US-20260124691-A1 - LASER COMPRESSION BONDING DEVICE

US20260124691A1US 20260124691 A1US20260124691 A1US 20260124691A1US-20260124691-A1

Abstract

A laser compression bonding device comprises: a carrier for placing a substrate; a transparent compression head for holding and displacing an electronic component, wherein the transparent compression head comprises a central portion for pressing the electronic component against the substrate via a solder material when the electronic component is placed on the substrate via the solder material, and a peripheral portion surrounding the central portion; a laser source for emitting a laser beam towards the carrier at least through the central portion of the transparent compression head to heat the solder material such that the electronic component is bonded onto the substrate via the solder material; and a heat spreader attached to the peripheral portion of the transparent compression head, wherein the heat spreader comprises a liquid channel for containing liquid that flows in the liquid channel to exchange heat with the transparent compression head.

Inventors

Jongchan Park
HyungSuk MIN

Assignees

STATS ChipPAC Management Pte. Ltd.

Dates

Publication Date: 20260507
Application Date: 20251102
Priority Date: 20241101

Claims (13)

1 . A laser compression bonding device, comprising: a carrier for placing a substrate; a transparent compression head for holding and displacing an electronic component, wherein the transparent compression head comprises a central portion for pressing the electronic component against the substrate via a solder material when the electronic component is placed on the substrate via the solder material, and a peripheral portion surrounding the central portion; a laser source for emitting a laser beam towards the carrier at least through the central portion of the transparent compression head to heat the solder material such that the electronic component is bonded onto the substrate via the solder material; and a heat spreader attached to the peripheral portion of the transparent compression head, wherein the heat spreader comprises a liquid channel for containing liquid that flows in the liquid channel to exchange heat with the transparent compression head.
2 . The laser compression bonding device of claim 1 , wherein the heat spreader is surrounding the central portion of the transparent compression head.
3 . The laser compression bonding device of claim 1 , wherein the liquid is a cooling liquid for cooling the transparent compression head.
4 . The laser compression bonding device of claim 1 , wherein the liquid comprises a cooling liquid for cooling the transparent compression head or a heating liquid for heating the transparent compression head.
5 . The laser compression bonding device of claim 1 , further comprising: a liquid supply that is fluidly coupled to the liquid channel to supply liquid into the liquid channel and draw liquid from the liquid channel after heat exchange between the liquid in the liquid channel and the transparent compression head.
6 . The laser compression bonding device of claim 1 , wherein the transparent compression head comprises a front surface facing towards the laser source and a back surface opposite to the front surface, and wherein the heat spreader is attached on the front surface or the back surface of the transparent compression head.
7 . The laser compression bonding device of claim 1 , wherein the transparent compression head comprises a front surface facing towards the laser source and a back surface opposite to the front surface, and wherein the heat spreader is attached on the front surface and the back surface of the transparent compression head.
8 . The laser compression bonding device of claim 1 , wherein the heat spreader is formed of a non-transparent material.
9 . The laser compression bonding device of claim 8 , wherein the heat spreader is arranged such that the laser beam is blocked by the heat spreader from irradiating onto a peripheral region of the substrate without the solder material.
10 . The laser compression bonding device of claim 1 , wherein the heat spreader is formed of a transparent material.
11 . The laser compression bonding device of claim 1 , wherein the transparent compression head further comprises at least one through hole passing through its central portion to apply a vacuum pressure to the electronic component to hold the electronic component.
12 . The laser compression bonding device of claim 1 , wherein the transparent compression head further comprises an airflow channel attached to an outside edge of the transparent compression head, and wherein the airflow channel is configured to contain a cooling airflow for cooling the transparent compression head.
13 . A laser compression bonding method, comprising: placing a substrate on a carrier; placing by a transparent compression head an electronic component on the substrate via a solder material; pressing the electronic component against the substrate by the transparent compression head and irradiating to the carrier a laser beam from a laser source through the central portion of the transparent compression head to bond the electronic component onto the substrate via the solder material; and injecting a liquid into a heat spreader attached to a peripheral portion of the transparent compression head to cool the transparent compression head, wherein the peripheral portion is surrounding the central portion and the heat spreader comprises a liquid channel; drawing the liquid from the liquid channel after heat exchange between the liquid and the transparent compression head.

Description

TECHNICAL FIELD The present application generally relates to semiconductor technology, and more particularly, to a laser compression bonding device and a method for using the same. BACKGROUND OF THE INVENTION Laser compression bonding (LCB) or soldering processes have been used to replace conventional massive reflowing processes in forming semiconductor packages, because during the laser compression soldering process thermal stresses within the semiconductor packages can be reduced. However, LCB tools are generally made of transparent materials such as bulk quartz or the like, which have low thermal conductivities. Heat may accumulate in the LCB tool during the bonding processes and may undesirably increase a temperature of the LCB tool. Therefore, a need exists for a new laser compression bonding device. SUMMARY OF THE INVENTION An objective of the present application is to provide a laser compression bonding device with an improved heat dissipation performance. According to an aspect of the present application, a laser compression bonding device is provided. The laser compression bonding device comprises: a carrier for placing a substrate; a transparent compression head for holding and displacing an electronic component, wherein the transparent compression head comprises a central portion for pressing the electronic component against the substrate via a solder material when the electronic component is placed on the substrate via the solder material, and a peripheral portion surrounding the central portion; a laser source for emitting a laser beam towards the carrier at least through the central portion of the transparent compression head to heat the solder material such that the electronic component is bonded onto the substrate via the solder material; and a heat spreader attached to the peripheral portion of the transparent compression head, wherein the heat spreader comprises a liquid channel for containing liquid that flows in the liquid channel to exchange heat with the transparent compression head. According to another aspect of the present application, a laser compression bonding method is provided. The method comprises: placing a substrate on a carrier; placing by a transparent compression head an electronic component on the substrate via a solder material; pressing the electronic component against the substrate by the transparent compression head and irradiating to the carrier a laser beam from a laser source through the central portion of the transparent compression head to bond the electronic component onto the substrate via the solder material; and injecting a liquid into a heat spreader attached to a peripheral portion of the transparent compression head to cool the transparent compression head, wherein the peripheral portion is surrounding the central portion and the heat spreader comprises a liquid channel; drawing the liquid from the liquid channel after heat exchange between the liquid and the transparent compression head. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only, and are not restrictive of the invention. Further, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention. BRIEF DESCRIPTION OF DRAWINGS The drawings referenced herein form a part of the specification. Features shown in the drawing illustrate only some embodiments of the application, and not of all embodiments of the application, unless the detailed description explicitly indicates otherwise, and readers of the specification should not make implications to the contrary. FIG. 1 illustrates changes in temperature of an LCB tool and an electronic component held by the LCB tool under different conditions. FIGS. 2a and 2b illustrate a laser compression bonding device according to an embodiment of the present application. FIGS. 3a to 3c illustrate a laser compression bonding method according to an embodiment of the present application. The same reference numbers will be used throughout the drawings to refer to the same or like parts. DETAILED DESCRIPTION OF THE INVENTION The following detailed description of exemplary embodiments of the application refers to the accompanying drawings that form a part of the description. The drawings illustrate specific exemplary embodiments in which the application may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice the application. Those skilled in the art may further utilize other embodiments of the application, and make logical, mechanical, and other changes without departing from the spirit or scope of the application. Readers of the following detailed description should, therefore, not interpret the description in a limiting