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US-20260124821-A1 - COMPOSITE COPPER FOIL AND MANUFACTURING METHOD THEREOF

US20260124821A1US 20260124821 A1US20260124821 A1US 20260124821A1US-20260124821-A1

Abstract

Provided is a composite copper foil including a first copper foil, a second copper foil, and an insulating bonding layer. The insulating bonding layer is disposed between the first copper foil and the second copper foil. A thickness of the insulating bonding layer is less than 5 micrometers.

Inventors

  • Ching-Yao Yuan
  • Wei-Sheng CHENG
  • Wen Ta Cheng
  • Chung Ni Wu

Assignees

  • NAN YA PLASTICS CORPORATION

Dates

Publication Date
20260507
Application Date
20241203
Priority Date
20241105

Claims (19)

  1. 1 . A manufacturing method of a composite copper foil, comprising: providing a first copper foil and a second copper foil with separate structures; forming an insulating bonding material between the first copper foil and the second copper foil; and forming the insulating bonding material into an insulating bonding layer, so that the first copper foil and the second copper foil are bonded through the insulating bonding layer.
  2. 2 . The manufacturing method of the composite copper foil as claimed in claim 1 , further comprising: providing a first carrier having a first peelable layer thereon, wherein the first copper foil is formed on the first peelable layer; and providing a second carrier having a second peelable layer thereon, wherein the second copper foil is formed on the second peelable layer.
  3. 3 . The manufacturing method of the composite copper foil as claimed in claim 2 , further comprising: forming the insulating bonding material on at least one of the first copper foil or the second copper foil; and making the first copper foil face to face with the second copper foil, and making the insulating bonding material disposed between the first copper foil and the second copper foil.
  4. 4 . The manufacturing method of the composite copper foil as claimed in claim 2 , wherein the first peelable layer and the second peelable layer are inorganic materials; and the insulating bonding material is an organic material.
  5. 5 . The manufacturing method of the composite copper foil as claimed in claim 2 , wherein a thickness of the first carrier is 5 times to 30 times of a thickness of the first copper foil.
  6. 6 . The manufacturing method of the composite copper foil as claimed in claim 2 , wherein a thickness of the second carrier is 5 times to 30 times of a thickness of the second copper foil.
  7. 7 . The manufacturing method of the composite copper foil as claimed in claim 2 , wherein a thickness of the second carrier is 5 times to 30 times of a thickness of the first copper foil.
  8. 8 . The manufacturing method of the composite copper foil as claimed in claim 2 , wherein a thickness of the first carrier is 5 times to 30 times of a thickness of the second copper foil.
  9. 9 . The manufacturing method of the composite copper foil as claimed in claim 2 , wherein a thickness of the first carrier is 5 times to 30 times of a thickness of the first copper foil; a thickness of the second carrier is 5 times to 30 times of a thickness of the second copper foil; the thickness of the second carrier is 5 times to 30 times of the thickness of the first copper foil; and the thickness of the first carrier is 5 times to 30 times of the thickness of the second copper foil.
  10. 10 . The manufacturing method of the composite copper foil as claimed in claim 2 , wherein a thickness of the first copper foil is 15 times to 50 times of a thickness of the first peelable layer.
  11. 11 . The manufacturing method of the composite copper foil as claimed in claim 2 , wherein a thickness of the second copper foil is 15 times to 50 times of a thickness of the second peelable layer.
  12. 12 . The manufacturing method of the composite copper foil as claimed in claim 2 , wherein a thickness of the second copper foil is 15 times to 50 times of a thickness of the first peelable layer.
  13. 13 . The manufacturing method of the composite copper foil as claimed in claim 2 , wherein a thickness of the first copper foil is 15 times to 50 times of a thickness of the second peelable layer.
  14. 14 . The manufacturing method of the composite copper foil as claimed in claim 2 , wherein a thickness of the first copper foil is 15 times to 50 times of a thickness of the first peelable layer; a thickness of the second copper foil is 15 times to 50 times of a thickness of the second peelable layer; the thickness of the second copper foil is 15 times to 50 times of the thickness of the first peelable layer; and the thickness of the first copper foil is 15 times to 50 times of the thickness of the second peelable layer.
  15. 15 . The manufacturing method of the composite copper foil as claimed in claim 1 , further comprising: curing the insulating bonding material after the insulating bonding material is in contact with the first copper foil and the second copper foil, so as to form the insulating bonding layer.
  16. 16 . The manufacturing method of the composite copper foil as claimed in claim 1 , wherein a thickness of the insulating bonding layer is thinner than a thickness of the insulating bonding material.
  17. 17 . The manufacturing method of the composite copper foil as claimed in claim 1 , wherein a thickness of the insulating bonding layer is less than 5 micrometers.
  18. 18 . A composite copper foil, comprising: a first copper foil; a second copper foil; and an insulating bonding layer disposed between the first copper foil and the second copper foil, wherein a thickness of the insulating bonding layer is less than 5 micrometers.
  19. 19 . The composite copper foil as claimed in claim 18 is formed by the first copper foil, the second copper foil, and the insulating bonding layer.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims the priority benefit of Taiwan application serial no. 113142314, filed on Nov. 5, 2024. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification. BACKGROUND Technical Field The disclosure relates to a metal foil and a manufacturing method thereof, and particularly relates to a composite copper foil and a manufacturing method thereof. Description of Related Art The conventional manufacturing method of composite copper foil involves first providing a polymer film (such as a polyester (PET) film or a polyimide (PI) film). Then, a first conductive film (commonly referred to as a conductive seed layer) is formed on both sides of the polymer film by sputtering. Afterward, the first conductive film is thickened through electroplating to form a second conductive film (commonly referred to as an electroplated layer). The composite copper foil formed by the method is usually limited by the thickness of the polymer film and the corresponding formation method of the conductive film, making it difficult to effectively reduce the overall thickness (for example, at least 6 micrometers). In addition, if a thinner polymer film is directly used for double-sided plating, it may not be able to effectively insulate due to penetration caused by plated atoms, plated particles, and/or plasma during the plating (such as sputtering or similar plasma deposition plating) process. Therefore, how to make composite copper foil with thinner thickness and still have good quality is a research topic. SUMMARY The disclosure provides a composite copper foil and a manufacturing method thereof. The structure and/or the manufacturing method of the composite copper foil is relatively simple, and the thickness can be relatively thin, but the quality is still good. The manufacturing method of the composite copper foil of the disclosure includes the following steps: providing a first copper foil and a second copper foil with separate structures; forming an insulating bonding material between the first copper foil and the second copper foil; forming the insulating bonding material into an insulating bonding layer, so that the first copper foil and the second copper foil are bonded through the insulating bonding layer. The composite copper foil of the disclosure includes a first copper foil, a second copper foil, and an insulating bonding layer. The insulating bonding layer is disposed between the first copper foil and the second copper foil. The thickness of the insulating bonding layer is less than 5 micrometers. Based on the above, the manufacturing method and/or the structure of the composite copper foil of the disclosure can be relatively simple, and the thickness can be relatively thin, but the quality is still good. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial flow chart of part of a manufacturing method of a composite copper foil according to an embodiment of the disclosure. FIG. 2A to FIG. 2E are partial side views of part of the manufacturing method of the composite copper foil according to an embodiment of the disclosure. DESCRIPTION OF THE EMBODIMENTS In the following detailed description, for purposes of illustration and not limitation, example embodiments are set forth disclosing specific details in order to provide a thorough understanding of the various principles of the disclosure. However, it will be apparent to one of ordinary skill in the art, having the benefit of this disclosure, that the disclosure may be practiced in other embodiments that depart from the specific details disclosed herein. Additionally, descriptions of well-known devices, methods, and materials may be omitted so as not to obscure the various principles of the disclosure. A range may be expressed herein as from “approximately” one specific value to “approximately” another specific value, and may also be expressed directly as one specific value and/or to another specific value. In expressing ranges, another embodiment includes from the one particular value and/or to another particular value. Similarly, when a value is expressed as an approximation by use of the antecedent “approximately”, it should be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each range are clearly related or independent of the other endpoints. In the document, non-limiting terms (such as: may, can, for example, or other similar terms) refer to not mandatory or optional implementation, inclusion, addition, or existence. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will also be understood that terms (such as defined in commonly used dictionaries) shall be construed to have a meaning consistent with the meaning in the