US-20260124789-A1 - Silicon Rod Cutting System

US20260124789A1US 20260124789 A1US20260124789 A1US 20260124789A1US-20260124789-A1

Abstract

A silicon rod cutting system, including: a machine base ( 1 ), wherein the machine base has at least two cutting stations, which are disposed at intervals; at least two cutting devices ( 4 ), which are fixed on the machine base, wherein the cutting devices are in one-to-one correspondence with the cutting stations, and the cutting devices are configured to cut a silicon rods on the cutting stations; a loading and unloading device ( 2 ), which is fixed with the machine base, wherein the loading and unloading device is configured to load a round silicon rod and unloading a square rod formed by cutting; and a transfer device ( 3 ), which is disposed on the machine base and is disposed between the cutting stations, wherein the transfer device is configured transfer, to the cutting station, the silicon rod loaded by the loading and unloading device, and transfer the square rod formed on the cutting stations to the loading and unloading device. The at least two cutting stations of the silicon rod cutting system share one loading and unloading device and one transfer device, so that the components of the silicon rod cutting system are fewer, and the occupied space is relatively small.

Inventors

Kecun LIU
Peng Sun
Changkun FAN
Faquan HAN
Cong Zhou
Xinhui Dai
Shengen HOU
Peilin Song

Assignees

QINGDAO GAOCE TECHNOLOGY CO., LTD

Dates

Publication Date: 20260507
Application Date: 20221026
Priority Date: 20211101

Claims (20)

1 . A silicon rod cutting system, comprising: a machine base, wherein the machine base has at least two cutting stations, which are disposed at intervals; at least two cutting devices, which are fixed on the machine base, wherein the at least two cutting devices and the at least two cutting stations are disposed in a one-to-one corresponding manner, and each of the at least two cutting devices is configured to cut a silicon rod on a corresponding cutting station of the at least two cutting stations; a loading and unloading device, which is fixed with the machine base, wherein the loading and unloading device is configured to load a round silicon rod and unload a square rod formed by cutting the round silicon rod; and a transfer device, which is disposed on the machine base and is disposed between the at least two cutting stations, wherein the transfer device is configured to transfer, to the at least two cutting station, the round silicon rod loaded by the loading and unloading device, and transfer, to the loading and unloading device, the square rod formed by cutting on the at least two cutting station.
2 . The silicon rod cutting system as claimed in claim 1 , wherein each of the at least two cutting devices comprises: a cutting handpiece mechanism, wherein the cutting handpiece mechanism is provided with a diamond wire and a handpiece through hole, and a cutting segment of the diamond wire and the handpiece through hole do not interfere with each other; wherein the handpiece through hole is configured to take out a flaw-piece formed by cutting the silicon rod, and the cutting segment is a part of the diamond wire configured to cut the silicon rod in motion; wherein each of the at least two cutting devices comprises two cutting handpiece mechanisms; and the cutting segments of the two cutting handpiece mechanisms of each of the at least two cutting devices are disposed opposite to each other.
3 . (canceled)
4 . The silicon rod cutting system as claimed in claim 2 , wherein the cutting handpiece mechanism comprises a wire saw assembly, and the wire saw assembly comprises: a wire saw mounting rack, wherein the wire saw mounting rack is provided with the handpiece through hole which extending vertically; and the diamond wire, which is disposed on a front side of the wire saw mounting rack; wherein the cutting segment is lower than the handpiece through hole, and a side of the wire saw mounting rack where the diamond wire is disposed is the front side of the wire saw mounting rack; the silicon rod cutting system further comprises a flaw-piece clamping mechanism, which is configured to pass through the handpiece through hole and enter a space between the two cutting handpiece mechanisms to clamp the flaw-piece, and exit from the handpiece through hole to take out the flaw-piece from the space between the two cutting handpiece mechanisms.
5 . (canceled)
6 . The silicon rod cutting system as claimed in claim 4 , wherein the flaw-piece clamping mechanism comprises a flaw-piece clamping frame, and the flaw-piece clamping frame comprises: a flaw-piece clamping jaw mounting column; a top clamping jaw and a bottom clamping jaw, which are disposed on a front side of the flaw-piece clamping jaw mounting column and are opposite to each other along a vertical direction, wherein at least one of the top clamping jaw and the bottom clamping jaw is slidably connected with the flaw-piece clamping jaw mounting column, and is configured to move up and down in the vertical direction, and a side of the flaw-piece clamping jaw mounting column where the top clamping jaw and the bottom clamping jaw are disposed is the front side of the flaw-piece clamping jaw mounting column; wherein the bottom clamping jaw is fixed on a bottom end of the flaw-piece clamping jaw mounting column; and the top clamping jaw is slidably connected with the flaw-piece clamping jaw mounting column, and the top clamping jaw is configured to move up and down in the vertical direction.
7 . (canceled)
8 . The silicon rod cutting system as claimed in claim 6 , wherein the flaw-piece clamping frame further comprises: a flaw-piece clamping jaw back plate which disposed vertically; a flaw-piece clamping jaw slide plate, wherein the flaw-piece clamping jaw slide plate is disposed on one plate surface of the flaw-piece clamping jaw back plate and is slidably connected with the flaw-piece clamping jaw back plate, the flaw-piece clamping jaw slide plate is configured to move in a horizontal direction along the flaw-piece clamping jaw back plate, and a motion direction of the flaw-piece clamping jaw slide plate is consistent with an X direction of the silicon rod cutting system where a flaw-piece unloading device is disposed; and a flaw-piece clamping jaw mounting column fixing plate, wherein two opposite end sides of the flaw-piece clamping jaw mounting column fixing plate are respectively fixed with the flaw-piece clamping jaw slide plate and the flaw-piece clamping jaw mounting column.
9 . The silicon rod cutting system as claimed in claim 8 , wherein two flaw-piece clamping jaw mounting columns are provided, and the top clamping jaw and the bottom clamping jaw are disposed on the front side of each flaw-piece clamping jaw mounting column; two flaw-piece clamping jaw mounting column fixing plates are provided for respectively fixing the two flaw-piece clamping jaw mounting columns in a one-to-one corresponding manner; two flaw-piece clamping jaw slide plates are provided to be respectively fixed with the two flaw-piece clamping jaw mounting column fixing plates in a one-to-one corresponding manner, wherein front sides of the two flaw-piece clamping jaw mounting columns are disposed opposite to each other.
10 . The silicon rod cutting system as claimed in claim 9 , wherein the flaw-piece clamping mechanism further comprises: a top clamping jaw Z-direction guide rail, wherein each of the two flaw-piece clamping jaw mounting columns is provided with two top clamping jaw Z-direction guide rails disposed in parallel, and a guide direction of the top clamping jaw Z-direction guide rail is the vertical direction and is consistent with a Z direction of the silicon rod cutting system; a top clamping jaw Z-direction slide block, which is disposed on a back side of the top clamping jaw; and a top clamping jaw Z-direction motion gas cylinder, which is fixed at the flaw-piece clamping jaw mounting column, wherein a piston rod of the top clamping jaw Z-direction motion gas cylinder is fixed with the back side of the top clamping jaw; and the top clamping jaw Z-direction motion gas cylinder is configured to push the top clamping jaw to move up and down in the vertical direction; wherein the flaw-piece clamping mechanism further comprises: a clamping jaw X-direction guide rail, wherein a plate surface of the flaw-piece clamping jaw back plate that is close to the flaw-piece clamping jaw slide plate is provided with two clamping jaw X-direction guide rails disposed in parallel, and a guide direction of the clamping jaw X-direction guide rail is consistent with a X direction of the silicon rod cutting system; a clamping jaw X-direction slide block, which is disposed on a plate surface of the flaw-piece clamping jaw slide plate that is close to the flaw-piece clamping jaw back plate; and a clamping jaw X-direction motion gas cylinder, which is fixed at the flaw-piece clamping jaw back plate, wherein a piston rod of the clamping jaw X-direction motion gas cylinder is fixed with the flaw-piece clamping jaw slide plate; and the clamping jaw X-direction motion gas cylinder is configured to push the flaw-piece clamping jaw slide plate to move along the clamping jaw X-direction guide rail, and a top clamping jaw and a bottom clamping jaw, which are disposed on one flaw-piece clamping jaw mounting column fixing plate, are configured to get close to or away from a top clamping jaw and a bottom clamping jaw, which is disposed on an other flaw-piece clamping jaw mounting column fixing plate.
11 . (canceled)
12 . The silicon rod cutting system as claimed in claim 10 , wherein the flaw-piece clamping mechanism further comprises: a clamping frame motion assembly, which is fixed with the flaw-piece clamping jaw back plate and is disposed on the machine base of the silicon rod cutting system, wherein a Y direction of the silicon rod cutting system is perpendicular to the X direction and the Z direction of the silicon rod cutting system; and the clamping frame motion assembly is configured to drive the clamping frame to linearly reciprocate in three directions of the silicon rod cutting system, that is, the X direction, the Y direction and the Z direction.
13 . The silicon rod cutting system as claimed in claim 12 , wherein the clamping frame motion assembly comprises: a clamping frame X-direction guide rail, which is fixed on an upper surface of the machine base of the silicon rod cutting system, wherein a guide direction of the clamping frame X-direction guide rail is consistent with the X direction of the silicon rod cutting system; a clamping frame X-direction mounting base; and a clamping frame X-direction motion slide block, which is fixed on an outer bottom of the clamping frame X-direction mounting base, wherein the clamping frame X-direction motion slide block cooperates with the clamping frame X-direction guide rail; wherein the clamping frame motion assembly further comprises: a clamping frame Y-direction mounting base; and a clamping frame Y-direction gear rack and a clamping frame Y-direction gear, which are engaged with each other, wherein the clamping frame Y-direction gear rack is fixed on an upper surface of the clamping frame X-direction mounting base; and a guide direction of the clamping frame Y-direction gear rack is consistent with the Y direction of the silicon rod cutting system, and the clamping frame Y-direction gear is fixed on an outer bottom of the clamping frame Y-direction mounting base; wherein the clamping frame motion assembly further comprises: a clamping frame Z-direction mounting base; and a clamping frame Z-direction guide rail lead screw, wherein a nut of the clamping frame Z-direction guide rail lead screw is fixed on an upper surface of the clamping frame Y-direction mounting base; a guide direction of a guide rail of the clamping frame Z-direction guide rail lead screw is the vertical direction and is consistent with the Z direction of the silicon rod cutting system, and a slide block of the clamping frame Z-direction guide rail lead screw is fixed at the flaw-piece clamping jaw back plate; wherein the clamping frame Z-direction guide rail lead screw is configured to convert a received rotary motion into a linear motion along the guide rail of the clamping frame Z-direction guide rail lead screw, and outputting the linear motion by means of the slide block of the clamping frame Z-direction guide rail lead screw.
14 . (canceled)
15 . (canceled)
16 . The silicon rod cutting system as claimed in claim 4 , wherein the cutting device further comprises a silicon rod chuck mechanism, and the silicon rod chuck mechanism comprises: a chuck rack; an upper floating head, which is disposed at the chuck rack, wherein the chuck rack is configured to move up and down, and the upper floating head is configured to press an upper end face of a silicon rod arranged vertically; and a flaw-piece support frame, which is connected with the chuck rack and is configured to extend out downwards and reset upwards, wherein the flaw-piece support frame is configured to extend out downwards and supported on an outer peripheral surface of the silicon rod, and the flaw-piece support frame is configured to reset upwards to leave the outer peripheral surface of the silicon rod; wherein the flaw-piece support frame comprises: a flaw-piece support frame mounting member, which is fixed with the chuck rack; a handrail fixing member and a flaw-piece handrail, wherein the flaw-piece handrail is fixed on one side of the handrail fixing member that is away from the upper floating head and extends out downwards; and a flaw-piece support driving device, which is connected with the flaw-piece support frame mounting member and the handrail fixing member, and is configured to drive the handrail fixing member and the flaw-piece handrail to extend out downwards and reset upwards.
17 . (canceled)
18 . The silicon rod cutting system as claimed in claim 16 , wherein the flaw-piece support driving device is a flaw-piece support driving gas cylinder; and a cylinder body of the flaw-piece support driving gas cylinder is fixed with the flaw-piece support frame mounting member, the guide rod of the flaw-piece support driving gas cylinder is fixed with the handrail fixing member, and the guide rod of the flaw-piece support driving gas cylinder stretches out and draws back to drive the handrail fixing member and the flaw-piece handrail to extend out downwards and reset upwards; or wherein the silicon rod chuck mechanism further comprises: a chuck rack vertical-motion assembly, which is disposed between the two cutting handpiece mechanisms, wherein the chuck rack is connected with the chuck rack vertical-motion assembly, the chuck rack vertical-motion assembly is configured to drive the chuck rack to move up and down in the vertical direction, and drive the upper floating head to press on the upper end face of the silicon rod disposed vertically and to leave the upper end face of the cut silicon rod.
19 . (canceled)
20 . (canceled)

Description

TECHNICAL FIELD The present disclosure relates to the technical field of silicon rod cutting, and in particular to a silicon rod cutting system. BACKGROUND At present, with the emphasis and openness of the society for the utilization of green and renewable energy sources, the field of photovoltaic solar power generation is getting more and more attention and development. In the field of photovoltaic power generation, a common crystalline silicon solar cell is fabricated on a high-quality silicon wafer, and this silicon wafer is cut from a pulled or cast silicon rod by a wire saw, that is, a wire cutting technology. The wire cutting technology is a relatively advanced squaring processing technology in the world at present, and the principle thereof is to rub a workpiece to be machined (such as a silicon rod, a sapphire, or other semiconductor hard and brittle materials) by means of a diamond wire moving at a high speed, so as to cut a square rod, thereby achieving the purpose of cutting. Compared with traditional knife saw blades, grinding wheel blades and inner circle cutting, the wire cutting technology has the advantages of high efficiency, high productivity, high precision, etc. SUMMARY Technical Problem An existing silicon rod cutting system cannot meet the requirements of the photovoltaic industry for silicon wafers. Solution to Problem Technical Solution An embodiment of the present disclosure provides a silicon rod cutting system of a new structure. The embodiment of the present disclosure provides a silicon rod cutting system, including: a machine base, wherein the machine base has at least two cutting stations, which are disposed at intervals;at least two cutting devices, which are fixed on the machine base, wherein the at least two cutting devices and the at least two cutting stations are disposed in a one-to-one correspondence manner, and the at least two cutting devices are configured to cut silicon rods on the cutting stations;a loading and unloading device, which is fixed with the machine base, wherein the loading and unloading device is configured to load a round silicon rod and unload a square rod formed by cutting; anda transfer device, which is disposed on the machine base and is disposed between the cutting stations, wherein the transfer device is configured to transfer, to the at least two cutting station, the silicon rod loaded by the loading and unloading device, and transfer, to the loading and unloading device, the square rod formed by cutting on the at least two cutting station. BENEFICIAL EFFECTS OF THE INVENTION Beneficial Effects Some embodiments of the present disclosure has the following technical effects due to the utilization of the above technical solutions: In the silicon rod cutting system, the at least two cutting stations share one loading and unloading device and one transfer device, so that the components of the silicon rod cutting system are fewer, and the occupied space is also relatively small. BRIEF DESCRIPTION OF THE DRAWINGS Description of the Drawings FIG. 1 illustrates a schematic diagram of a cutting process of a silicon rod cutting system according to an embodiment of the present disclosure; FIG. 1A illustrates a schematic diagram of the silicon rod cutting system according to an embodiment of the present disclosure; FIG. 1B and FIG. 1C illustrate schematic diagrams of transferring a round silicon rod from a loading and unloading device to a cutting device by a transfer device of the silicon rod cutting system shown in FIG. 1A; FIG. 2A illustrates a schematic diagram of the loading and unloading device of the silicon rod cutting system according to an embodiment of the present disclosure; FIG. 2B illustrates a schematic diagram of another angle of FIG. 2A; FIG. 2C illustrates a partial enlarged view of FIG. 2B; FIG. 3A, FIG. 3B and FIG. 3C illustrate schematic diagrams of the transfer device of the silicon rod cutting system according to an embodiment of the present disclosure; FIG. 3D and FIG. 3E illustrate schematic diagrams of an upper clamping jaw assembly and a lower clamping jaw assembly of the transfer device of FIG. 3A; FIG. 3F illustrates a schematic diagram of a crystal line endpoint of four crystal lines of a silicon rod on an end face of the silicon rod; FIG. 4A illustrates a schematic diagram of a cutting handpiece mechanism of the cutting device of the silicon rod cutting system according to an embodiment of the present disclosure; FIG. 4B illustrates a schematic diagram of cutting a silicon rod from top to bottom by two cutting handpiece mechanisms of the same cutting device of the silicon rod cutting system according to an embodiment of the present disclosure; FIG. 4C and FIG. 4D illustrate schematic diagrams of removing, from a handpiece through hole, two flaw-pieces formed by one-time cutting in FIG. 4B; FIG. 4E illustrates a schematic diagram of a tension wheel assembly of the cutting handpiece mechanism shown in FIG. 4A; FIG. 4F illustrate