method for forming a power semiconductor module, in particular a housing for this, and a power semiconductor module itself, wherein the positioning of the connection elements with respect to one another or with respect to the housing does not have to already conform to the final quality requirements during the manufacture of the housing. This object is achieved according to the invention by a method for manufacturing a power semiconductor module having a housing, a switchgear arranged in this housing and having a plurality of connection elements, having the following method steps: A) forming a housing with pre-fixed connection elements;B) arranging the switchgear in the housing and connecting the connection elements to connection surfaces of a substrate of the switchgear;C) arranging a positioning device for fixing the position of the connection elements with respect to one another;D) fixing the connection elements relative to one another and to the housing. Essentially, here and below, the term “housing” is to be understood in a broad sense and, in this regard, in particular also includes housing parts, in particular also frame-like housing parts. Likewise, the term “connection element” is also to be understood in a broad sense and in particular also includes load connection elements, such as control and auxiliary connection elements, which may be formed for example as solder or plug-type, in particular press-pin, contacts. In this case, it may be preferred if the connection elements each have a foot portion and a contact portion, wherein, in method step B), the respective foot portion is mechanically connected to an associated connection surface in an electrically conductive manner. In this case, it may be further preferred if the respective contact portions are arranged to be movable with respect to one another, in particular perpendicularly to their longitudinal direction, in one spatial direction, or preferably in two orthogonal spatial directions. It may be advantageous if the housing is formed as a plastic housing and the connection elements are pre-fixed therein using an injection moulding technique. In one alternative, it may be advantageous if the positioning device is removed after method step D). In another alternative, it may be advantageous if the positioning device is not removed after method step D) and, in particular, forms part of the housing. In this case, it may be particularly preferred if the connection elements are fixed in position by means of a circumferential second positioning surface in each case or by means of a plurality of second positioning partial-surfaces in each case, each arranged in or at the respective opening in the positioning device. Essentially, it may be preferred if the connection elements are fixed in position by means of an adhesive compound, with which openings in the housing or in the positioning device are preferably filled. Alternatively to this, it may be preferred if the connection elements are fixed in position by deformation of a deformation portion of the housing or of the positioning device. In particular, it may be advantageous if the respective connection element is fixed in one spatial direction as a result of a positioning surface or mutually opposing first positioning partial-surfaces of the positioning element lying flush against the connection element during method step C). The object is furthermore achieved by a power semiconductor module having a housing, a switchgear arranged in this housing and having a plurality of connection elements, wherein the respective connection elements have a first connecting portion, which is arranged in the housing in a form-fitting manner in each case, and a second connecting portion, which is arranged in the housing in a materially-bonded or f