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US-20260123883-A1 - PROCESS FOR MANUFACTURING WEARABLE RING FORM FACTOR

US20260123883A1US 20260123883 A1US20260123883 A1US 20260123883A1US-20260123883-A1

Abstract

Methods, systems, and devices for manufacturing a wearable device are described. A method for manufacturing a wearable device may include coupling a printed circuit board (PCB) to an inner ring-shaped housing that contains a plurality of apertures by aligning a plurality of sensors of the PCB with the plurality of apertures. The method may also include coupling an outer ring-shaped housing to the inner ring-shaped housing by surrounding the inner ring-shaped housing with the outer ring-shaped housing. Additionally, the method may include injecting a filler material through an additional aperture of the outer ring-shaped housing to fill a cavity defined by the inner ring-shaped housing and the outer ring-shaped housing, filling at least a portion of the plurality of the inner ring-shaped housing with the filler material.

Inventors

  • Teemu Juhani Haverinen
  • Mikko Latomäki
  • Jukka-Tapani Mäkinen
  • Marko Uusitalo
  • Antti Lämsä

Assignees

  • OURA HEALTH OY

Dates

Publication Date
20260507
Application Date
20251008

Claims (20)

  1. 1 . A method for manufacturing a wearable ring device, comprising: coupling a printed circuit board to a first portion of the wearable ring device, the first portion of the wearable ring device comprising at least one aperture, wherein coupling the printed circuit board to the first portion of the wearable ring device comprises aligning at least one sensor of the printed circuit board with the at least one aperture; coupling a second portion of the wearable ring device to the first portion of the wearable ring device by at least partially surrounding the first portion of the wearable ring device with the second portion of the wearable ring device; and injecting a filler material through one or more apertures of the at least one aperture of the first portion of the wearable ring device to fill a cavity, defined at least in part by the first portion of the wearable ring device and the second portion of the wearable ring device, with the filler material.
  2. 2 . The method of claim 1 , further comprising: filling an entirety of the at least one aperture with the filler material so that the filler material within the at least one aperture is flush with an inner surface of the first portion of the wearable ring device.
  3. 3 . The method of claim 1 , further comprising: filling the at least one aperture with the filler material so that the filler material extends beyond an inner surface of the first portion of the wearable ring device; and polishing the inner surface of the first portion of the wearable ring device so that the filler material is flush with the inner surface of the first portion of the wearable ring device, an outer surface of the second portion of the wearable ring device, or both.
  4. 4 . The method of claim 1 , further comprising: placing the wearable ring device within a mold based at least in part on coupling the second portion of the wearable ring device to the first portion of the wearable ring device, wherein the filler material is injected based at least in part on placing the wearable ring device within the mold.
  5. 5 . The method of claim 1 , wherein coupling the printed circuit board to the first portion of the wearable ring device comprises: engaging a first set of locating components of the first portion of the wearable ring device with a second set of locating components of the printed circuit board to maintain the printed circuit board in a radial orientation of a plurality of radial orientations relative to the first portion of the wearable ring device, wherein aligning the at least one sensor of the printed circuit board with the at least one aperture is based at least in part on the engaging.
  6. 6 . The method of claim 5 , wherein coupling the printed circuit board to the first portion of the wearable ring device comprises: sliding the printed circuit board within a groove of the first portion of the wearable ring device, wherein engaging the first set of locating components of the first portion of the wearable ring device with the second set of locating components of the printed circuit board is based at least in part on the sliding.
  7. 7 . The method of claim 5 , wherein the first set of locating components comprise one or more protrusions and wherein the second set of locating components comprise one or more grooves or detents, or wherein the first set of locating components comprise the one or more grooves or detents and wherein the second set of locating components comprise the one or more protrusions.
  8. 8 . The method of claim 1 , wherein the first portion of the wearable ring device is coupled to the second portion of the wearable ring device with a sealing material, wherein the sealing material comprises an adhesive, a welding material, a compression fit component, or any combination thereof.
  9. 9 . The method of claim 1 , wherein the first portion of the wearable ring device is coupled to the second portion of the wearable ring device based at least in part on the filler material.
  10. 10 . The method of claim 1 , wherein the filler material comprises a transparent epoxy material that enables transmission of light through the at least one aperture.
  11. 11 . The method of claim 1 , wherein the first portion of the wearable ring device comprises a first metallic material, and wherein the second portion of the wearable ring device comprises a second metallic material.
  12. 12 . The method of claim 11 , wherein the first metallic material of the first portion of the wearable ring device is the same as the second metallic material of the second portion of the wearable ring device.
  13. 13 . The method of claim 11 , wherein the first metallic material of the first portion of the wearable ring device is different from the second metallic material of the second portion of the wearable ring device.
  14. 14 . The method of claim 1 , wherein the printed circuit board comprises a flexible printed circuit board.
  15. 15 . The method of claim 1 , wherein the first portion of the wearable ring device is welded to the second portion of the wearable ring device.
  16. 16 . A wearable ring device comprising: a first portion of the wearable ring device of the wearable ring device comprising at least one aperture; a printed circuit board coupled to the first portion of the wearable ring device such that at least one sensor of the printed circuit board is aligned with the at least one aperture of the first portion of the wearable ring device; a second portion of the wearable ring device coupled to the first portion of the wearable ring device, wherein the second portion of the wearable ring device at least partially surrounds the first portion of the wearable ring device; and a filler material injected through one or more apertures of the at least one aperture of the first portion of the wearable ring device, such that the filler material at least partially fills a cavity defined at least in part by the first portion of the wearable ring device and the second portion of the wearable ring device.
  17. 17 . The wearable ring device of claim 16 , wherein the first portion of the wearable ring device comprises a first set of locating components, wherein the printed circuit board comprises a second set of locating components, and wherein the printed circuit board is coupled to the first portion of the wearable ring device based at least in part on the first set of locating components engaging with the second set of locating components.
  18. 18 . The wearable ring device of claim 17 , wherein the first set of locating components comprise one or more protrusions and wherein the second set of locating components comprise one or more grooves or detents, or wherein the first set of locating components comprise the one or more grooves or detents and wherein the second set of locating components comprise the one or more protrusions.
  19. 19 . The wearable ring device of claim 16 , wherein the filler material comprises a transparent epoxy material that enables transmission of light through the at least one aperture.
  20. 20 . The wearable ring device of claim 16 , wherein the first portion of the wearable ring device comprises a first metallic material, and wherein the second portion of the wearable ring device comprises a second metallic material.

Description

CROSS REFERENCE The present Application for Patent is a continuation of U.S. patent application Ser. No. 17/903,545 by Haverinen et al., entitled “PROCESS FOR MANUFACTURING WEARABLE RING FORM FACTOR,” filed Sep. 6, 2022, which is assigned to the assignee hereof, and is expressly incorporated by reference herein. FIELD OF TECHNOLOGY The following relates to wearable devices and data processing, including a process for manufacturing a wearable ring form factor. BACKGROUND Some wearable devices may be configured to collect data from users including temperature data, heart rate data, and the like. In some cases, the overall structure of the wearable device may affect the accuracy of data measurements performed by the wearable device. Additionally, wearable devices may be intended to be worn full-time, and may therefore be subject to constant wear and tear. As such, there is a desire to improve the durability of wearable devices, while also enabling the wearable devices to be manufactured in an efficient and cost-effective manner. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 illustrates an example of a system that supports a process for manufacturing wearable ring form factor in accordance with aspects of the present disclosure. FIG. 2 illustrates an example of a system that supports the process for manufacturing wearable ring form factor in accordance with aspects of the present disclosure. FIG. 3A illustrates an example of a ring wearable system that supports the process for manufacturing a wearable ring form factor in accordance with aspects of the present disclosure. FIG. 3B illustrates an example of a ring wearable system that supports the process for manufacturing a wearable ring form factor in accordance with aspects of the present disclosure. FIG. 4 illustrates an example of a ring wearable assembly that supports the process for manufacturing a wearable ring form factor in accordance with aspects of the present disclosure. FIGS. 5A and 5B illustrate examples of ring wearable cross sections that support the process for manufacturing a wearable ring form factor in accordance with aspects of the present disclosure. FIGS. 6A and 6B illustrate examples of inner aperture injection systems that support the process for manufacturing a wearable ring form factor in accordance with aspects of the present disclosure. FIGS. 7 through 9 show flowcharts illustrating methods that support processes for manufacturing a wearable ring form factor in accordance with aspects of the present disclosure. DETAILED DESCRIPTION Some wearable devices may be configured to collect data from users associated with movement and other activities. For example, some wearable devices may be configured to continuously acquire physiological data associated with a user including temperature data, heart rate data, and the like. As such, some wearable devices may be configured to house one or more sensors configured to acquire physiological data from a user. In some cases, a wearable device may collect physiological data associated with a user based on skin contact at an optical interface between sensors of the wearable device and the user's skin. In such cases, the structure of a wearable device may affect the ability of the wearable device to efficiently and accurately acquire physiological data. For example, the structure of some wearable devices may cause a loss of skin contact at the optical interface of the wearable device during the user's movement. In some examples, separate protruding domes of a wearable ring device may cause gaps between optical components of the wearable ring device and the skin of the user's finger. Such protruding domes may displace veins and arteries within the user's finger as the wearable ring device moves, causing disturbances in the signal used to collect physiological data. Because the quality of the physiological data readings is dependent on the skin contact at the optical interface of the wearable device, poor fit of the wearable device may detrimentally affect the ability of the wearable device to efficiently and accurately acquire physiological data by increasing an amount of noise in the signal. These issues with wearable devices may result in a distorted picture of the user's overall health, as well as increased power consumption and decreased user experience. Additionally, wearable devices may be intended to be worn full-time, and may therefore be subject to constant wear and tear. As such, there is a desire to manufacture wearable devices to be durable, while also maintaining the aesthetic appeal of the wearable devices. Moreover, some wearable devices may lack individuality such that the wearable devices may include a similar design and aesthetic that lacks personalization from one wearable device to another. As such, there is a need for a manufacturing process that may be used to manufacture durable, aesthetically pleasing, and customizable wearable devices (e.g., wearable ring devices) in a cost-efficie